Instruction/ maintenance manual of the product MDS-PC2 Sony
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1 MICROFILM MDS-PC2 SPECIFICA TIONS SERVICE MANUAL MINIDISC DECK Model Name Using Similar Mechanism MDS-S40 MD Mechanism T ype MDM-5A Optical Pick-up T ype KMS-260B/J1N US Model Canadian Model AEP Mod.
2 SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers which are displayed automa tically when error s occur , and erro r codes which show the error history in the test mode during servicing . For details on how to vie w error codes for the customer, r efer to the follo wing box in the instruction manual.
3 Displays the recording time. Displayed as “r ππππππ h”. The displayed time is the total time the laser is set to the high po wer state. This is about 1/4 of the actual recording time. The time is displayed in decimal digits from 0h to 65535h.
4 CA UTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous r a- diation exposure. Notes on chip component replacement • Nev er reuse a disconnected chip component. • Notice that the minus side of a tantalum capacitor may be damaged by heat.
5 T ABLE OF CONTENTS 1. SER VICING NOTE .......................................................... 6 2. GENERAL ........................................................................ 12 3. DISASSEMBL Y 3-1. Case and Front Panel .....................
6 SECTION 1 SER VICING NO TE JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa veform of the BD board.
7 IOP DA T A RECORDING AND DISPLA Y WHEN OPTICAL PICK-UP AND NON-V OLA TILE MEMOR Y (IC171 OF BD BO ARD) ARE REPLA CED The IOP v alue labeled on the optical pick-up can be recorded in the non-v ola tile memory . By recording the value, it will elimin a te the need to look at the value on the label of the optical pic k-up.
8 CHECKS PRIOR T O PARTS REPLA CEMENT AND ADJUSTMENTS Before performing repairs, perform the follo wing checks to determine the faulty locations up to a certain extent.
9 Back up board FLUORESCENT DISPLA Y TUBE ALL LIGHTING AND KEY CHECK MODE In this mode, the fluorescent display tube check and key c heck can be performed. Procedur e: 1. While pressing the INPUT button and r (REC) b utton, insert the power plug into the outlet.
10 Fig. 1 Reading the T est Mode Display (During recording and stop) R Ts@@c##c** Fluorescent display tube display @@ : Cause of retry ## : Number of retries ** : Number of retry errors Fig. 2 Reading the T est Mode Display (During playbac k) @@####**$$ Fluorescent display tube display @@ : Parts No.
11 Reading the Display: Con vert the hexadecimal display into binary display . If more than two causes, they will be added. Example When 84 is displayed: Higher bit : 8 = 1000 n b7 Lo wer bit : 4 = 01.
12 This section is e xtracted from instruction manual. Location of Parts and Contr ols SECTION 2 GENERAL Front P anel 2 4 6 7 8 9 10 11 1 3 5.
13 SECTION 3 DISASSEMBL Y Note: Follo w the disassembly procedur e in the numerical order gi ven. 3-1. CASE AND FRONT P ANEL 3-2. MD MECHANISM 8 Front panel (Take not of two claws) 9 Flat type wire (CN701) 1 Two screw s (Flat head) 2 Two screws (Flat head) 3 Case 4 Two screws (BTT M3) 6 Screw (M2 x 6.
14 3-4. BASE UNIT (MB U-5A) AND BD BO ARD 3-3. SLIDER (CAM) 6 Slider (Cam) 2 Brack et (Guide L) 5 Brack et (Guide R) 3 Leaf spring 1 T wo screws (BTP 2.6 x 6) 4 T wo screws (BTP 2.6 x 6) Set the shaft of Lev er (O/C) to be at the position in the figure.
15 3-5. SW BO ARD AND LO ADING MOT OR (M103) 5 Three screws (BTP2.6 x 6) 4 Loading motor (M103 ) 6 SW board 2 Gear B 3 T wo screws (PWH 1.7 x 3) 1 Screw (PTPWH M2.
16 SECTION 4 TEST MODE 4-1. PRECA UTIONS FOR USE OF TEST MODE • As loading related operations will be performed reg ar dless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
17 4-5. SELECTING THE TEST MODE There are 27 types of test modes as sho wn belo w . The groups can be switched by pressing the = and = b uttons. After selecting the group to be used, press the ^ “PR OGRAM” button. After setting a certain group, pressing the = and = buttons s witches between these modes.
18 4-5-1. Operating the Continuous Playbac k Mode 1. Entering the continuous playback mode 1 Set the disc in the unit. (Whiche ver recordable discs or discs for playback only are av ailable.) 2 Press the + button and display “CPLA Y MODE”. 3 Press the ^ “PR OGRAM” button to change the display to “CPLA Y MID”.
19 4-6. FUNCTIONS OF O THER BUTT ONS Contents Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns ON/OFF . Stops continuous playback and continuous recording. The sled moves to the outer circumf erence only w hen this is pressed.
20 ( P REC SYNC L.SYNC O VER B A- TRA CK DISC SLEEP MONO When Off Contents Displa y When Lit During continuous playback (CL V : ON) T rac king servo OFF Recording mode ON CL V low speed mode ABCD adju.
21 5-1. PARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follo ws. The procedure changes according to the part replaced SECTION 5 ELECTRICAL ADJUSTMENTS • Abbre viation OP :.
22 5-2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSINON T o check the emission of the laser diode during adjustments, nev er vie w directl y from the top as this may lose your eye-sight.
23 5-6. CHECKS PRIOR TO REP AIRS These checks are performed before replacing parts according to “approximate specif ications” to determine the faulty locations. For details, refer to “Checks Prior to P arts Replacement and Adjustments” (See page 8).
24 5-6-4. Focus Bias Check Change the focus bias and check the focus tolerance amount. Checking Procedur e : 1. Load a test disk (MD W -74/A U-1). 2. Rotate the + button and display “CPLA Y MODE”. 3. Press the ^ “PR OGRAM” button twice and display “CPLA Y MID”.
25 5-7. INITIAL SETTING OF ADJUSTMENT VALUE Note: Mode which sets the adjustment results recorded in the non-vola tile memory to the initial setting value. Ho wev er the results of the temperature compensation offset adjustment will not change to the initial setting value.
26 6. Press the = , + buttons so tha t the reading of the laser po w er meter becomes 6.9 to 7.1 mW , press the ^ “PR O- GRAM” button and sa ve it. Note : Do not perform the emission with 7.0 mW more than 15 seconds continuously . 7. Then, press the + button and display “PWR CHECK”.
27 11. Press the = , + buttons until the w av eform of the oscil- loscope mov es closer to the specified v alue. In this adjustment, wa veform v aries at intervals of a pprox. 2%. Adjust the wa veform so that the specified value is satisf ied as much as possible.
28 5-13. ERROR RA TE CHECK 5-13-1. CD Error Rate Chec k Checking Pr ocedure : 1. Load a check disc (MD) TD YS-1. 2. Press the + b utton and display “CPLA Y MODE”. 3. Press the ^ “PR OGRAM” button twice and display “CPLA Y MID”. 4. The display changes to “C1 = AD = ”.
29 NO TE: It is useful to use the jig. for checking the wa veform. (Refer to Ser - vicing Note on page 6.) 5-15. ADJUSTING POINTS AND CONNECTING POINTS [BD BO ARD] (SIDE A) [BD BO ARD] (SIDE B) CN110 .
30 SECTION 6 DIA GRAMS 6-1. CIRCUIT BO ARDS LOCA TION Back up board SW board BD board P anel board Main board P ower boar d.
31 31 MDS-PC2 6-2. BLOCK DIA GRAM – BD SECTION – HR901 OVER WRITE HEAD HEAD DRIVE Q181,182 3 6 1 2 FILTER PCO FILI FILO CLTV PLL EFM, ACIRC, ENCODER/ DECODER RF AGC & EQ AGCI RFO MORFI MORFO R.
32 32 MDS-PC2 – MAIN SECTION – 1 RM 5 23 80 17 16 18 12 19 4 2 26 14 13 24 15 74 66 18 71 78 72 31 33 32 69 77 75 53 51 68 70 59 60 54 76 67 65 56 55 73 79 47 30 28 49 15 13 12 35 97 19 34 37 50 3.
33 33 MDS-PC2 – MAIN SECTION – IC701 !£ (XOUT) IC201 !™ (SYSCLK) IC201 !¶ (LRCK1) IC201 !§ (BCK) – P ANEL SECTION – IC901 %• (OSCO) 3.4Vp-p 2.
34 34 MDS-PC2 6-3. PRINTED WIRING BO ARD – BD SECTION – • See page 30 for Cir cuit Boards Location. D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC123 D-2 IC171 D-1 Q102 B-1 Q103 B-1 Q104 B-1 • SEMICONDUCT OR LOCA TION Ref.
35 35 MDS-PC2 6-4. SCHEMA TIC DIA GRAM – BD (1/2) SECTION – • See page 33 for Wa veform. • See page 45 for IC Bloc k Diagrams. • See page 48 for IC Pin Function.
36 36 MDS-PC2 6-5. SCHEMA TIC DIA GRAM – BD (2/2) SECTION – • See page 33 for Wa veform. • See page 34 for Printed Wiring Board. (Page 35) (Page 35) (Page 35) (Page 35) (Page 35) (Page 35) (Pa.
37 37 MDS-PC2 6-6. SCHEMA TIC DIA GRAM – MAIN (1/2) SECTION – • See page 33 for Wa veform. • See page 39 for Printed Wiring Board. (Page 44) (Page 36) (Page 42) (Page 38) (Page 38) (Page 38) (Page 38) SW BOARD BD BOARD (2/2) POWER BOARD • See page 51 for IC Pin Function.
38 38 MDS-PC2 6-7. SCHEMA TIC DIA GRAM – MAIN (2/2) SECTION – • See page 33 for Wa veform. • See page 47 for IC Bloc k Diagrams. (Page 37) (Page 37) (Page 37) (Page 37) (Page 40) PANEL BOARD I.
39 39 MDS-PC2 6-8. PRINTED WIRING BO ARD – MAIN SECTION – • See page 30 for Cir cuit Boards Location. IN OUT L L R R LINE (ANALOG) • SEMICONDUCT OR LOCA TION D390 A-2 D391 A-2 IC301 A-3 IC308 A-1 IC351 A-4 IC381 A-2 IC382 A-2 IC441 A-5 IC501 B-7 Q191 A-1 Q192 A-1 Q291 A-1 Q292 A-1 Q390 A-2 Q441 B-6 Ref.
40 40 MDS-PC2 6-9. SCHEMA TIC DIA GRAM – P ANEL SECTION – • See page 33 for Wa veform. (Page 38) MAIN BOARD (2/2).
41 41 MDS-PC2 6-10. PRINTED WIRING BOARD – P ANEL SECTION – • See page 30 for Cir cuit Boards Location. (Page 39) MAIN BOARD.
42 42 MDS-PC2 6-11. SCHEMA TIC DIA GRAM – PO WER SECTION – (Page 37) (Page 36) BD BOARD (2/2) MAIN BOARD (1/2) IN 1 IN 2 OUT DIGITAL (OPTICAL) RESET.
43 43 MDS-PC2 6-12. PRINTED WIRING BOARD – PO WER SECTION – • See page 30 for Cir cuit Boards Location. • SEMICONDUCT OR LOCA TION D431 C-2 D432 C-2 D433 C-2 D466 B-2 D467 B-2 D801 E-1 IC601 C-1 Ref. No. Location • SEMICONDUCT OR LOCA TION D411 C-4 D412 C-3 D421 C-2 D422 C-1 D451 B-2 D452 B-2 D461 B-4 D462 B-4 D911 B-4 D912 C-2 Ref.
44 44 MDS-PC2 6-13. SCHEMA TIC DIA GRAM – BD SWITCH SECTION – 6-14. PRINTED WIRING BOARD – BD SWITCH SECTION – • See page 30 for Cir cuit Boards Location.
45 100 99 98 97 96 95 94 93 EFMO DVSS TEST3 TEST2 TEST1 TEST0 SPFD SPRD 92 SFDR 91 SRDR 90 FS4 89 FRDR 88 FFDR 87 DVDD 86 TFDR 85 TRDR 84 LDDR 83 APCREF 82 DTRF 81 CKRF 80 XLRF 79 F0CNT 78 ADFG 77 APC.
46 • MAIN section 3 4 5 6 2 8 7 1 VADCN VADCP VINL2 PGA PGA 0DB/6DB SWITCH NOISE SHAPER INTERPOLATION FILTER DSP FEATURES PRAK DETECTOR L3-BUS INTERFACE DECIMATION FILTER DIGITAL INTERFACE DIGITAL M.
47 6-16. IC PIN FUNCTIONS • IC101 RF Amplifier (CXA2523AR) (BD board) Pin No . Pin Name I/O Function I J VC A to F PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLA T XSTBY F0CNT VREF EQADJ 3T ADJ Vcc WBL.
48 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 to 34 35 36 to 40 41 42 43 44 45 46 47 • IC121 Digital Signal Processor , Digital Serv o Signal Processor , EFM/A CIRC Encoder/Decoder , Shock-pr oof Memory Controller , A TRAC Encoder/Decoder , 2M Bit DRAM (CXD2654R) (BD board) Function Pin No .
49 Function Pin No . Pin Name I/O 48 49 50, 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 D1 D0 D2, D3 MVCI ASY O ASYI A VDD BIAS RFI A VSS P.
50 Function Pin No . Pin Name I/O 86 87 88 89 90 91 92 93 94 95 96 to 98 99 100 TFDR D VDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1 to TEST3 D VSS EFMO O — O O O O O O O I (S) I — O Trac king servo driv e PWM output (+) +3V power suppl y (Digital) Focus serv o drive PWM output (+) Focus servo dr ive PWM output (–) 176.
51 1, 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 to 27 28 29 30 31 32 33 34 35 36 37 38 to 41 42, 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57, 58 59 Pin No .
52 Pin No. Pin Name I/O Function 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 PB-P REC/PB +3.
53 3 2 7 7 2 1 9 26 26 4 FL701 T901 5 6 5 5 12 11 11 5 MDM-5A not supplied not supplied not supplied not supplied not supplied #1 #1 #1 #1 #1 #1 #1 #1 # 7 #1 not supplied 7 7 10 11 11 8 7 7 22 14 16 7 18 25 24 13 15 12 20 21 (AEP ,SP) 21 (UK) 13 (SP) 21 (US,CND) 19 17 23 23 22 SECTION 7 EXPLODED VIEWS 7-1.
54 7-2. MECHANISM SECTION (MDM-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 515 4-996-227-01 LEVER (HEAD) 516 4-996-229-01 SPRING (HEAD LEVER), TORSION 517 4-996-212-0.
55 7-3. BASE UNIT SECTION (MB U-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 565 4-996-261-01 GEAR (SL-B) 566 4-996-264-01 SPRING (SHAFT), LEAF 567 4-996-265-01 SHAFT , MAIN 568 4-996-256-01 SL(BASE) 569 4-996-257-01 RACK (SL) 570 4-996-263-01 SPRING (CL V), TORSION 571 4-988-560-01 SCREW (+P 1.
56 SECTION 8 ELECTRICAL P ARTS LIST Note: Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark • SEMICONDUCTORS In each case, u: µ , for example: uA...: µ A..., uP A...: µ P A..., uPB...: µ PB..., uPC...: µ PC..., uPD...: µ PD.
57 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark IC152 8-759-430-25 IC BH6511FS-E2 IC171 8-759-487-04 IC BR24C02F-E2 IC181 8-759-481-17 IC MC74ACT08DTR2 IC192 8-759-460-72 .
58 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C102 1-124-779-00 ELECT CHIP 10uF 20% 16V C181 1-126-395-11 ELECT 22uF 20% 16V C182 1-163-017-00 CERAMIC CHIP 0.0047uF 5% 50V C183 1-163-009-11 CERAMIC CHIP 0.001uF 10% 50V C184 1-126-603-11 ELECT CHIP 4.
59 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark P ANEL R189 1-216-037-00 MET AL CHIP 330 5% 1/10W R191 1-216-057-00 MET AL CHIP 2.
60 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < DIODE > D411 8-719-210-39 DIODE EC10QS04-TE12L5 D412 8-719-210-39 DIODE EC10QS04-TE12L5 D421 8-719-210-33 DIODE EC1.
61 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < COIL > L751 1-216-296-91 SHORT 0 L752 1-216-296-91 SHORT 0 L753 1-216-296-91 SHORT 0 < TRANSISTOR > Q751 8-72.
62 Sony Corporation Home A udio Company 9-928-916-11 (SP) 99F0986-1 Printed in Japan © 1999. 6 Published by Quality Assurance Dept. MDS-PC2.
An important point after buying a device Sony MDS-PC2 (or even before the purchase) is to read its user manual. We should do this for several simple reasons:
If you have not bought Sony MDS-PC2 yet, this is a good time to familiarize yourself with the basic data on the product. First of all view first pages of the manual, you can find above. You should find there the most important technical data Sony MDS-PC2 - thus you can check whether the hardware meets your expectations. When delving into next pages of the user manual, Sony MDS-PC2 you will learn all the available features of the product, as well as information on its operation. The information that you get Sony MDS-PC2 will certainly help you make a decision on the purchase.
If you already are a holder of Sony MDS-PC2, but have not read the manual yet, you should do it for the reasons described above. You will learn then if you properly used the available features, and whether you have not made any mistakes, which can shorten the lifetime Sony MDS-PC2.
However, one of the most important roles played by the user manual is to help in solving problems with Sony MDS-PC2. Almost always you will find there Troubleshooting, which are the most frequently occurring failures and malfunctions of the device Sony MDS-PC2 along with tips on how to solve them. Even if you fail to solve the problem, the manual will show you a further procedure – contact to the customer service center or the nearest service center
