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Document Numbe r:321323-001 Intel® Xeon® Processor 5500 Series Thermal/Mechanical Design Guide March 2009.
2 Thermal/Mechanical Design Guide INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT .
Thermal/Mechanical Design Guide 3 Contents 1I n t r o d u c t i o n ......... ......... .......... ......... .......... ......... .......... ......... .......... ......... .......... ...... 9 1.1 References ........... ........ ........... ........ ..
4 Thermal/Mechanical Design Guide 6 Quality and Reliab ility Requirements .......... ........ ........... ........ ........... ........ ........... .... 43 6.1 Test Cond itions ....... .......... ......... .......... ........... ........ ........... .
Thermal/Mechanical Design Guide 5 B-7 1U Reference Heatsink Fin and Base (Sheet 1 of 2 ) ...... .......... ........... ........ ........... ........ 58 B-8 1U Reference Heatsink Fin and Base (Sheet 2 of 2 ) ...... .......... ........... ........ .....
6 Thermal/Mechanical Design Guide Tables 1-1 Referen ce Documents ........... ........ ........... .......... ......... .......... ......... .......... ......... ........10 1-2 Terms and Descrip tions ................... ........... .......... .......
Thermal/Mechanical Design Guide 7 Revision History § Document Number Revision Number Description Revision Date 321323 001 Public Release March 2009.
8 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 9 Introduction 1 Introduction This document provides guidelines for the design of thermal and mechanical solutions for 2-socket server and 2-sock et W orkstation processors in the Intel® Xeon® 5500 Platform.
Introduction 10 Thermal/Mechanical Design Guide 1.1 References Material and concepts av ailable in the following documents may be beneficial when reading this document. Notes: 1. Document numbers indicat ed in Location column are subje ct to change. See the ap propriate Elec tronic Design Kit (EDK) for the mo st up-to-date Docume nt number .
Thermal/Mechanical Design Guide 11 Introduction § T CONTROL T CONTROL is a static value b elow TCC activ ation used as a tri gger point for fan speed control. TDP Thermal Design Power: T hermal solution sh ould be designed to dissipate this target power level.
Introduction 12 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 13 LGA1366 Socket 2 LGA1366 Socket This chapter describes a surface mount, L G A (Land Grid Array) socket intended for processors in the Intel® X eon® 5500 Platfo rm. The socket provides I/O, power and ground contacts.
LGA1366 Socket 14 Thermal/Mechanical Design Guide Figure 2-2. LGA1366 Socket C ontact Numbering (Top View of Socket) 31 29 27 25 23 21 19 17 15 13 11 9 7 5 32 30 28 26 24 22 20 18 16 14 12 10 8 6 4 BA.
Thermal/Mechanical Design Guide 15 LGA1366 Socket 2.1 Board Layout The land pattern for the LGA1366 socket is 40 m ils X 40 mils (X by Y), and the pad size is 18 mils. Note that there is no round- off (conversion) error between socket pitch (1.016 mm) and board pitch (40 mil) as these values are equivalent.
LGA1366 Socket 16 Thermal/Mechanical Design Guide 2.2 Attachment to Motherboard The socket is attached to the motherboard by 1366 solder balls. There are no additional external methods (that is, screw , extra solder , adhesive, and so on) to attach the socket.
Thermal/Mechanical Design Guide 17 LGA1366 Socket The co-planarity (prof ile) and true position requirements are defined in Appendix C . 2.3.3 Contacts Base material for the contacts is high strength copper allo y . For the area o n socket contacts where processor lands will mate, there is a 0.
LGA1366 Socket 18 Thermal/Mechanical Design Guide 2.4 Package Installation / Removal As indicated in Figure 2-6 , access is provided to facilitate manual installation and removal of the package.
Thermal/Mechanical Design Guide 19 LGA1366 Socket 2.5 Durability The socket must withstand 30 cycles of processor insertion and remov al. The max chain contact resistance from Ta b l e 4 - 4 must be met when mated in the 1st and 30th cycles. The socket Pick and Place cover must withstand 15 cycles of insertion and remov al.
LGA1366 Socket 20 Thermal/Mechanical Design Guide 2.9 LGA1366 Socket NCTF Solder Joints Intel has defined selected solder joints of th e sock et as non-critical to function (NCTF) for post environmental testing.
Thermal/Mechanical Design Guide 21 Independent Loading Mechanism (ILM ) 3 Independent Loading Mechanism (ILM) The Independent Loading Mechanism (ILM) pr ovides the force needed to se at the 1366-LGA land package onto the socket contacts. The ILM is physically separ ate from the socket body .
Independ ent Loading Mechan ism (ILM) 22 Thermal/Mechanical Design Guide 3.1.2 ILM Back Plate Design Overview The unified back plate for 2-socket server and 2-socket W orkstation products consists of a flat steel back plate with threaded st uds for ILM attach, and internally threaded nuts for heatsink attach.
Thermal/Mechanical Design Guide 23 Independent Loading Mechanism (ILM ) 3.2 Assembly of ILM to a Motherboard The ILM design allows a bottoms up assemb ly of the components to the board. In step 1, (see Figure 3 -3 ), the back plate is placed in a fixture.
Independ ent Loading Mechan ism (ILM) 24 Thermal/Mechanical Design Guide . Figure 3-3. ILM Assembly Step 1: W i th so cket bo dy reflow ed on board, and back plate in f ixt ure, align board hol es to back plate studs. Step 2: With back plat e against bottom of board, ali gn ILM cover assem bly to back plate studs.
Thermal/Mechanical Design Guide 25 Independent Loading Mechanism (ILM ) As indicated in Figure 3-4 , socket protrusion and ILM key features prev ent 180-degree rotation of ILM cover assembly with respect to the socket. The result is a specific Pin 1 orientation with respect to the ILM lever .
Independ ent Loading Mechan ism (ILM) 26 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 27 LGA1366 Socket and ILM Electrica l, Mechanical, and Environmental Specifications 4 LGA1366 Socket and ILM Electrical, Mechanical, and Environmental Specifications This chapter describes the electrical, mechan ical, and environmental specifications for the LGA1366 socket and the Independent Loading Mechanism.
LGA1366 Socket and ILM Electrical , Mechan ical, and Environmental Specifications 28 Thermal/Mechanical Design Guide 4.4 Loading Specifications The socket will be tested against the conditions lis ted in the LGA1366 Socket V alidation Reports with heatsink and the ILM attached, under the loading cond itions outlined in this chapter .
Thermal/Mechanical Design Guide 29 LGA1366 Socket and ILM Electrica l, Mechanical, and Environmental Specifications 4.6 Environmental Requirements Design, including materials, shall be consiste nt with the manufacture of units that meet the following environmental reference points.
LGA1366 Socket and ILM Electrical , Mechan ical, and Environmental Specifications 30 Thermal/Mechanical Design Guide A detailed description of this methodology can be found at: ftp://download.intel.com/technology/itj/q32000/pdf/reliability .pd f . § Figure 4-1.
Thermal/Mechanical Design Guide 31 Thermal Solutions 5 Thermal Solutions This section describes a 1U reference heatsink, design targets for 2U and T ower heatsinks, performance expectations for a 25.5 mm tall heatsink, and thermal design guidelines for Intel® Xeon® Processor 5 500 Series and the follow-on processors.
Thermal Solutions 32 Thermal/Mechanical Design Guide For 1U reference heatsink, see Ap pendix B for detailed drawings. Ta b l e 5 - 1 specifie s Ψ CA and pressure drop targets at 9.7 CFM. Figure 5-1 shows Ψ CA and pressure drop for the 1U heatsink versus the airflow provided.
Thermal/Mechanical Design Guide 33 Thermal Solutions 5.1.1 25.5 mm Tall Heatsink For the 25.5 mm tall heatsink, Ta b l e 5 - 2 provides guidance regarding performance expectations. Th ese v alues are not used to gener ate processor thermal specifications.
Thermal Solutions 34 Thermal/Mechanical Design Guide 5.2 Heat Pipe Considerations Figure 5-2 shows the orientation and position of the T TV die. The TTV die is sized and positioned similarly to the processor die.
Thermal/Mechanical Design Guide 35 Thermal Solutions 5.3 Assembly The assembly process for the 1U reference heatsink begins with application of Honeywell PCM45F thermal interface material to improve conduction from the IHS. T ape and roll format is recommended.
Thermal Solutions 36 Thermal/Mechanical Design Guide 5.3.1 Thermal Interf ace Material (TIM) TIM should be verified to be within its recommended shelf life before use. Surfaces should be free of fore ign materials prior to application of TIM. Use isopropyl alcohol and a lint free cloth to remove old TIM before applying new TIM.
Thermal/Mechanical Design Guide 37 Thermal Solutions 5.5.2 Dual Thermal Profile Processors that offer dual thermal profile are specified in the appropriate Datasheet. Dual thermal profile helps mitigate limitations in volumetrically constr ained form factors and allows trade-offs between heatsink cost and T CC activation risk.
Thermal Solutions 38 Thermal/Mechanical Design Guide Compliance to Profile A ensures that no measurable performance loss will occur due to TCC activation. It is expected that T CC would only be activated for very brief periods of time when running a worst -case real wo rld application in a worst -case thermal condition.
Thermal/Mechanical Design Guide 39 Thermal Solutions 5.6.1 Fan Speed Control There are many wa ys to implement fan speed control. Using processor ambient temperature (in addition to Digital Thermal Sensor) to scale fan speed can improve acoustics when DTS > T CONTROL .
Thermal Solutions 40 Thermal/Mechanical Design Guide 5.6.2 PECI Averaging and Catastrophic Thermal Manag ement By aver aging D TS over PECI, thermal solution failure can be detected and a soft shutdown can be initiated to help prevent loss of data.
Thermal/Mechanical Design Guide 41 Thermal Solutions compliance by ensuring that the processor T c ase value, as measured on th e T TV , does not exceed T case_max_B at the anomalous po wer level for the en vironmental condition of interest. This anomalous power level is equal to 75% of the TDP limit.
Thermal Solutions 42 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 43 Quality and Reliability Requirements 6 Quality and Reliability Requirements 6.1 Test Conditions The T est Conditions provided in Ta b l e 6 - 1 address processor heatsink failure mechanisms only . T est Conditions, Qualificati on and Visual Criteria v ary by customer; Ta b l e 6 - 1 applies to Intel requirements.
Quality and Reliability Requirements 44 Thermal/Mechanical Design Guide 8) The rmal Performance Using 1U heatsink and 1U airflow from Ta b l e 5 - 1 : 1) TT V @ 95W (Profile B), Note 1. Using 2U heatsink and 2U airflow from Ta b l e 5 - 1 : 2) TT V @ 95W (Profile A), Note 1.
Thermal/Mechanical Design Guide 45 Quality and Reliability Requirements 6.2 Intel Reference Component Validation Intel tests reference components both indivi dually and as an assembly on mechanical test boards, and assesses performance to the env elopes specified in previous sections by varying bo undary conditions.
Quality and Reliability Requirements 46 Thermal/Mechanical Design Guide 2. Heatsink remains seated and its bottom remains mated flat against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.
Thermal/Mechanical Design Guide 47 Component Suppliers A Component Suppliers V arious suppliers have developed support components for processors in the Intel® X eon® 5500 Platform. These suppliers and components are listed as a convenience to customers.
Component Suppliers 48 Thermal/Mechanical Design Guide A.1.3 Alternative Thermal Solution The alternative thermal solutions are preliminary an d are not verified by Intel to meet the criteria outlined in Ta b l e 6 - 1 . Customers can purchase the alternative thermal solutions from the suppliers listed in Ta b l e A - 3 .
Thermal/Mechanical Design Guide 49 Component Suppliers A.1.4 Socket and ILM Components The LGA1366 Socket and ILM Components are described in Chapter 2 and Chapter 3 , respectively . Socket mechanical drawings are provided in Appendix C . Mechanical models are listed in Ta b l e 1 - 1 .
Component Suppliers 50 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 51 Mechanical Drawings B Mechanical Drawings Table B-1. Mechanical Drawing List Description Figure Board Keepin / K e epout Zones (Sheet 1 of 4) Figure B-1 Board Keepin.
Mechanical Drawings 52 Thermal/Mechanical Design Guide Figure B-1. Board Keepin / Keepout Zones (Sheet 1 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 49.90 [1.965] SOCKET BODY OUTLINE, FOR REFERENCE ONLY 44.
Thermal/Mechanical Design Guide 53 Mechanical Drawings Figure B-2. Board Keepin / Keepout Zones (Sheet 2 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 2X 0.00 0.000 [] 2X 0.00 0.
Mechanical Drawings 54 Thermal/Mechanical Design Guide Figure B-3. Board Keepin / Keepout Zones (Sheet 3 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 8X 6.00 0.236 [] 5.00 0.
Thermal/Mechanical Design Guide 55 Mechanical Drawings Figure B-4. Board Keepin / Keepout Zones (Sheet 4 of 4) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R REVISION HISTORY ZONE REV DESCRIPTION DATE APPROVED - A ORIGINAL RELEASE 09/29/06 - B M.
Mechanical Drawings 56 Thermal/Mechanical Design Guide Figure B-5. 1U Refere nce Heat sink Assembly (Sheet 1 of 2).
Thermal/Mechanical Design Guide 57 Mechanical Drawings Figure B-6. 1U Ref erence Heatsink Assembly (Sheet 2 of 2).
Mechanical Drawings 58 Thermal/Mechanical Design Guide Figure B-7. 1U Reference Heatsink Fin and Base (Sheet 1 of 2).
Thermal/Mechanical Design Guide 59 Mechanical Drawings Figure B-8. 1U Reference Heatsink Fin and Base ( Sheet 2 of 2).
Mechanical Drawings 60 Thermal/Mechanical Design Guide Figure B-9. Heatsink Shoulder Screw (1U, 2U and Towe r) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A A A D89880 1 03 DWG. NO SHT. REV SHEET 1 OF 1 DO NOT SCALE DRAWING SCALE: 1 03 D89880 D REV DRAWING NUMBER SIZE SCREW, SHOULDER, M3 X 0.
Thermal/Mechanical Design Guide 61 Mechanical Drawings Figure B-10. Heatsink Com pression Spring (1U , 2U and Tower).
Mechanical Drawings 62 Thermal/Mechanical Design Guide Figure B-11. Heatsink Re tain ing Ring (1U, 2U and Tower).
Thermal/Mechanical Design Guide 63 Mechanical Drawings Figure B-12. Heatsink Load Cup (1U, 2U and To wer).
Mechanical Drawings 64 Thermal/Mechanical Design Guide Figure B-13. 2U Collaborative He atsink Assembly (Sheet 1 of 2).
Thermal/Mechanical Design Guide 65 Mechanical Drawings Figure B-14. 2U Collaborative Hea tsink Assembly (Sheet 2 of 2).
Mechanical Drawings 66 Thermal/Mechanical Design Guide Figure B-15. 2U Collaborative Heat sink Volumetric (Sheet 1 of 2).
Thermal/Mechanical Design Guide 67 Mechanical Drawings Figure B-16. 2U Collaborative Hea tsink Volumetric (Sheet 2 of 2).
Mechanical Drawings 68 Thermal/Mechanical Design Guide Figure B-17. Tower Collaborative He atsink Assembly (Sheet 1 of 2).
Thermal/Mechanical Design Guide 69 Mechanical Drawings Figure B-18. Tower Collaborative He atsink Assembly (Sheet 2 of 2).
Mechanical Drawings 70 Thermal/Mechanical Design Guide Figure B-19. Tower Collaborative He atsink Volumetric (Sheet 1 of 2).
Thermal/Mechanical Design Guide 71 Mechanical Drawings Figure B-20. Tower Collaborative He atsink Volumetric (Sheet 2 of 2).
Mechanical Drawings 72 Thermal/Mechanical Design Guide Figure B-21. 1U Refere nce Heatsink Assembly with TIM (Sheet 1 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R E32409 1 01 DWG.
Thermal/Mechanical Design Guide 73 Mechanical Drawings Figure B-22. 1U Reference Heatsink Assembly with TI M (Sheet 2 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 35.0 # 1.0 1.
Mechanical Drawings 74 Thermal/Mechanical Design Guide Figure B-23. 2U Refere nce Heatsink Assembly with TIM (Sheet 1 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R E32410 1 01 DWG.
Thermal/Mechanical Design Guide 75 Mechanical Drawings Figure B-24. 2U Reference Heatsink Assembly with TI M (Sheet 2 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 35.0 # 1.0 1.
Mechanical Drawings 76 Thermal/Mechanical Design Guide Figure B-25. Tower Reference He atsink Assembly with TIM (Sheet 1 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R E32412 1 01 DWG.
Thermal/Mechanical Design Guide 77 Mechanical Drawings § Figure B-26. Tower Refer ence Heatsink Assembly with TI M (Sheet 2 of 2) 1 3 4 5 6 7 8 B C D A 1 2 3 4 5 6 7 8 B C D A 2200 MISSION COLLEGE BLVD. P.O. BOX 58119 SANTA CLARA, CA 95052-8119 R 35.
Mechanical Drawings 78 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 79 Socket Mechanical Drawings C Socket Mechanical Drawings Ta b l e C - 1 lists the mechanical drawings included in this appendix.
Socket Mechanical Drawings 80 Thermal/Mechanical Design Guide Figure C-1. Socket Mechanic al Drawing (Sheet 1 of 4).
Thermal/Mechanical Design Guide 81 Socket Mechanical Drawings Figure C-2. Socket Mechanic al Drawing (Sheet 2 of 4).
Socket Mechanical Drawings 82 Thermal/Mechanical Design Guide Figure C-3. Socket Mechanic al Drawing (Sheet 3 of 4).
Thermal/Mechanical Design Guide 83 Socket Mechanical Drawings § Figure C-4. Socket Mechanic al Drawing (Sheet 4 of 4).
Socket Mechanical Drawings 84 Thermal/Mechanical Design Guide.
Thermal/Mechanical Design Guide 85 Heatsink Load Metrology D Heatsink Load Metrology T o ensure complia nce to max socket loading value listed in T able 4-3, and to meet the performance targets for Thermal Interface Mate rial in Section 5.
Heatsink Load Metrology 86 Thermal/Mechanical Design Guide § Figure D-1. Intel® Xeon® Processor 5500 Series Load Cell Fixture.
Thermal/Mechanical Design Guide 87 Embedded Thermal Solutions E Embedded Thermal Solutions This section describes the L V processors and Embedded reference heatsinks for NEBS (Network Equipment Building Systems) comp liant A TCA (Advanced T elecommunications Computing Architecture) systems.
Embedded Thermal Solutions 88 Thermal/Mechanical Design Guide Detailed dra wings for the A TC A refe rence heatsink can be found in Section E.3 . Ta b l e E - 1 above specifies Ψ CA and pressure drop targets and Figure E-1 below shows Ψ CA and pressure drop for the A TCA heatsink ve rsus the airflow provided.
Thermal/Mechanical Design Guide 89 Embedded Thermal Solutions Notes: 1.) The thermal specifications shown in this graph ar e for reference only. See the Intel® Xeon® Processor 5500 Series Datasheet, Volume 1 for the Ther mal P rofile specifications.
Embedded Thermal Solutions 90 Thermal/Mechanical Design Guide Notes: Thermal sample only , retention not production ready . Notes: Heat s ink should be optimize d for the layout.
Thermal/Mechanical Design Guide 91 Embedded Thermal Solutions § Figure E-5. UP ATCA Heat S ink Drawing.
Embedded Thermal Solutions 92 Thermal/Mechanical Design Guide E.3 Mechanical Drawings and Supplier Information See Appendix B for retention and keep out drawings. The part number below represent Intel refe rence designs for a DP A TCA heatsink. Customer implem entation of these c omponen ts may be unique and require validation by the customer .
Thermal/Mechanical Design Guide 93 Embedded Thermal Solutions § Figure E-6. ATCA Reference Heat Sink Assembly (Sheet 1 of 2).
Embedded Thermal Solutions 94 Thermal/Mechanical Design Guide § Figure E-7. ATCA Reference Heat Sink Assembly (Sheet 2 of 2).
Thermal/Mechanical Design Guide 95 Embedded Thermal Solutions § Figure E-8. ATCA Reference He atsink Fin and Base (Sheet 1 of 2).
Embedded Thermal Solutions 96 Thermal/Mechanical Design Guide § § Figure E-9. AT CA Reference H eatsink Fin and Base (Sheet 2 of 2).
Thermal/Mechanical Design Guide 97 Processor Installation Tool F Processor Installation Tool The following optional tool is designed to provide mechanical assistance during processor installation and removal. Contact the supplier for av ailability: Billy Hsieh billy .
Processor Installation Tool 98 Thermal/Mechanical Design Guide § Figure F-1. Processor Installation Tool.
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