Instruction/ maintenance manual of the product Intel Xeon 5080 Fujitsu
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Document Number: 313079 -001 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet May 2006.
2 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet INFORMA TION IN THIS DOCUMENT IS PROVIDED IN CONNE CTION WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR O THERWISE, TO ANY INTELLECTUAL PROPER TY RIGHTS IS GRANTED BY THIS DOCUMENT .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 3 Contents 1 Introduction.......... ........... .......... ........... .......... ........... ........ ........... .......... ........... .......... 9 1.1 Terminology ........... .......... ....
4 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 6.2.6 T control and Fan Speed Reduction .................. ........... .......... ........... ..........79 6.2.7 T hermal Diode................. .......... ........... .......... ......... ...
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 5 8-1 Boxed Dual-Core Intel Xeon Processor 5000 Seri es 1U Passive/2U Activ e Combination Heat S ink (With Removable Fan) ............... .......... .... 89 8-2 Boxed Dual-Core Intel Xeon Processor 5000 Ser ies 2U Passive Heat Si nk .
6 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 7-1 Power-On Co nfiguration Option Lands................. ............ ........... ............ ........... .... 83 8-1 PWM Fan Frequency Specifications for 4-Pin Active CEK The rmal Solution .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 7 Revision History Revision Description Date 001 Initial release May 2006.
8 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Features Dual-Core processor A v ailable at 3.73 GHz processor speed Includes 16-KB Level 1 data cache per core (2 x 16-KB) I.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 9 Introduction 1 Introduction The Dual-Core Intel ® Xe o n ® Processor 5000 series are Intel dual core products for dual processor (DP) servers and workstations.
Introduction 10 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet and can thus help improve the over all security of the system. For further information on Execute Disable Bit functionality see http://www .intel.com/cd/ids/developer/asmo-na/ eng/149308.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 11 Introduction 1.1 Terminology A ‘#’ symbol after a signal name refers to an activ e low signal, indicating a signal is in the asserted state when driven to a low leve l. For example, when RESET# is low , a reset has been requested.
Introduction 12 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet • Thermal Desi gn Powe r – Processor thermal solutions should be designed to meet this target. It is the highest expected sustainable pow er while running known power intensive real applications.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 13 Introduction Notes: Contact your Intel represent ative for th e latest revision of th ose documents.
Introduction 14 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 15 Electrical Specifications 2 Electrical Specifications 2.1 Front Side Bus and GTLREF Most Dual-Core Intel Xe on Processor 5000 series FSB signals use Assisted Gunning T ransceiver Logic (AGTL+) signaling technolo gy .
Electrical Specifications 16 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 2.3 Decoupling Guidelines Due to its large number of tr ansistors and high internal clock speeds, the Dual-Core Intel X eon Processor 5000 series are capable of generating large av erage current swings between low and full power states.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 17 Electrical Specifications The processor core frequency is configured du ring reset by using valu es stored internally during manufacturing. The stored v alue sets the highest bus fraction at which the particular processor can operate.
Electrical Specifications 18 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 2.4.2 Phase Lock Lo op (PLL) and Filter V CCA and V CCIOPLL are power sources required by the PLL clock generators on the Dual- Core Intel X eon Processor 5000 series.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 19 Electrical Specifications 2.5 Voltage Identification (VID) The V oltage Identification (VID) specification for the Dual-Core Intel X eon Processor 5000 series set by the VID signals is the refe rence VR output voltage to be delivered to the processor Vcc pins.
Electrical Specifications 20 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. When this VI D pattern is obse rved, the voltage regulator outp ut should be disabled. 2. Shading denotes the expected VID range of the Du al-Core Intel X eon Processor 5000 series [1.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 21 Electrical Specifications Note: 1. The MS_ID[1:0] signals are provided to indicate th e Market Segment for the p rocessor and ma y be used for future processor compatibility or for keying. System management software may utilize these signals to identify the processor installed.
Electrical Specifications 22 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet With the implementation of a source synchr onous data bus comes the need to specify two sets of timing parameters.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 23 Electrical Specifications Ta b l e 2 - 7 outlines the signals which include on-die termination (R TT ). Open drain signals are also included. Ta b l e 2 - 8 provides signal reference voltages.
Electrical Specifications 24 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet connect to the rest of the chain unless one of the other components is capable of accepting an input of the appropriate voltage. Similar considerations must be made for TCK, TMS , and TRST#.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 25 Electrical Specifications Notes: 1. For functio nal operation, all processo r electrical, sign al quality , mechanical and thermal specifications must be satisfied. 2. Oversho ot and undershoo t voltage g uidelines for input, output, and I/O signals are outlined in Section 3 .
Electrical Specifications 26 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. Unless otherwise noted, all specifications in this table apply to all proc essors and are base d on final silicon validation/char acterization. 2. These voltages are targe ts only .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 27 Electrical Specifications 11. Minimu m VCC and maximum ICC are s pecif ied at the maximum processor ca se temperature (T CASE) shown in Ta b l e 6 - 1 . 12. This specification refers to the to tal reduction of the load line due to VID transitions below the specified VID.
Electrical Specifications 28 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. Processor or V oltage R egulator th ermal protection circ uitry should n ot trip for load currents greater than I CC_TDC . 2. Not 100% tested. Specified by design characterization.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 29 Electrical Specifications Notes: 1. The V CC_MIN and V CC_MA X loadlines represent stati c and transient limi ts. Please see Section 2.12.1 for V CC over shoot specifi cations. 2. This table is intended to ai d in reading discre te points on Figure 2-4 .
Electrical Specifications 30 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 3. Refer to Ta b l e 2 - 1 1 for processor VCC information. 4. The load lines specify voltage limits at the die measured at the VCC_DIE_SENSE and VS S_DIE_SENSE lands and at the VCC_DIE_SENS E2 and VSS_DIE_SENSE2 lands.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 31 Electrical Specifications Notes: 1. Unless otherwise noted, all specifications in this table apply to all processor frequencies. 2. All outputs are open dr ain. 3. V HYS represents the amou nt of hysteresis, nom inally centered about 0.
Electrical Specifications 32 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet maximum allowable overshoot above VID). Thes e specifications apply to the processor die voltage as measured across the VCC_DIE_SENSE and VSS_DIE_SENSE lands and across the VCC_DIE_SENSE2 and VSS_DIE_SENSE2 lands.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 33 Mechanical Specifications 3 Mechanical Specifications The Dual-Core Intel Xeon Processor 5000 series are packaged in a Flip Chip Land Grid Array (FC-L GA6) package that interfaces to the baseboard via a LGA771 socket.
Mechanical Specifications 34 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Note: Guidelines on potential IHS flatne ss v ariation with socket load p late actuation and installation of the cooling solution is available in the processor Thermal/Me ch anical Design Guidelines.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 35 Mechanical Specifications Figure 3-3. Processor Package Drawing (Sheet 2 of 3).
Mechanical Specifications 36 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Figure 3-4. Processor Packag e Drawing (Sheet 3 of 3).
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 37 Mechanical Specifications 3.2 Processor Component Keepout Zones The processor may contain components on the substrate that define component keepout zone requirements. A thermal and mech anical solution design must not intrude into the required keepout zones.
Mechanical Specifications 38 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 10. R is defined as the radial distance from the center of the LGA771 socket ball arr ay to the center of h eatsink load reaction point closest to the sock et. 11. Applies to populated sockets in fully populated and partially po pulated socket co nfigurations.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 39 Mechanical Specifications 3.8 Processor Markings Figure 3-5 and Figure 3-6 shows the topside markings on the processor . This diagram aids in the identification of the Dual-Core Intel Xeon Processor 5000 series.
Mechanical Specifications 40 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 3.9 Processor Land Coordinates Figure 3-7 and Figure 3-8 show the top and bottom view of the processor land coordinates, respectively . The coordinates ar e referred to throughout the document to identify processor lands.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 41 Mechanical Specifications § Figure 3-8. Processor Land Coordinates, Bottom View V TT / Clocks 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 .
Mechanical Specifications 42 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 43 Land Listing 4 Land Listing 4.1 Dual-Core Intel Xeon Processor 5000 Series Land Assignments This section provides sorted land list in Ta b l e 4 - 1 and Ta b l e 4 - 2 . Ta b l e 4 - 1 is a listing of all processor lands ordered alphabetically by land name.
Land Listing 44 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet D02# A4 Source Sync Input/Output D45# E22 Source S ync Input/Output D03# C6 Source Sync Input/Output D46# D22 Source Sync Input.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 45 Land Listing IGNNE# N2 ASync GTL+ Input RESERVED J3 INIT# P3 ASync GTL+ Input RESERVED N4 LINT0 K1 ASync GTL+ Input RESERVED N5 LINT1 L1 ASy.
Land Listing 46 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet VCC AC8 Pow er/Other VCC AG30 Powe r/Other VCC AD23 Power/Other VCC AG8 Power/Other VCC AD24 Power/Other VCC AG9 Power/Other VC.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 47 Land Listing VCC AL19 Power/Other VCC J21 Power/ Other VCC AL21 Power/Other VCC J22 Power/ Other VCC AL22 Power/Other VCC J23 Power/ Other V.
Land Listing 48 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet VCC T29 Power/Other VSS A15 Power/Other VCC T30 Power/Other VSS A18 Power/Other VCC T8 Power/Other VSS A2 Pow er/Other VCC U23 .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 49 Land Listing VSS AF10 Power/Ot her VSS AJ29 Power/Other VSS AF13 Power/Ot her VSS AJ30 Power/Other VSS AF16 Power/Ot her VSS AJ4 P ower/Othe.
Land Listing 50 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet VSS B1 Power/Other VSS F7 Power/Othe r VSS B11 Power/Other VSS G1 Power/Othe r VSS B14 Power/Other VSS H10 Power/Other VSS B17 .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 51 Land Listing VSS P25 Power/Other VT T A25 Power/Other VSS P26 Power/Other VT T A26 Power/Other VSS P27 Power/Other VT T B25 Power/Othe r VT .
Land Listing 52 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 4.1.2 Land Listing by La nd Number Table 4-2. Land Listing by Land Number (Sheet 1 of 9) Land No.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 53 Land Listing AD7 VSS Power/Other AF2 BPM4# Commo n Clk Inp ut/Outpu t AD8 VCC Power/Other AF20 VSS Power/Other AE1 TCK T A P Input AF21 VCC .
Land Listing 54 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet AG9 VCC Power/Other A J20 VSS Power/Other AH1 VSS Power/Other A J21 VC C Power/Oth er AH10 VSS Power/Other A J22 VC C Power/Oth.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 55 Land Listing AL1 THERMDA Power/Other Output AM21 VCC P ower/Other AL10 VSS Power/Ot her AM22 VCC P ower/Other AL11 VCC Power/Othe r AM23 VSS.
Land Listing 56 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet B14 VSS Power/Oth er C26 VTT Power/Oth er B15 D53# Source S ync Input/Output C27 VTT Power/Other B16 D55# Source S ync Input/Ou.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 57 Land Listing E15 D33# Source Sync Input/Output F27 RESERVED E16 D34# Source Sync Input/Output F28 BCLK0 Clk Input E17 VSS Power/Other F29 RE.
Land Listing 58 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet H16 DP2# Common Clk Input/Output J28 VCC Power/Othe r H17 VSS Power/Other J29 VC C Power/Other H18 VSS Power/Other J3 RESE RVED.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 59 Land Listing M27 VCC Power/Other R2 VSS Power/Other M28 VCC Power/Ot her R23 VSS Power/Other M29 VCC Power/Ot her R24 VSS Power/Other M3 STP.
Land Listing 60 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet V2 LL_ID0 Power/Other Output Y4 A20# Source Sync Input/Output V23 VSS Power/Other Y5 VSS Power/Other Y6 A19# Source Sync Input/Output Y7 VSS Power/Other Y8 VCC Power/O ther § Table 4-2.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 61 Signal Definitions 5 Signal Definitions 5.1 Signal Definitions Table 5-1. Signal Definitions (She et 1 of 8) Name Type Description Notes A[35:3]# I/O A[35:3]# (Address) define a 2 36 -byte physical memory address space.
Signal Definitions 62 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet BINIT# I/O BINIT# (Bus Initialization) may be obse rved and driven by all processor FSB a gents and if used, must connect the appropriate pins o f all such agents.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 63 Signal Definitions D[63:0]# I/O D[63:0]# (Data) are the data signals. These signals pro vide a 64-bit data path between the processor FSB agents, and mu st con nect the appropriate pins on all such agents.
Signal Definitions 64 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet DSTBN[3:0]# I/O Data strobe used to latch in D[63:0]#. 3 DSTBP[3:0]# I/O Data strobe used to latch in D [63:0]#. 3 FERR#/PBE# O FERR#/PBE# (floating-point error/pend ing break event) is a multiplexed signal and its meaning is qualified by STPCLK#.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 65 Signal Definitions IGNNE# I IGNNE# (Ignore Numeric E rr or) is as serted to force th e process or to ign ore a numeric error and conti nue to execute no nc ontrol floating-poi nt instructions.
Signal Definitions 66 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet PWRGOOD I PWRG OOD (Po wer Good) is an input. The processor requir es this signal to be a clean indication that all proces sor clocks and power suppl ies are stable and within their specifications.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 67 Signal Definitions TESTHI[11:0] I TESTHI[11:0] must be connected to a V TT power source thr ough a resistor for proper processor oper ation. R efer to Section 2.6 for TESTHI grouping restrictions.
Signal Definitions 68 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. For this pin on Dual-Cor e Intel Xeon Proc essor 5000 series, the maximum number of symmetric agents is one.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 69 Thermal Specifications 6 Thermal Specifications 6.1 Package Thermal Specifications The Dual-Core Intel Xeon Processor 5000 series require a thermal solution to maintain temperatures within its oper ating limits.
Thermal Specifications 70 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Figure 6-2 ; Ta b l e 6 - 3 and Ta b l e 6 - 6 ) is indicativ e of a constrained thermal environment (that is, 1U form factor).
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 71 Thermal Specifications Notes: 1. Thermal Profile A is representative of a volume trically u nconstraine d platform. Please refer to Ta b l e 6 - 2 for discrete points that constitute the thermal profile.
Thermal Specifications 72 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. These values are spec ified at V CC_MA X for all processor frequencies. Syst ems must be designed to en sure the processor is not to be subjected to any static V CC and I CC combination wherein V CC exceeds V CC_MAX at specified I CC .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 73 Thermal Specifications Notes: 1. Thermal Profile A is representative of a volume trically u nconstraine d platform. Please refer to Ta b l e 6 - 5 for discrete points that constitute the thermal profile.
Thermal Specifications 74 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. These values are spec ified at V CC_MA X for all processor frequencies. Syst ems must be designed to en sure the processor is not to be subjected to any static V CC and I CC combination wherein V CC exceeds V CC_MAX at specified I CC .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 75 Thermal Specifications Notes: 1. Thermal Profile is representative of a volume trically constrained platfor m. Please refer to Ta b l e 6 - 8 for discrete points that constitute the thermal profile.
Thermal Specifications 76 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet T CASE temperature measurements should be made. F or detailed guidelines on temperature measurement methodology , refer to the Dual-Core Intel ® Xeon ® Processor 5000 Series Thermal/Me chanical Design Guidelines .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 77 Thermal Specifications 6.2 Processor Thermal Features 6.2.1 Thermal Monitor The Thermal Monitor (TM1) feature helps control the processor te mperature by activating the Thermal Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature.
Thermal Specifications 78 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet the system tries to enable On-De mand mode at the same time the T CC is engaged, the factory configured duty cycle of the TC C will override the duty cy cle selected by the On- Demand mode.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 79 Thermal Specifications 6.2.6 Tcontrol and Fan Speed Reduction T control is a temperature specification based on a temperatu re reading from the thermal diode. The value for T control will be calibrated in manufacturing and configured for each processor .
Thermal Specifications 80 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet between n trim and the actual ideality of the particular processor will be calculated.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 81 Thermal Specifications . Notes: 1. Intel does not suppo rt or recommend oper ation of the thermal diode und er reverse bias. 2. Same as I FW in the diode model in Ta b l e 6 - 9 . 3. Characterized acro ss a temperature r ange of 50-80°C.
Thermal Specifications 82 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 83 Features 7 Features 7.1 Power-On Configuration Options Several configur ation options can be configur ed by hardware. The Dual-Core Intel Xeon Processor 5000 series samples its hardware configuration at r eset, on the active-to- inactive tr ansition of RESET#.
Features 84 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet needs to account for a variable number of processors asserting the Stop Grant SBC on the bus before allowing the proce ssor to be tr ansitioned into one of the lower processor power states.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 85 Features The Enhanced HAL T state must be enabled by way of the BIOS for the processor to remain within its specifications. The Enhanc ed HAL T state requires s upport for dynamic VID transitions in the platform.
Features 86 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet RESET# will cause the processor to immediately initialize itself , but the processor will stay in Stop-Gr ant state. A transition back to the Normal state will occur with the de- assertion of the STPCLK# signal.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 87 Features Note: Not all Dual-Core Intel Xeon Processor 5000 series are ca pable of supporting Enhanced Intel SpeedStep T echnology .
Features 88 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 89 Boxed Processor Specifications 8 Boxed Processor Specifications 8.1 Introduction Intel box ed processors are intended for system integr ators who build systems from components av ailable through distribution channels.
Boxed Processor Specifications 90 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Notes: 1. The heat sinks repres ented in these image s are for reference only , and may not represent the final box ed processor heat sink s. 2. The screws, spr ings, and standoffs will be captiv e to the heat sink.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 91 Boxed Processor Specifications 8.2.1 Boxed Processor Heat Sink Dimensions (CEK) The boxed processor will be shipped with an unattached thermal solution. Clear ance is required around the thermal solution to en sure unimpeded airflow for proper cooling.
Boxed Processor Specifications 92 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Figure 8-4. Top Side Board Keep-Out Zones (Par t 1).
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 93 Boxed Processor Specifications Figure 8-5. Top Si de Board Keep-O ut Zones (P art 2).
Boxed Processor Specifications 94 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Figure 8-6. Bottom Side Board Keep-Out Zones.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 95 Boxed Processor Specifications Figure 8-7. Board Mounting Hole Keep-Out Zones.
Boxed Processor Specifications 96 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Figure 8-8. Volumetric Height Keep-Ins.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 97 Boxed Processor Specifications Figure 8-9. 4-Pin Fan Cable Con nec tor (For Active CEK Heat Sink).
Boxed Processor Specifications 98 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet Figure 8-10. 4-Pi n Base Board Fan Header (F or Active CEK Heat Sink).
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 99 Boxed Processor Specifications 8.2.2 Boxed Processo r Heat Sink Weight 8.2.2.1 Thermal Solution Weight The 1U passive/2U active combin ation heat sink solution and the 2U passive heat sink solution will not exceed a mass of 1050 grams.
Boxed Processor Specifications 100 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet The fan power header on the baseboard must be positioned to allow the fan heat sink power cable to reach it. The fan power head er identification and location must be documented in the suppliers platform documentation, or on the baseboard itself .
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 101 Boxed Processor Specifications 8.3.2.1 1U Passive/2U Active Combinat ion Heat Sink Solution (1U Rack Passive) In the 1U configuration it is assumed that a chassis duct will be implemented to pro vide sufficient airflow to pass through the heat sink fins.
Boxed Processor Specifications 102 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet The other items listed in Figure 8-3 that are required to compete this solution will be shipped with either the chassis or boards.
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 103 Debug Tools Specifications 9 Debug Tools Specifications Please refer to the eXtended Debug Port: De bug Port Design Guide for UP and DP Platforms and the appropriate platform design guidelines for information regarding debug tool specifications.
Debug Tools Specifications 104 Dual-Core Intel® Xeon® Processor 5000 Series Datasheet 9.3.1 Mechanical Considerations The LAI is installed between the processor so cket and the pro cessor . The LAI plugs into the socket, while the processor plugs into a socket on th e LAI.
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