Instruction/ maintenance manual of the product MO810E Intel
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Intel ® Desktop Board D810EMO/MO810E Technical Product Specification The Inte l ® Desktop Board D810EMO/MO810E may contain design defects or errors known as errata that may cause the product to deviate from p ublished specifications. Current characterized errata are documented in the Intel Desktop Board D810EMO/MO810E Specification Update.
Revision History Revision Revision History Date -001 First release of the Intel ® Desktop Board D810EMO /MO810E Technic al Product Specific ation February 2000 This product specification applies to only standard D810EMO/MO810E boards with BIOS identifier MO81010A.
iii Preface This Technical Product Specifi cation (TPS) specifies the board la yout, components, connectors, power and environmental requirements, and the BIOS for the D810EMO/MO810E desktop board. It describes the standard product and available manufacturing options.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification iv Other Common Notation # Used after a signal name to identify an active-low signal (s uch as USBP0#) (NxnX) When used in the desc .
v Contents 1 Product Description 1.1 Overvie w ................................................................................................................... 1 0 1.1.1 Feature Summary ..............................................................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification vi 2.9 Jumpe r Blo ck ............................................................................................................. 49 2.10 Mechanical C onsiderations ................
Contents vii 4.5 Secu rity Men u............................................................................................................ 83 4.6 Pow er Menu ...........................................................................................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification viii 21. Mic In Connector ....................................................................................................... 40 22. Chassis Fan Connector (J2J1) .................
9 1 Product Description What This Chapter Contains 1.1 Overvie w ................................................................................................................... 1 0 1.2 Online Support................................................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 10 1.1 Overview 1.1.1 Feature Summary Table 1 summarizes the D810EMO/MO 810E board’s major features.
Product Description 11 For information about Refer to The board’s com pliance level with ACPI, Plug and Play , and SMBIOS Table 2, page 13 1.1.2 Board Layout Figure 1 shows the location of the major components on the board.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 12 1.1.3 Block Diagram Figure 2 is a block diagram of the major functional areas of the board.
Product Description 13 1.2 Online Support Find information about Intel ® desktop boards under “Product Info” or “Customer Support” at these World Wide Web sites: http: //www.int el.com /desi gn/moth erbd http://support.intel.com/support/motherboards/desktop 1.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 14 Table 2. Specifications ( continued) Reference Name Specification Title Version, Revision Date, and Owners hip This specification is available at: IrDA † Serial Infrared Physical Layer Link Spec ification Version 1.
Product Description 15 Table 2. Specifications ( continued) Reference Name Specification Title Version, Revision Date, and Owners hip This specification is available at: UHCI Univers al Host Controller Interface Design G uide Version 1.1, March 1996, Intel Corporation.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 16 1.4 Processor CAUTION The board supports processors that draw a maximum of 22 am ps. Using a processor that draws more than 22 amps can damage the processor, the board, and the power supply.
Product Description 17 1.5 System Memory CAUTION To be fully compliant with all applicable Intel ® SDRAM memory specifications, the board should be populated with DIMMs that support the Serial Presence Detect (SPD ) data structure. If your memory m odules do not support SPD, you will see a notification to this effect on the screen at power up.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 18 1.6 Intel ® 810E Chipset The Intel 810E chipset consists of the following devices: • 82810E DC-133 G raphics Memory Controller.
Product Description 19 1.6.1 Direct AGP Direct (integrated) AGP is a high-performance bus (independent of the PCI bus) for graphics-intensive applications, such as 3-D applications.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 20 1.6.3 IDE Support The board has two independent bus-mastering IDE interfaces. These interfaces support: • ATA PI devices (such .
Product Description 21 ✏ NOTE The recommended method of accessing the date in system s with Intel desktop boards is indirectly from the Real-Time Clock (RTC) via the BIOS. The BIO S on Intel desktop boards contains a century checking and maintenance feature.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 22 1.9 Graphics Subsystem The Intel 82810E DC-133 GMCH graphics memory controller hub component provides the following graphics supp.
Product Description 23 1.10 Audio Subsystem The Audio Codec ’97 (AC ’97) compatible audio subsystem includes these features: • Split digital/analog architecture for improved signal-to-noise rati.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 24 1.10.4 Audi o Connectors The audio connectors include the following: • Line out (back panel) • Mic in (back panel) • ATA PI CD-RO M (connects an internal ATAPI C D-ROM drive to the audio mixer) For information about Refer to The back panel audio c onnectors Section 2.
Product Description 25 1.12 LAN Subsystem The Intel 82559 Fast Ethernet Wired for Management (WfM) PCI LAN subsystem provides both 10Base-T and 100Base-TX connectivity.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 26 1.12.2 LAN Subsystem Software The Intel 82559 Fast Ethernet WfM PCI LAN software and drivers are available from Intel’s World Wide Web site. For information about Refer to Obtaining LAN software and driv ers Section 1.
Product Description 27 1.13 Power Management Features Power management is implemented at several levels, including: • Advanced Configuration and Pow er Interface (ACPI) • Hardware support: Power connector Wake on network event Instantly Available technology Wake on Ring Resume on Ring 1.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 28 1.13.1.1 System States and Power States Under ACPI, the operating system directs all system and device pow er state transitions.
Product Description 29 1.13.1.2 Wake Up Devices and Events Table 9 lists the devices or specific events that can wake the computer from specific states.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 30 1.13.2.1 Power Connector When used with an ATX-compliant power supply that supports remote power on/off, the board can turn off the system power through software control.
Product Description 31 1.13.2.4 Instantly Available Technology CAUTION For Instantly Available technology, the +5 V standby line for the power supply must be capable of providing adequate +5 V standby current. Failure to provide adequate standby current when using this feature can damage the power supply.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 32.
33 2 T echnical Reference What This Chapter Contains 2.1 Introduction................................................................................................................ 33 2.2 Memory Ma p ..................................................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 34 2.3 I/O Map Table 12. I/O Map Address (hex) Size Description 0000 – 000F 16 bytes DMA Controller 0020 – 0021 2 bytes Programm.
Technical Reference 35 Table 12. I/O Map (continued) Address (hex) Size Description 96 contiguous by tes starting on a 128-byte divis ible boundary ICH (ACPI + TCO) 64 contiguous by tes starting on a .
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 36 2.5 PCI Configuration Space Map Table 14. PCI Conf iguration Space Map Bus Number (hex) Device Number (hex) Function Number (hex).
Technical Reference 37 2.7 PCI Interrupt Routing Map This section describes interrupt sharing and how the interrupt signals are connected between the PCI bus connector and onboard PCI devices. The PCI specification specifies how interrupts can be shared between devices attached to the PCI bus.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 38 2.8 Connectors CAUTION Only the back panel I/O connectors of the board have overcurrent protection. The internal board connectors are not overcurrent protected, and should connect only to devices inside the computer chassis, such as fans and internal peripherals.
Technical Reference 39 2.8.1 Back Panel I / O Connector s Figure 4 shows the location of the back panel I/O connectors. OM08925 C DF E A B Item Description A USB port 0 ( see Table 17, page 40) B USB .
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 40 Table 17. USB Connectors Pin Signal Name 1 +5 V (fused) 2 USBP0# / USBP1# 3 USBP0 / USBP1 4 Ground Table 18.
Technical Reference 41 2.8.2 Internal I/O Connectors Figure 5 shows the location of the internal I/O connectors. OM08926 1 2 40 39 C D F E 1 11 10 20 1 2 49 50 B 8 9 2 1 1 A 1 G H 1 Item Description R.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 42 Table 22. Chassis Fan Connector (J2J1) Pin Signal Name 1 Ground 2 +12 V 3 Ground Table 23.
Technical Reference 43 Table 25. Slimline IDE Connect or (J8E1) Pin Signal Name Pin Signal Name 1 AUD_LCR_R 2 AUD_RCD_R 3 AUD_CDGND_R 4 AUD_CDGND_R 5N / C 6N / C 7 Reset IDE 8 Ground 9 Data 7 10 Data .
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 44 Table 27. Pow er Connector (J8B1) Pin Signal Name Pin Signal Name 1 +3.3 V 11 +3.
Technical Reference 45 Table 28. PCI Bus Connect or (J4B1) Pin Signal Pin Signal Pin Signal Pin Signal A1 Ground (TRST#)* B1 -12 V A32 AD16 B32 AD17 A2 +12 V B2 Ground (TCK)* A33 +3.3 V B33 C/BE2# A3 +5 V (TMS)* B3 Ground A34 FRAME# B34 Ground A4 +5 V (TDI)* B4 No c onnect (TDO)* A35 Ground B35 IRDY# A5 +5 V B 5 +5 V A36 TRDY# B36 +3.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 46 2.8.3 External I / O Connectors Figure 6 shows the locations of the external I/O connectors. OM08927 2 10 7 1 A B 16 15 2 1 Item Description Reference Designator A USB ports (see Table 30, page 47) J7A1 B Front panel (see Table 31, page 47) J8C1 Figure 6.
Technical Reference 47 2.8.3.1 USB Port Connector Table 30 lists the signal names of the USB port connector. Table 30. USB Port Connector (J7A1) Pin Signal Name Pin Signal Name 1 USB_PWR 2 USB_PWR 3 USB_P2RL# 4 USB_P3RL# 5 USB_P2RL 6 USB_P3RL 7 Ground 8 Ground 9 Key (no pin) 10 USB_FP_OC 2.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 48 2.8.3.2. 1 Power / Sl eep / Message Waiti ng LED Connector Pins 2 and 4 can be connected to a single- or dual-colored LED. Table 32 lists the possible states for a single-colored LED.
Technical Reference 49 2.9 Jumper Block CAUTION Do not move jumpers with the power on. Always turn off the power and unplug the power cord from the computer before changing a jumper setting. O therwise, damage to the board could occur. Figure 7 shows the location of the BIOS Setup jumper block.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 50 Table 34. BIOS Setup Configuration Jumper Settings (J8F1) Function/Mode Jumper Setting Configuration Normal 1-2 1 3 The BIOS uses current configuration information and pas swords for booting.
Technical Reference 51 2.10 Mechanical Considerations 2.10.1 FlexATX Form Factor The board is designed to fit into a FlexATX form-factor chassis. The board can also be installed in a microATX-form-factor chassis. Figure 8 illustrates the mechanical form factor for the board.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 52 2.10.2 I/O Shield The back panel I/O shield for the board must meet specific dimension and material requirements. Systems based on this board need the back panel I/O shield to pass certification testing.
Technical Reference 53 2.11 Electrical Considerations 2.11.1 Add-i n Boar d Consi der ati ons The board is designed to provide 2 A (average) of +5 V current for an add-in board in the PCI slot.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 54 2.11.3 Power Suppl y Consi der ati ons System integrators should refer to the power usage values listed in Table 35 when selecting a power supply for use with this board.
Technical Reference 55 2.12 Thermal Considerations CAUTION An ambient temperature that exceeds the board’s m aximum operating temperature by 5 o C to 10 o C could cause components to exceed their maxim um case temperature and malfunction. For information about the maxim um operating temperature, see the environmental specifications in Section 2.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 56 Table 37 provides maximum component case temperatures for board components that could be sensitive to thermal changes. Case temperatures could be affected by the operating temperature, current load, or operating frequency.
Technical Reference 57 2.14 Environmental Table 38 lists the environmental specifications for the board. Table 38. Board Environmental Specifications Parameter Specification Temperature Non-Operating .
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 58 2.15 Regulatory Compliance This section describes the board’s compliance with safety and EMC regulations. 2.15.1 Safety Regulations Table 39 lists the safety regulations the board complies with when it is correctly installed in a compatible host system.
Technical Reference 59 2.15.3 Certification Markings This printed circuit assembly has the following product certification markings: • UL Joint Recognition Mark: Consists of small c followed by a st.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 60.
61 3 Overview of BIOS Features What This Chapter Contains 3.1 Introduction................................................................................................................ 61 3.2 BIOS Flash Memory Organi zation .........................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 62 3.2 BIOS Flash Memory Organization The Intel 82802AB Firmware Hub (FWH) includes a 4 Mbit (512 KB) symmetrical flash memory device. Internally, the device is grouped into eight 64-KB blocks that are individually erasable, lockable, and unlockable.
Overview of BIO S Features 63 3.3.2 PCI I DE Suppor t If you select Auto in the BIOS Setup program, the BIOS automatically sets up the two PCI IDE connectors with independent I/O channel support.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 64 3.4 System Management BIOS (SMBIOS) SMBIOS is a Desktop Management Interface (D MI) compliant method for managing computers in a managed network.
Overview of BIO S Features 65 3.5 BIOS Upgrades The BIOS can be upgraded using the Intel ® Flash Memory Update utility that is available from Intel. This utility supports the following BIOS maintenan.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 66 3.6 Recovering BIOS Data Some types of failure can destroy the BIOS. For example, the data can be lost if a power outage occurs while the BIOS is being upgraded in flash memory. The BIOS can be recovered from either a 1.
Overview of BIO S Features 67 3.7 Boot Options In the BIOS Setup program, the user can choose to boot from an ATAPI removable media device, hard drives, CD-RO M, or the network. Boot devices are defined in priority order. The default setting is for the CD-ROM drive to be the primary boot device and the hard drive to be the secondary boot device.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 68 3.8 USB Legacy Support USB legacy support enables USB devices such as keyboards, mice, and hubs to be used even w hen no operating system USB drivers are in place. By default, USB legacy support is set to A uto.
Overview of BIO S Features 69 3.9 BIOS Security Features The BIOS includes security features that restrict access to the BIO S Setup program and who can boot the computer.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 70.
71 4 BIOS Setup Program What This Chapter Contains 4.1 Introduction................................................................................................................ 71 4.2 Maintenance Menu ...............................................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 72 Table 43 lists the function keys available for menu screens. Table 43. BIOS Setup Program Function Keys BIOS Setup Program Functi.
BIOS Setup Program 73 4.2.1 Extended Confi gur ati on Submenu To access this submenu, select Maintenance on the menu bar, then Extended Configuration . Maintenance Main Advanced Security Power Boot Exit Extended Configuration The submenu represented by Table 45 is for setting system control and video memory cache mode.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 74 4.3 Main Menu To access this menu, select Main on the menu bar at the top of the screen.
BIOS Setup Program 75 4.4 Advanced Menu To access this menu, select Advanced on the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit Boot Configuration Peripheral Configuration IDE Configuration Event Log Configuration Video Configuration Table 47 describes the Advanced menu.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 76 4.4.1 Boot Confi gur ati on Submenu To access this submenu, select Advanced on the menu bar, then Boot Configuration .
BIOS Setup Program 77 4.4.2 Per i pher al Configur ati on Submenu To access this submenu, select Advanced on the menu bar, then Peripheral Configuration .
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 78 4.4.3 I DE Confi gur ati on Submenu To access this submenu, select Advanced on the menu bar, then IDE Configuration .
BIOS Setup Program 79 4.4.3.1 Primary/Secondary IDE Master/Slave Submenus To access these submenus, select Advanced on the menu bar, then IDE Configuration and then the master or slave to be configured.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 80 Table 51. Primary/Secondary IDE Master/Slave Submenus (continued) Feature Options Description PIO Mode • Auto (default) • 0 • 1 • 2 • 3 • 4 Configures the PIO m ode. Auto sets the PIO m ode to the fastest s peed supported.
BIOS Setup Program 81 4.4.4 Event Log Confi gur ati on To access this menu, select Advanced on the menu bar, then Event Log Configuration . Maintenance Main Advanced Security Power Boot Exit Boot Conf.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 82 4.4.5 Vi deo Configuration To access this menu, select Advanced on the menu bar, then Video Configuration .
BIOS Setup Program 83 4.5 Security Menu To access this menu, select Security from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit The menu represented by Table 54 is for setting passwords and security features.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 84 4.6 Power Menu To access this menu, select Power from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit The menu represented in Table 55 is for setting the power management features.
BIOS Setup Program 85 4.7 Boot Menu To access this menu, select Boot from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit IDE Drive Configuration The menu represented in Table 56 is used to set the boot features and the boot sequence.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 86 Table 56. Boot Menu (continued) Feature Options Description First Boot Device Second Boot Devic e Third Boot Device Fourth Boot Device • ARMD-FDD (Note 1) • ARMD-HDD (Note 2) • IDE-HDD • ATAPI CDROM • Intel UNDI, PXE 2.
BIOS Setup Program 87 4.8 Exit Menu To access this menu, select Exit from the menu bar at the top of the screen. Maintenance Main Advanced Security Power Boot Exit The menu represented in Table 57 is for exiting the BIOS Setup program, saving changes, and loading and saving defaults.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 88.
89 5 Error Messages and Beep Codes What This Chapter Contains 5.1 BIOS Error Messages ................................................................................................ 89 5.2 Port 80h POST C odes ........................................
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 90 Table 58. BIO S Error Messages (continued) Error Message Explanation Checking NVRAM..... NVRAM is being c hecked to see if it is valid. Update OK! NVRAM was inv alid and has been updated.
Error Messages and B eep Codes 91 5.2 Port 80h POST Codes During the POST, the BIO S generates diagnostic progress codes (POST-codes) to I/O port 80h. If the POST fails, execution stops and the last POST code generated is left at port 80h. This code is useful for determining the point where an error occurred.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 92 Table 61. Runtime Code Uncompressed in F000 Shadow RAM Code Description of PO ST Operation 03 NMI is Disabled. To chec k soft reset/pow er-on. 05 BIOS stack set. G oing to disable cache if any .
Error Messages and B eep Codes 93 Table 61. Runtime Code Uncompressed in F000 Shadow RAM (continued) Code Description of PO ST Operation 40 To prepare the descriptor tables. 42 To enter in virtual mode for memory test . 43 To enable interrupts for diagnostics mode.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 94 Table 61. Runtime Code Uncompressed in F000 Shadow RAM (continued) Code Description of PO ST Operation 84 Lo ck-key ch e cking over . To ch eck fo r memor y size mi smatch wi th CMOS .
Error Messages and B eep Codes 95 Table 61. Runtime Code Uncompressed in F000 Shadow RAM (continued) Code Description of PO ST Operation AE Uncompress SMBIOS m odule and init SMBIOS code and form the runtime SMBIOS image in shadow. B1 Going to copy any code to spec ific area.
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 96 Table 64 describes the lower nibble of the high byte and indicates the bus on which the routines are being executed.
Error Messages and B eep Codes 97 5.5 BIOS Beep Codes Whenever a recoverable error occurs during power-on self-test (POST), the BIO S displays an error message describing the problem (see Table 65).
Intel Desktop Board D810EMO/MO 810E Technical Product Specification 98.
An important point after buying a device Intel MO810E (or even before the purchase) is to read its user manual. We should do this for several simple reasons:
If you have not bought Intel MO810E yet, this is a good time to familiarize yourself with the basic data on the product. First of all view first pages of the manual, you can find above. You should find there the most important technical data Intel MO810E - thus you can check whether the hardware meets your expectations. When delving into next pages of the user manual, Intel MO810E you will learn all the available features of the product, as well as information on its operation. The information that you get Intel MO810E will certainly help you make a decision on the purchase.
If you already are a holder of Intel MO810E, but have not read the manual yet, you should do it for the reasons described above. You will learn then if you properly used the available features, and whether you have not made any mistakes, which can shorten the lifetime Intel MO810E.
However, one of the most important roles played by the user manual is to help in solving problems with Intel MO810E. Almost always you will find there Troubleshooting, which are the most frequently occurring failures and malfunctions of the device Intel MO810E along with tips on how to solve them. Even if you fail to solve the problem, the manual will show you a further procedure – contact to the customer service center or the nearest service center
