Instruction/ maintenance manual of the product DDR3 Samsung
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October 2009 General Information DDR3 SDRAM DDR3 SDRAM Product Guide October 2009 Memory Division.
October 2009 General Information DDR3 SDRAM 1. DDR3 SDRAM Component Ordering Information 51 : 512Mb 1G : 1Gb 2G : 2Gb 4G : 4Gb 04 : x 4 08 : x 8 16 : x16 3 : 4 Banks 4 : 8 Banks 5 : 16 Banks 3. DRAM T ype 4. Density 5. Bit Organi zation 6. # of Internal Banks M A B C D E F G H Z H J M C L Y 9.
October 2009 General Information DDR3 SDRAM 2. DDR3 SDRAM Component Product Guide * Note : 1.35V product is 1.5V operatable. Density Banks Part Number Package & Power , Te m p . (-C/-L) & Speed Org. VDD V oltage PKG Ava i l. Note 1Gb D-die 8Banks K4B1G0446D HC(L)F7/F8/H9 256M x 4 1.
October 2009 General Information DDR3 SDRAM 3 : DIMM 4 : SODIMM Z FBGA(Lead-f ree) H FBGA(Lead-free & Halogen-free) J FBGA(Lead-f ree, DDP) M FBGA(Lead-free & Halogen-free, DDP) 32 : 32M 33 : .
October 2009 General Information DDR3 SDRAM 4. DDR3 SDRAM Module Product Guide 4.1 240Pin DDR3 Unbuffered DIMM (1.5V Product ) 240Pin DDR3 Unbuffered DIMM Org. Density Pa rt Number Speed Raw Card Comp osition Comp. Ve r s i o n Internal Banks Rank PKG Height Ava i l .
October 2009 General Information DDR3 SDRAM 4.3 204Pin DDR3 SoDIMM (1.5V Produc t) 204Pin DDR3 SODIMM Org. Density Part Number Speed Raw Card Compo sition Comp.
October 2009 General Information DDR3 SDRAM 4.5 240Pin DDR 3 Registere d DIMM (1.5V Product) 240Pin DDR3 Registered DIMM Org. Density Part Number Sp ee d Raw Card Composition Comp.
October 2009 General Information DDR3 SDRAM 4.6 240Pin DDR3 Registe red DIMM (1.35V Product) * Note : 1.35V product is 1.5V operatable. 240Pin DDR3 Registered DIMM Org. Density Part Number Sp ee d Raw Card Composition Comp . Ve r s i o n Internal Banks Rank PKG Height A vail.
October 2009 General Information DDR3 SDRAM 4.7 240Pin DDR3 VLP Register ed DIMM (1.5V Product) 240Pin DDR3 VLP Registered DIMM Org. Density Part Number S peed Raw Card Composition Comp. Ve r s i o n Internal Banks Rank PKG Height Av a i l . Note 128Mx 72 1GB M392B2873DZ1 CF8/H9 K(1Rx8) 128M x 8 * 9 pcs 1Gb D-die 81 78 + 4 ball FBGA 18.
October 2009 General Information DDR3 SDRAM 4.8 240Pin DDR3 VLP Register ed DIMM (1.35V Product) * Note : 1.35V product is 1.5V operatable. 240Pin DDR3 VLP Registered DIMM Org. Density Part Number Speed Raw Card Com position Comp. Ve r s i o n Internal Banks Rank PKG Height A vail.
October 2009 General Information DDR3 SDRAM 4GB 2Rx4 PC3 - 10600R - 09 - 10 - E1 - P0 Made in Korea M393B5170EH1-CH9 0920 5. RDIMM RCD Information 5.1 RCD Identification in JEDEC Description in Module Label 5.2 Label Example 5.3 RCD Information - Example Vo l t a g e V endor Revision Module P/N JEDEC Description On Label 1.
October 2009 General Information DDR3 SDRAM 78 + 4Ball FBGA for 1Gb D-die (x4/x8 ) 96 + 4Ball FBGA for 1Gb D-die (x16) A B C D E F G H M N 9.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 10 = 8.00 4.00 0.80 4.80 82 - ∅ 0.45 Sol der ball 0.2 AB M (Datum B) (Datum A) 1 0 87654321 11 9 1.
October 2009 General Information DDR3 SDRAM 78Ball FBGA for 1Gb E-die (x4/x8) / 1Gb F-die (x4 /x8) / 2Gb C-die (x4/x8) 96Ball FBGA for 1Gb E-die (x16) A B C D E F G H M N 7.50 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6.40 3.20 0.80 4.80 78 - ∅ 0.45 Sol der ball 0.
October 2009 General Information DDR3 SDRAM 78Ball FBGA for 2Gb B-die (x4/x8) 96Ball FBGA for 2Gb B-die (x16) A B C D E F G H M N 9.00 ± 0.10 0.80 x 12 = 9.60 3.20 0.80 4.80 78 - ∅ 0.45 Solder ball 0.2 AB M (Datum B) (Datum A) 1.60 MOLDING AREA #A1 INDEX MARK B A BOTTOM VIEW 11 .
October 2009 General Information DDR3 SDRAM 78Ball DDP for 1Gb D-die (x4) 78Ball DDP for 1Gb E-die (x4/x8) Bottom To p Bottom To p A B C D E F G H M N 0.80 x 12 = 9.60 0.80 x 8 = 6. 40 4.00 0.80 4.80 82 - ∅ 0.45 Solder ball 0.2 AB M (Datum B) (Datum A) 87654321 9 1.
October 2009 General Information DDR3 SDRAM 78Ball DDP for 2Gb B-die (x4/x8) Bottom To p A B C D E F G H M N 10.00 ± 0.10 0.80 x 12 = 9.60 0.80 x 8 = 6. 40 3.20 0.80 4.80 78 - ∅ 0.45 Solder ball 0.2 AB M (Datum B) (Datum A) 87654321 9 1.60 #A1 INDEX MARK B A 1 1.
October 2009 General Information DDR3 SDRAM x64/x72 240pin DDR3 SDRAM Unbuffered DIMM 133.35 ± 0.15 Max 4.0 54.675 Units : Millimeters 9.50 128.95 (2) (4X)3.00 ± 0.1 30.00 ± 0.15 2.30 17.30 A B 47.00 71.00 2.50 1.00 0.2 ± 0.15 2.50 ± 0.20 Deta il B 5.
October 2009 General Information DDR3 SDRAM x64 204pin DDR3 SDRAM Unbuffered SODIMM 0.25 MAX 2.55 Deta il B Deta il A 1.00 ± 0.10 0.45 ± 0.03 4.00 ± 0.10 67.60 SPD 0.10 AB M C 2X 4.00 ± 0.10 0.10 AB M C 2X 1.80 (OPTIONAL HOLES) 0.60 Units : Millimeters 21.
October 2009 General Information DDR3 SDRAM x72 240pin DDR3 SDRAM Registered DIMM Register Address, Command and Control lines AB 47.00 71.00 Units : Millimeters 9.50 128.95 (2X)3.00 17.30 Register 1.00 0.2 ± 0.15 2.50 ± 0.20 Deta il B 5.00 Deta il A 1.
October 2009 General Information DDR3 SDRAM 133.15 ± 0.2 4.65 ± 0.12 2 130.45 ± 0.15 127 ± 0.12 23.6 ± 0.15 25.6 ± 0.15 7.45 1 19.29 80.78 Green Line : TIM Att atch Line 0.4 1 +0/ -0.3 0.65 ± 0.2 R 0 . 2 R0.1 1 25.6 ± 0.15 0.15 1.3 1.3 2 2 ± 0.
October 2009 General Information DDR3 SDRAM 19 ± 0.1 39.3 ± 0.2 D 19 E (Clip open size) K text mark ’B’ or ’K’ punch press_stamp B A 39.3 ± 0.2 29.77 R 1. 5 0.1 ~ 0.3 Upper Bending Tilting Gap 0.5 3. CLIP P ART C 1.05 132.95 ± 133.45 1.27 4.
An important point after buying a device Samsung DDR3 (or even before the purchase) is to read its user manual. We should do this for several simple reasons:
If you have not bought Samsung DDR3 yet, this is a good time to familiarize yourself with the basic data on the product. First of all view first pages of the manual, you can find above. You should find there the most important technical data Samsung DDR3 - thus you can check whether the hardware meets your expectations. When delving into next pages of the user manual, Samsung DDR3 you will learn all the available features of the product, as well as information on its operation. The information that you get Samsung DDR3 will certainly help you make a decision on the purchase.
If you already are a holder of Samsung DDR3, but have not read the manual yet, you should do it for the reasons described above. You will learn then if you properly used the available features, and whether you have not made any mistakes, which can shorten the lifetime Samsung DDR3.
However, one of the most important roles played by the user manual is to help in solving problems with Samsung DDR3. Almost always you will find there Troubleshooting, which are the most frequently occurring failures and malfunctions of the device Samsung DDR3 along with tips on how to solve them. Even if you fail to solve the problem, the manual will show you a further procedure – contact to the customer service center or the nearest service center
