Instruction/ maintenance manual of the product RP7405/7410 HP
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User Gu ide hp r p74 05/7410 Ser vers T hird E di tio n Manufacturing P art Number: A6752-96008 21102 USA © C opy right 2002.
ii Legal Noti ces The inf orm at ion in thi s docu me nt is s ub ject to cha nge wit ho ut n ot ice. Hewlet t-P ac kard makes n o warr an ty of any kind wit h rega r d to th is manual, in cluding , b u t n ot l imited to , th e impl ie d warra nties of mer chantabi lity and fitn ess for a partic ular purpose .
Con tents iii 1. Introd u ction hp rp7405/rp 7410 Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Cell Boa rd . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Con tent s iv Replaci ng the T op Cov er . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Re m ovin g and Replaci ng a D isk Dri v e . . . . . . . . . . . . . . . . . . . . . .
Con tents v Aco u st i c No ise S pecific ation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 98 Air Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Con tent s vi.
Ta b l e s vii T a b le 1 . Revisions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii T a b le 1 -1. hp rp7405 Servers . . . . . . . . . . . . . . . . . . . . . . .
Ta b l e s viii.
Fig u r e s ix Fi g ure 1 . Declaration of Conformity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xi Fi g ure 2 . Ja p anese RF I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Fig u r e s x Fi g ure 4 -2. T op Cover R etaini ng Screws . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 62 Fi g ure 4 -3. D isk Driv e L o c ation . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pref ace.
viii Revisi on History T able 1 Revisions Re visi on P art N umbe r Re le ase Dat e Des crip tio n Third A675 2-96008 Novem ber 20 02 Corrected power cord and powe r reqirements se ction.
ix Nota tional Conve ntions W ARNING W arn ings high li ght p roc edur es or in form ati on ne cess ar y to a void in jury t o pe rso nne l. Th e wa rnin g sh ould te ll t he r ead er ex actl y wh at w ill res ult fro m what acti ons and ho w t o a void the m.
x Safe ty and R egulator y Regula tory Model: RSVLA-0102 F or y our protecti on, thi s product has b een teste d to var i o u s na t io nal and i nternation al regul ations a nd sta n dar ds.
xi Fi gure 1 Declar ation of Conformity.
xii USA R adio Fr equency Int erference FCC N otice The F ederal Communicatio n s Commission (in 47 CFR P art 15 s ubpart B) has specified that the following notic e be brou gh t to th e atten tio n o f th e u sers of t his prod uct.
xiii Kore an RF I Sta te ment Certi fication Nu mber: E - AA AAA - BB - CCCC • E: EMC r egistrati on • AAAAA: equipmen t codes (RRL notice, 2000.10.
xiv BSM I (T aiwan A rea) This produ ct is fully compliant to CN S 13438 (CISPR 22: 1993) Class A. Th e EMC label is in the fo rm shown in Figure 4. Fi gure 4 T aiwan Area EMC NO TE Electric al practices an d sugges tions in th is gu ide are based on No rth American practices.
xv Install a tion Con ditions See inst allation instruc t ions before conne cting this equipment to the input supply . V oir la noti ce d ’i nsta l lati on avan t d e ra ccor d er au rése au . W ARNING NO RD IC Class 1 Eq uipment Denma rk: Før til slutni ng af de øvri ge leder e, se medf ø l g ende inst allations vejlednin g .
xvi Li thium Bat tery C autio n W ARNING O bserve t h e corr ect polari ty when c h angin g the lithiu m battery . There is a dange r of exp l osio n i f ba tt ery is in sta lle d in c orre ct ly . Repla c e on ly with the same or equi v alen t type recommend ed by the manufactu r er .
xvi i Laser Safety NO TE If a Fibre Ch annel I /O card i s presen t , t he follow ing laser safety statement appl ies . This prod u ct contains a laser inter nal to the Op tica l L in k Modu le (OLM) for conn ecti on to the Fibre com mu ni c atio ns p ort .
xviii.
Chapter 1 1 1 Introduction The hp rp7410 is a memb er of Hewle tt-P ac kard’ s bu sin ess-critical com puting platfo rm family : a mid-range, mid- volume serv er , positi oned as an upgr ade to the cu rrent N -Class p roduc t in th e PL-1X p ro duct line.
Chapter 1 Introducti on hp rp7405/rp7410 Overvie w 2 hp rp 74 05/r p741 0 Over vi ew The hp rp74 05/rp7410 is a 10U , 8-way SM P , rack-mount se rver th at accomm odate s up to 32 G B of memo ry (64 GB available at a late r date); PCI-4X I/O; and intern al periph erals in cludin g disks and DVD/tape .
Chapter 1 Introduction hp rp7405/rp7410 Overvie w 3 Figure 1 -2 hp r p7405/r p7 410 Ser ver (w ithou t fro nt b ezel) Improvem ent s o ver its pred ecess or , N4000, include: • Be tter availa bility.
Chapter 1 Introducti on hp rp7405/rp7410 Overvie w 4 Sys tem B ack pl ane The syst em backp lan e compr ises th e syste m clock g ene rati on logic, the sys tem reset ge ner ation logic, DC- to -DC con ve rt ers, p ow er m on it or lo gic, an d t w o L o ca l Bu s a da pto r (LBA ) l i nk- to -PCI con ve rte r A S IC s.
Chapter 1 Introduction hp rp7405 Servers 5 hp rp 74 05 Se rver s Hewle tt-P ackar d offers a c o st-effective server based on the hp rp7410 by employ ing a r ed uced numbe r of proc essors , memory , core I/O, or po wer suppl ies as i ndicated i n T able 1-1.
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 6 Det ail ed h p rp74 05/ rp74 10 De scri ptio n Fi gure 1-3 hp rp7 4 10 8-W ay B lock Diagram.
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 7 Cell Board The cel l bo ard c ontai ns the proces sors , mai n memo ry , and t he c ell cont rol ler (CC) A SIC t hat inte rfa ces th e proc es sors an d memory t o the off-board I/ O. Sh ow n in Fig ure 1 -4 is the CC .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 8 The h p r p7405/rp74 10 h as a 48V d istribut ed po wer system a nd receives t he 4 8V p ower from the syste m bac kplane board. The cell boar d cont a ins DC-to- D C converter s to gen erate the required volt age rails .
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 9 PDH Ri ser Bo ar d The PD H ris e r bo ard is a dau gh t er car d for the cel l boa rd .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 10 In th e singl e nP artit ion case , if two ce lls are present, e ither c e l l may be the root cell, assuming t he both cells have M P C ore I/O fun ction ality p res ent. If only one ce ll is p res ent, th at c ell is t he roo t cell ( an d sh ould be c ell 1).
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 11 Sys tem B ack pl ane The syst em backp lan e compr ises th e syste m clock g ene rati on logic, the sys tem reset ge ner ation logic, DC- to -DC c onv ert er s, pow er mon ito r lo gic, and two LBA lin k- to -P CI conv er te r ASI Cs .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 12 . Fi gure 1-9 I/O Subsys tem Architecture The s erver s upports two inte rnal SBAs . The SBAs gener ate 32 ro pe bus ses (16 p er SBA).
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 13 This concep t allows m axim um connect ivity for mainstr eam 5V -only , 33 MHz, 32 bit (PCI-1x) and 64-bit (PCI-2x ) ca rds, as we ll as f ull I/O ban dwidth ut ilizati on thro ugh t he u se o f 64-bit , 66 M Hz (P CI-4 x) univ ersal car ds.
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 14 Mas s S torag e ( Disk) Bac kpl ane Internal m a ss storage co nnections (to dis ks) are ro uted on th e mass st orage backpla ne, having c onnec tors a nd termin ation logi c . A ll dis ks ar e h ot plu ggable.
Chapter 1 Introduction Detailed h p rp7405/rp741 0 D escription 15 Figure 1 -10 Right-Front View of hp rp7 405/rp7 410 The PCI I/O car d sec tion, l ocat ed tow ards the rea r , i s ac cess ed by remo vin g the to p co ver . The PCI OLR fan mo dules ar e located i n front of the P CI cards .
Chapter 1 Introducti on Detai led hp rp7405/rp7410 Description 16 Cell boards ar e access ed from th e right s ide of t he chass is behind a removab le side cover .
Chapter 2 17 2 Install ation.
Chapter 2 Ins t a lla ti o n Unpac king the Server 18 Unpac king the Se rver Hewlett -P ackard shippi n g cont a iner s are design ed to protect their cont en ts under norma l shippin g cond i tion s. Af ter th e equipmen t a r ri v es , carefu lly ins pect eac h carton f or sig n s of shippi ng damage.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 19 CA UTION T he plastic wrappin g ma teri al shoul d be cut off rather than pulled off . Pulling the pla st ic cove ring off re pres ent s an ESD haz ard.
Chapter 2 Ins t a lla ti o n Unpac king the Server 20 Step 5. Remove four bo lts h old ing do wn t he r amps and remo ve the ra mp s . See F igure 2-2.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 21 Step 6. Remove the six bolts from the base attac h ing the rack to the pall et. See Figu r e 2-3.
Chapter 2 Ins t a lla ti o n Unpac king the Server 22 Se curi ng th e Ca bi net Once in p osition , se cure an d sta b ilize th e ca binet usin g the leveli ng feet at th e cor ners of th e base a nd in stall the a nti-tip mechanisms on the bot tom fron t and r ear of th e rack.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 23 Fi gure 2-5 RONI Lifter Step 1. F ollow the in s tr u ctio ns on the out s ide o f the serve r packaging to remove the bandi ng and carto n top f r om the server pal l et. Fi gure 2-6 Server with Shipping Box Removed Step 2.
Chapter 2 Ins t a lla ti o n Unpac king the Server 24 Step 3. Observe Figure 2-7. Remove the two foam c ushion for lift access. Fi gure 2-7 Remove Cushions for Lift Access Step 4. In sert the lif ter f orks un der the se rver . Step 5. Careful ly roll the lift forward until it is fully p osition ed aga inst the sid e of the server .
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 25 Step 6. Slowly raise the se rve r off the palle t un til it clears th e pallet c ush ions. Fi gure 2-8 Raising a Server Off the P alle t Step 7. Roll the l i f t er an d serve r awa y from the pa l le t .
Chapter 2 Ins t a lla ti o n Unpac king the Server 26 U nload ing w ith Lif t Ha ndle P an els W ARNING Use thi s pr oc edu re o nly if no He wl ett -P a ckar d a ppr ov ed l i ft is av ail abl e. Thi s proced ure should on ly be attempt ed by two (2) a uthorized Hewl ett-P ackar d service pe ople.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 27 Step 4. Wi th one h andle in each hand , ins t all t he pin en d of t he panel i nto the backside of the front ra ck moun t ears on the chas s is . F igure 2-1 1 Insertin g the Pins In to the Rack Step 5.
Chapter 2 Ins t a lla ti o n Unpac king the Server 28 Step 6. Contin ue to pull the handle s apart unt il the sp rin g plun ger sn ap s into fina l positio n. T he sprin g plunger will drop down into t h e re cess posi tion. Step 7. Chec k that the handl es are s ecure by pressing the handl es toget her and mov ing back and forth .
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 29 In stall ing th e Cable Ma nage ment A rm (CMA ) Once the serv er is i nstalled i n the rac k, the CMA mu st be inst alled on t he rear of the s erver .
Chapter 2 Ins t a lla ti o n Unpac king the Server 30 Step 2. Attach the othe r end of the CM A to the server using the thum b scre ws that cam e with the CM A. F igu re 2-1 6 Att achi ng CM A to the S er ver Insta lli ng Add- O n Produc ts This sectio n explains load or ders and dependencies for add-on product s.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 31 Embe dded Disks The hp rp74 05/rp7410 s erver can opera te in the diskles s (LAN boot) m ode. If disks are t o be install ed, the to p two disk s are driv en by the prim ary MP Core I/O set. Install th e first embed ded disk in the top left locatio n.
Chapter 2 Ins t a lla ti o n Unpac king the Server 32 Proce sso rs Each cell board can h ol d up to f our proc essors . Proc essor slot s are n u mber ed 0-3. In stall p rocesso r s in ascen ding orde r: slot 0, 1, 2 , and 3. It i s not ne cessary t o balan ce the nu mber of proc essors a cross b oth cell boards.
Chapter 2 Ins t a lla ti o n Unpacki ng the Server 33 Differe nt d en sities of mai n DIMM s c an be mixe d w ith in a s yst em, but ea ch set o f four D IMMs m ust be ident ical. A se t of D IMM s is def ined as t he group o f four DIMMs that must be loaded t ogether on a cell board.
Chapter 2 Ins t a lla ti o n Connect ing A C Input P o wer 34 Connect ing AC I nput P ower The hp rp7405/ rp7410 has five line cord configu rations: • All fou r line cord s • Cords A0 and A1 o nly • Cords B0 and B1 o nly • Cords A0 and B0 o nly • Cords A1 and B1 o nly A s ing le-line -cor d con figu ration is n o t a llowed .
Chapter 2 Ins t a lla ti o n Connecti ng A C Input Po wer 35 If two separ ate powe r source s are availab le, the two powe r supp lies can be plugge d into the separate powe r sour ces, increasin g sys tem r eliabili ty sho uld one powe r sourc e fail.
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 36 MP Core I/O Con nectio ns Each hp rp740 5/rp7410 c an have up to two MP Co re I/O boar d sets ins talled. This allow s for tw o partition s to be opera ting, or allows for MP Core I/O redun dancy in a sin gle pa rtition config uratio n.
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 37 Setti ng Up t he CE T o ol (P C) The CE T ool is usuall y a l apt o p. It allows c ommunication with th e Management Processor (MP) in th e hp rp740 5/rp7410. The MP mo nitors the activity of e ithe r a one p artiti on or a mul tiple p artiti on c onfigura tion.
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 38 If t he CE T ool is a laptop usi ng Reflect ion 1, check or chang e these co mmunications settings using t h e follow ing procedure: 1. From the Reflect i on 1 Ma in screen , pull down the Co nne ctio n menu an d selec t Co nne ctio n Se tup .
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 39 On the front of the hp rp74 05/rp7410, a solid green Sta n db y Pow er , a solid gree n MP Present , and a flashing amber Att enti on light will illu m inate after abo ut 30 seco nds. Fi gure 2-22 Fron t P anel Display 2.
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 40 The M P Main Menu appears: F igure 2 -2 3 MP Main Me nu Config uri ng LAN Info rma tion for the MP T o set the M P LAN I P address : 1 . At t he MP Mai n Men u p rom p t ( MP > ), en t er cm. F r om th e MP Command Menu promp t ( MP: C M> ), ente r lc (for L AN c onfi gur at ion) .
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 41 Enter lc and pr ess t h e Return key . The followin g screen appears: Figure 2 -24 Th e lc C om ma nd S creen NO TE The value in the “IP a ddress ” fi eld has been set at the fa ctory . The c ustomer mu s t provide the actual LAN IP address .
Chapter 2 Ins t a lla ti o n MP Core I/O Connections 42 1 0. A sc reen sim ila r to t he follo wing w ill a ppear a llowin g verific ation of the se ttings: Figure 2 -25 T he ls Com man d S cre en T o retu rn to the MP ma in menu, ente r ma . T o exit th e MP , enter x at the MP ma in menu.
Chapter 2 Ins t a lla ti o n MP Cor e I/O Con nections 43 The du co mma nd displays the M P Bus topo logy . A s cre en similar to the follo wing ap pears: Figure 2-26 The du Com ma n d S cree n 3. T here will be an aster isk (*) in the colu mn m arke d MP .
Chapter 2 Ins t a lla ti o n P ower ing On the hp rp7405/rp7410 Ser ver 44 P ow eri ng On the h p rp 74 05/rp 7410 Serv er Afte r powerin g on the M an ageme nt Proc esso r (MP) (+3.3 V HK P), and checki ng that the MP detec ts th e pres en ce of the c ell boar ds, power up t he ser v er .
Chapter 2 Ins t a lla ti o n Selecti ng a Boot Partit ion using the Management Processor 45 Sele cting a Boot P artitio n usi ng the Man agement P ro cessor At this point in the install ation process .
Chapter 2 Ins t a lla ti o n V erif ying t he System Configuratio n using Boot C onsole Handler (BCH) 46 V erify ing the Syste m Configurat ion using Boot Console Ha ndler (B CH ) From th e BCH main m enu , type in to go t he Inf orm at ion M enu.
Chapter 2 Ins t a lla ti o n Bootin g HP-UX using Boo t Console Handl er ( BCH ) 47 Boo ting HP- UX usin g Boo t Consol e Handl er (BCH) If Instan t Ignit ion was order ed, HP-U X will h ave been ins talled in the fact ory at the P rimar y P ath addre ss.
Chapter 2 Ins t a lla ti o n Booti ng HP-UX using B oot C onsol e Hand ler ( B CH) 48.
Chapter 3 49 3 T roubleshooti ng.
Chapter 3 T roub leshooting Common Instal lation Pr oblems 50 Common Insta llation Probl ems The follo w ing sec tions contain general proce dur es to help yo u locat e installa tio n proble ms. CA UTION Repl ace the top cov er befor e operating the ser v er , even for a shor t time .
Chapter 3 T r oub l eshooting Common Install ation Pro ble ms 51 9. Boot the server and if it does not function proper ly , refer to the followi ng proce du res . The Se rv er Do es No t P ow er On Use these st eps to check for power related problems: 1.
Chapter 3 T roub leshooting Common Instal lation Pr oblems 52 Bulk P o wer Su pply LE Ds Ther e is a single three-col or LED on ea ch bulk power supply . PCI P ower Supp ly LEDs Ther e are three LEDs on the PCI power supply . G reen and yello w LEDs follow OL* operati on .
Chapter 3 T r oub l eshooting Common Install ation Pro ble ms 53 Syste m, Stand by , and I/O F an LEDs Ther e is a single three-col or LED on ea ch Syst em, St a ndby , and I /O F an. SINC POST L EDs The four SINC PO ST LEDs (Green) d isplay the cur rent sta te of t h e SINC firmw are.
Chapter 3 T roub leshooting Common Instal lation Pr oblems 54 OL * LE D s PC I/C el l LE D OL* MP Co re I/O LEDs The MP Core I/O LED s are locat ed on the MP Cor e I/O Pa nel. T able 3-6 OL* LEDs Loca t ion LE D Driv en B y St ate De sc rip tion Chas sis Beside Cell and On Cell Cell Boa rd P o wer C ell LP M On Gr een 3.
Chapter 3 T r oub l eshooting Common Install ation Pro ble ms 55 LA N/SCSI ( PCI Sl ot) LEDs The LAN/SCSI LEDs a r e located on t h e PCI P anel . Management Processor Active SP On Gr een Ser v ic e Proces s or o n this MP Core I/ O Board is man aging box .
Chapter 3 T roub leshooting Common Instal lation Pr oblems 56.
Chapter 4 57 4 Remov al and Rep l acement.
Chapter 4 Removal and R eplacement Sh ut tin g Down nP ar titions and Po wering O ff Har dwar e Component s 58 Shut ting Down nP art itions an d P o wering Off Ha rdware Compone nts When y ou r emove and replace hardware you ma y nee d to shut dow n one or more nP artiti ons on t h e s erv er .
Chapter 4 Remov al and R eplacement Shutt ing D o wn nP art it i ons and P oweri ng Of f Har dware Componen ts 59 F or exampl e, th e shu tdo wn -h 240 comm a nd will sh ut dow n and ha lt HP-U X on the nPartiti on after w a iting for a g r ace period of four minu tes (240 secon ds).
Chapter 4 Removal and R eplacement Sh ut tin g Down nP ar titions and Po wering O ff Har dwar e Component s 60 Step 9. Use the MP Command menu’ s PE com mand t o po wer on th e hard wa re co mpone nt th at you p owere d off. Step 10. Use the MP Command menu’ s PS command to confirm the stat us of the newly replac ed compon ent.
Chapter 4 Remov al and R eplacement Remo ving and R eplaci ng the T op Cover 61 Remov ing and Repla cing the T op Cover It i s necessary to remov e and repl ace one or more of the c overs to access t he components w ith i n th e serve r chassis. CA UTION Observe all ESD safe ty p recau tions be fore atte mptin g this proced ure.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng the T op C over 62 Rem ovi ng th e T op C ove r Fi gure 4-2 T op Cover Re taining Scr e ws Step 1. Loos en the retain ing screws securin g the cover to the rear of the chassis . Step 2. Sli de the cover tow ard th e rear of the ch assis .
Chapter 4 Remov al and R eplacement Removing and Replaci ng a Disk Drive 63 Remov ing and Repla cing a Disk D rive The disk dr ives are loca t ed i n the fr ont of the c hassis . T h e nPar tition mu st be shutdown t o re mov e or repla ce the driv e th at serves as t he boot disk .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Disk D rive 64 Rem o vi ng a Di sk Dr i ve Figure 4-4 Disk Drive Det ail Step 1. Disen gage th e front lockin g latch on the disk drive by pushin g the releas e tab to the right an d the latch lev er t o th e left.
Chapter 4 Remov al and R eplacement Removing and Replaci ng a Disk Drive 65 #pvcre ate #vgcfg rest ore.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a CD/D V D Drive 66 Remov ing and Repla cing a CD/ DVD Driv e The CD/D VD is located i n the front of the chas sis. The system power to this compo nent must b e removed before attemp ting t o remo ve or replac e it.
Chapter 4 Remov al and R eplacement Rem o vin g and Rep l aci ng a CD/ D V D Dr ive 67 Removing a CD/DVD Drive Fi gure 4-6 CD/DVD Detail Step 1. T o r emove the CD/D VD, depr ess the front lockin g latch to loosen the driv e from the chassi s. Step 2.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a CD/D V D Drive 68 R eplac ing a C D/DV D Fi gure 4-7 CD/DVD Detail Step 1. Conn ec t the cabl es t o the rea r of the CD /DVD .
Chapter 4 Remov al and R eplacement Remo ving and Replacing a Fr ont Smart Fan Assembl y 69 Remov ing and Replaci ng a F ront Smart F an A ssembly The Fron t Smart F an A sse mbly is lo cated in the front of the chassis. The fan assem bly is a hot swapp able compon en t.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Fr ont Smar t F an Assemb ly 70 Rem ovi n g a Fron t S m art F a n A ss em b ly F igure 4-9 F ront F an Detail Step 1. Push th e F an Releas e Pin away from the fan. Step 2. Sli de t he fan awa y f r om the connector .
Chapter 4 Remov al and R eplacement Remo vi ng and Replacin g a Rear Smart F an A ssembly 71 Remov ing and Repla c in g a Rea r Smar t F an A ssembly The Re ar S mart F an As semb ly is loc ated in t he r ear o f th e chass is. The F an ass em bly is a h ot swappa ble compon en t.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Rear S m ar t Fan Assembl y 72 R emovin g a Rear S mart F an Ass embly Fi gure 4-11 Rear F an Detail Step 1. Push th e F an Releas e Pin away from the fan. Step 2. Sli de t he fan awa y f r om the connector .
Chapter 4 Remov al and R eplacement Remo vi ng and Replacin g a PCI Smart F an A ssembly 73 Remov ing and Repla c in g a PC I Smart F an Assembl y The PCI Smart F an Ass embly is lo cated in the rea r of th e PCI cardcag e. T h e F an ass embly is a hot s wappable compon en t.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a PCI S m art Fan Assembl y 74 Rem ovi ng a P CI S m art F a n As se mbl y Fi gure 4-1 3 PCI Smart F an Assemb ly Detail Step 1. Secu rely grasp the two thu m b holds o n the fan asse mbl y .
Chapter 4 Remov al and R eplacement Removing and Replaci ng a Bulk P o wer Suppl y 75 Remov ing and R epla cing a Bulk P owe r Suppl y The b ul k power s upply is loc ated in the fro nt of t h e chassi s. Th e BPS i s a hot sw appable c omponent. CA UTION Observe all ESD safe ty p recau tions be fore atte mptin g this proced ure.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a Bul k P ower Su pply 76 Rem o vi ng a BP S Fig u r e 4 -15 BP S De t a il Step 1. Pull the ext r ac tion leve rs locate d on the u pper front outer po rtion of the BPS . Step 2. Sli de t he BPS forwa r d using the extracti ons levers to remove it from the chass is.
Chapter 4 Remov al and R eplacement Removing and Repl acing a PCI Po wer Module (Bric k) 77 Remov ing and Repla cing a PCI P ower Modul e (Bri ck) The PCI power modu le is located in the fr ont of t he chassis . The PCI power module is a hot pl uggable compon en t.
Chapter 4 Removal and R eplacement Remo ving and Replacing a PCI P ower M odule (Bric k) 78 Removing a PCI P ower Module (Brick) F igure 4-17 PCI P ower Module Detai l Step 1. Secu rely grasp the han dle on the front of the p ower m odule. Step 2. Firmly d epre ss the secu ring thu mb latch .
Chapter 4 Remov al and R eplacement Remo vi ng and Replaci ng the PCI V ol tage Regul ator Modu les 79 Re mo vi ng a n d R epl ac in g t h e P CI V ol tag e R eg ula t or M od u le s Removing PCI VRM Step 1. P owe r down server . IMPOR T ANT Power mus t b e remo ved from both P CI Chassi s 0 and PCI C hassis 1 to continue.
Chapter 4 Removal and R eplacement Remo ving and Replacing t he PCI V oltage R egulator Modules 80 Step 4. Pu t rig ht s ide cove r ba c k onto cha ss is.
Chapter 4 Remov al and R eplacement Removin g and Repl acing a PC I C ard 81 Remov ing and Repla cing a PCI C ard The PCI car d s are loca te d in t h e rear of t he cha s sis in t he PC I car d cage. PC I ca rds ar e hot swap p able compon en ts . CA UTION Observe all ESD safe ty p recau tions be fore atte mptin g this proced ure.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a PCI C ard 82 Step 3. W ai t fo r S AM t o co mp le te i ts cr itic al reso u rce a n alysi s fo r t h e se le c ted c ard and t h en r e vie w th e analysis r esults.
Chapter 4 Remov al and R eplacement Removin g and Repl acing a PC I C ard 83 Step 13. Connec t all cables to the replac emen t PCI card. Step 14. In SAM’ s Re place Card wi ndow , cl ick th e OK b utton . SAM p owers th e PCI slo t ba ck on, and tu rn s off (stop s blink ing ) the slot’s atte ntion indic ator .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng the M ass Stora ge Backpl ane 84 Remov ing and Repla cing the Mas s Storag e Backplane Removi ng the Bac kpla ne Step 1. Rem ove all intern al dis ks. F igure 4-21Locating In ternal Dis k s Step 2.
Chapter 4 Remov al and R eplacement Removing and Replacing the Mass Storage Backpl ane 85 Ens u re t hat yo u not ice wher e each i s remov ed, so t hat th ey may be corr ectly r einstalled . Fi gure 4-22Locating the Mass Storage Backplan e Step 5. Uns c rew the two captive screw s and remove back plane/b racket assembl y .
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng the M ass Stora ge Backpl ane 86 R eplac ing t he Back plan e Step 1. Align and pr ess the backplan e/br acke t asse mbly in to it s mou nt. Step 2. F asten the two captiv e screws . Step 3.
Chapter 4 Remov al and R eplacement Remo ving and Replacing a MP/S C SI Boar d 87 Remov ing and Repla cing a MP/S CSI Bo ard The M P/SCS I boar d is locate d in the r ear of th e c hassis. The MP/SCSI bo ard is a h ot plu ggable com ponent. Ther e may be up to two M P/SCSI boards install ed in a system.
Chapter 4 Removal and R eplacement Remo ving and R eplaci ng a MP/SCSI Board 88 Removing a MP/SCSI board Fig u r e 4 -25 M P/ S C S I D e tai l Step 1. Label an d r emove all c ables con nected to t he M P/SCSI bo ard to be re moved. Step 2. Loos en the two retain i ng screw s securin g the MP/SCSI board to the chassis .
Appendi x A 89 A Rep lac eab l e P a rt s.
A ppe ndi x A Replaceab le Par ts 90 T able A- 1 hp rp74 05/r p7410 Fi eld Rep lace able U nit (F RU) Lis t FRU Description Re placement P art Numbe r Exc han ge P art Numbe r 18GB 10K RP M SCSI D isk A6537-67001 A6537-69001 1GB DIM M (single) A6098AX A6098-69 001 240V N .
Appendi x A Replaceable Parts 91 Assembl y , Front Bezel, No NamePlate A6752-040 66 Ballast, J147 9 (1 p er system) J1479-60 001 None Box, DVD Filler A6752-67041 None Cable Managem ent Arm 5065-5951 N.
A ppe ndi x A Replaceab le Par ts 92 PCI Fille r P late 5001-6892 None PCI Power M odule (Brick) 0950-3819 A6093-69023 P ower Cord, C19/ CEE 7-7 4. 5m Black CA Assembly 8120-689 9 None P ower Cord, C19/GB 1002 4.5m Black CA Assembly 8121-007 0 None P ower Cord, C19/IEC-309 L6-20 4 .
Appendi x B 93 B Syst em Specificat ions This ch apter des cribes the basic se rver conf igura tion and its phy sical sp ecificatio ns and requir emen ts:.
A ppe ndi x B System Speci ficat ions Dime nsi ons and W eights 94 Dimensions a nd W eig hts This sec tion p rovide s dim ens ions and we ig hts of the s yst em com pon ents. Shippin g bo x, palle t, ra mp, and c ontai ner ad ds approx imate ly 50 lb s to the total syste m weig ht.
Appendi x B System Speci ficat ions Electri cal Specifi cations 95 Elect r ic al S pe ci fica t ion s This sec tion provide s electric al specific ations for hp rp740 5/rp7410 ser vers. Ground ing The site buildin g sha ll provide a safety groun d/pr otectiv e ear th for each AC service entra nce to all cabine ts.
A ppe ndi x B System Speci ficat ions Elect rical Specifi cat ions 96 Syste m P ower Sp ecifi c ati ons T able B -4 and T able B-5 lis t th e AC powe r r equir ements for an hp rp7405 /rp7410 server . Th ese tab les prov ide informat ion to help det erm in e the amoun t of AC pow er needed f or your computer r oom.
Appendi x B System Speci ficat ions En vir onmental Specifi cati ons 97 Envi ronment al Speci fications This section provides the enviro nmental, pow er diss i pati on, nois e emission, and air flow speci fication s for th e hp rp7405/r p7410 serve r .
A ppe ndi x B System Speci ficat ions En vir onmental S pecifications 98 PCI /Ma ss St orag e Se cti on C ooli ng Six (6) 92mm fans loc a ted be t ween t h e Mass St orag e D evic es and the PCI Card Ca ge p rovide airflo w through these devices . The PCI fans are powere d off of housekeeping power and + run at full s peed at a ll times .
Appendi x B System Speci ficat ions En vir onmental Specifi cati ons 99 Figur e B-1 illustra tes the location of the inlet and outlet airduc ts on a sing le cabinet.
A ppe ndi x B System Speci ficat ions En vir onmental S pecifications 100.
Appendi x C 101 C Site Preparati on.
A ppe ndi x C Site Prepar at ion Elect rical Consider ati ons 102 Elect r ic al C onsi der at i ons Prope r des ign an d in stallatio n o f a powe r dist ributio n sy stem for an h p r p7405/rp74 10 s erver requir es specia lized skills.
Appendi x C Site P r eparat i on Electrical L oad Requi rements (Ci rcuit B reaker Si zing) 103 El ectr ical Loa d Req ui r eme n ts (C irc uit Br ea k er S i zing ) It i s alwa ys a good i dea t o de.
A ppe ndi x C Site Prepar at ion Po w e r Q u a l i t y 104 Po w e r Q u a l i t y This equipment is des i gn ed to oper ate over a wide r ange o f voltages and f requencies . I t h as b een test ed and shown to com ply wi th EMC Sp ecification EN50082.
Appendi x C Site P r eparat i on Dis tribut ion H ardw are 105 Dist rib ution H ard ware Thi s s ectio n de scri bes w ire sel ecti on an d the ty pes of ra cew ays (el ect ric al co ndui ts) used in the d ist ribu tio n syst em.
A ppe ndi x C Site Prepar at ion Gr ound ing Systems 106 Gro unding Sy s tems hp rp740 5/rp7410 serv ers requ ire tw o methods of grounding : • P ower distr ibution safety grou n ding • Hi gh freq.
Appendi x C Site P r eparat i on Gr oundi ng Systems 107 NO TE In some cases pow er dist ribution s ystem green (green/ y e l lo w ) wir e ground c onductors are too long and inducti ve to pro v ide adequat e high frequenc y ground return paths .
A ppe ndi x C Site Prepar at ion Gr ound ing Systems 108 • Good—Use t he rais ed floor st r uctu r e as a g round gri d. In this ca s e, the floor must be designed as a g rou n d grid with bo lted.
Appendi x C Site P r eparat i on System In stall ation Gui delines 109 Sys tem I nstall ation Gui del ines This sec tion cont ains inform ation about ins tallati on practice s . Some comm on pitfalls are highlig hted . Both powe r cable and data com muni cati ons cabl e installa tions ar e discus se d.
A ppe ndi x C Site Prepar at ion En vir onmental E lements 110 Env ironme n tal El em ent s The follow ing environ mental elem ents can affect an hp rp740 5/rp7410 ser ver installat ion: • Comput er.
Appendi x C Site P r eparat i on Envi ronmental Elements 111 At altitud es abov e 10,00 0 feet (3048 m ), the lower air d ensit y reduces th e coo ling capabi lity of air condit ionin g syste ms. If yo ur fa cility is loc ated ab ove th is altit ude, th e r ecom mend ed t emp er ature rang es m ay n eed to b e modified.
A ppe ndi x C Site Prepar at ion En vir onmental E lements 112 • Under floor air distribut ion s ys tem—Dow nfl ow air condit ioning equipment lo cated on the raise d floor of the c omputer r oom uses t he cav ity beneat h t he raised fl oor a s plenum for t he s upply ai r .
Appendi x C Site P r eparat i on Envi ronmental Elements 113 CA UTION Low hum idity con tri butes to un de sirably high lev els of e lectro stat ic char ges. This incre as es th e elec trostati c discharge (ESD) vol ta ge potential. ESD can c ause component d a mage d uring serv icing op eration s.
A ppe ndi x C Site Prepar at ion En vir onmental E lements 114 Special precautio ns are nece ssary if the com puter r oom is near a source of air pollution . Some air pollutants, espec ially hy drogen su l fide (H2S), are not on ly unplea sa nt but corro sive as w ell.
Appendi x C Site P r eparat i on Envi ronmental Elements 115 Acoustics Computer equ ipment and air condit i onin g blowers cause comput er rooms to be noisy .
A ppe ndi x C Site Prepar at ion Com put e r Ro o m S a fe ty 116 Compu ter R oom Safet y Insid e the c ompu ter r oom, fi re protect ion and a dequate l ighting (fo r equipment servicin g) are i mportant safety c onside ra tions. F e de ral and loca l safety co des go vern co mpute r install atio ns.
Appendi x C Site P r eparat i on Faci lity Characteristics 117 F ac il ity C h ar ac t eri s tic s This sec tion c ontain s infor matio n abou t facili ty charac teristics that must be con side red for the ins tallatio n or operatio n o f a n hp rp 7405 /rp7410 serv er .
A ppe ndi x C Site Prepar at ion Faci lity Characteristics 118 Aver age F lo or Load ing The av erage floor load va l ue , defined in T a ble C-4, is not appropr i ate for a ddress ing rai s ed flo or r atin gs a t the floor grid sp acing lev el.
Appendi x C Site P r eparat i on Faci lity Characteristics 119 Win dow s A void h o u sing computers in a r oom with windows . Sunli ght ent ering a computer room may cause problems . Magneti c tape s torage me dia is da maged if e xposed t o direct sunlight.
A ppe ndi x C Site Prepar at ion Space Req ui rements 120 Space Requir e ments This sectio n conta ins inform ation about sp ace requir em ents for a n h p r p7405/rp74 10 s erver . Th is data s hould be u sed a s t he b asic guid elin e fo r spac e p lan d evelo pme nts.
Appendi x C Site P r eparat i on Space Requiremen ts 121 The service a rea space r equiremen t s , shown in F i gure C-3, are mi nimum di men sion s. If other e quipment is loc ated so t hat it exhaus.
A ppe ndi x C Site Prepar at ion Zinc P art ic le Contaminat ion 122 Zinc P article Contam inatio n Metalli c part iculate s can be especi ally har mf ul around electr onic equipm ent.
123 Index A AC p ow er s pecific ations , 95 acoustic s , 115 ai r cond iti onin g , 111 syste m r ecom me ndat ions , 111 ai r cond iti onin g ducts , 113 air d istribu tion sy stem room s pace r etu.
Index 124 I I/O S ubsystem , 4 , 11 , 12 installin g se rver into the rac k , 28 IP addre ss default , 40 lc Comand Screen , 41 K K eyston e syste m air du cts , 99 envir onmental eleme nts , 110 powe.
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