Instruction/ maintenance manual of the product MDS-JE630 Sony
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MICROFILM SERVICE MANUAL MINIDISC DECK US Model Canadian Model SPECIFICA TIONS MDS-JE630 U.S. and foreign patents licensed form Dolby Laboratories Licensing Corporation. System MiniDisc digital audio system Disc MiniDisc Laser Semiconductor laser ( λ = 780 nm) Emission duration: continuous Laser output Less than 44.
– 2 – SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers whic h are displayed automatically when errors occur , and error codes which show the err or history in the test mode during servicing.
– 3 – ITEMS OF ERROR HIST OR Y MODE ITEMS AND CONTENTS Selecting the T est Mode Display Details of History E00 No error E01 Disc error . PTOC cannot be read (DISC ejected) E02 Disc error .
– 4 – SECTION 1 SER VICING NO TES SAFETY CHECK-OUT After correcting the original service problem, perform the follo w- ing safety check before releasing the set to the customer: Check the antenna terminals, metal trim, “metallized” knobs, screws, and all other exposed metal par ts for AC leakage.
– 5 – Flexib le Circuit Board Repairing • Kee p the temper ature of the soldering iron around 270 ˚C dur- ing repairing. • Do not touch the soldering iron on the same conductor of the circuit board (within 3 times). • Be careful not to apply force on the conductor when soldering or unsoldering.
– 6 – JIG FOR CHECKING BD BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the wa v eform of the BD board. The names of terminals and the checking items to be performed are sho wn as follows.
– 7 – IOP DA T A RECORDING AND DISPLA Y WHEN OPTICAL PICK-UP AND NON-V OLA TILE MEMOR Y (IC171 OF BD BO ARD) ARE REPLA CED The IOP value labeled on the optical pick-up can be r ecorded in the non-volatile memory . By r ecording the value, it will eliminate the need to look at the value on the optical pic k-up label.
– 8 – CHECKS PRIOR TO PAR TS REPLA CEMENT AND ADJUSTMENTS Before performing repairs, perform the follo wing checks to determine the faulty locations up to a certain extent. Details of the procedures are described in “5 Electrical Adjustments”.
– 9 – [] RETR Y CA USE DISPLA Y MODE • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set.
– 10 – Reading the Retry Cause Display 84218421 b7 b6 b5 b4 b3 b2 b1 b0 00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000 Hexa- decimal Details 01 02 04 08 10 20 40 80 Higher Bits Lower Bits Hexadecimal Bit Binary When 0 Emphasis OFF Monaural This is 2-bit display .
– 11 – SECTION 2 GENERAL This section is e xtracted from instruction manual. • LOCA TION OF CONTROLS – Front P anel – – Rear P anel –.
– 12 –.
– 13 – CASE (408226) FRONT P ANEL SECTION Note: Follow the disassemb ly pr ocedure in the numerical order given. SECTION 3 DISASSEMBL Y 1 two screws (CASE 3 TP2) 2 case (408226) 1 two screws (CASE.
– 14 – MAIN BO ARD MECHANISM DECK SECTION (MDM-5D) 1 wire (flat type) (21 core) (CN341) 6 MAIN board 2 power cord connector (CN901) 3 four screws (BVTT3 × 6) 1 wire (flat type) (23 core) (CN501) .
– 15 – SLIDER (CAM) B ASE UNIT (MBU-5D), BD BO ARD 1 two screws (P2.6x6) 4 bracket (Guide L) 3 leaf spring 2 harnes 6 bracket (Guide R) 7 slider (Cam) 5 two screws (P2.6x6) Set the shaft of Lev er (O/C) to be at the position in the figure. Set the shaft of Cam gear to be at the position in the figure.
– 16 – SW BO ARD , LO ADING MO TOR (M103) 5 three screws (BTP2.6 × 6) 6 SW board 4 loading motor (M103) 3 two screws (PWH1.7 × 4) 1 screw (PTPWH M2.
– 17 – SECTION 4 TEST MODE 1. PRECA UTIONS FOR USE OF TEST MODE • As loading related operations will be performed reg ardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
– 18 – 5. SELECTING THE TEST MODE There are 31 types of test modes as sho wn below . The groups can be switched by turning the [AMS] knob. After selecting the group to be used, press the [YES] b utton.
– 19 – “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” ± ≠ § “CREC MID” n “CREC OUT” n “CREC IN” § ± ≠ 5-1. Operating the Continuous Pla yback Mode 1. Entering the continuous playback mode (1) Set the disc in the unit. (Whichev er recorda ble discs or discs for playback only are av ailable.
– 20 – 6. FUNCTIONS OF O THER BUTT ONS 7. TEST MODE DISPLA YS Each time the [LEVEL/DISPLA Y/CHAR] button is pressed, the display changes in the follo wing or der . 1. Mode display Displays “TEMP ADJUS”, “CPLA YMODE”, etc. 2. Error rate display Displays the error rate in the follo wing way .
– 21 – ( P REC SYNC A.SP ACE O VER B A- TRA CK DISC SLEEP MONO When Off Contents Display When Lit During continuous playback (CL V : ON) T racking ser vo OFF Recording mode ON CL V low speed mode .
– 22 – SECTION 5 ELECTRICAL ADJUSTMENTS 1. P AR TS REPLACEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follo ws. The procedure changes according to the part replaced • Abbre viati.
– 23 – 2. PRECA UTIONS FOR CHECKING LASER DIODE EMISSION T o check the emission of the laser diode during adjustments, nev er view directl y from the top as this may lose your eye-sight.
– 24 – ± ≠ 6. CHECK PRIOR T O REP AIRS These checks are performed before replacing parts according to “approximate specif ications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjust- ments” (See page 8).
– 25 – 9. Press the [YES] button to display “EFB = MO-P”. Then, the optical pick-up mov es to the pit area automatically and serv o is imposed. 10. Observe the wa v eform of the oscilloscope, and check that the specified v alue is satisfied. Do not turn the [AMS] knob .
– 26 – 7. INITIAL SETTING OF ADJUSTMENT V ALUE Note: Mode which sets the adjustment results recorded in the non-v ola tile memory to the initial setting v alue. Howe ver the results of the tempera- ture compensation of fset adjustment will not change to the initial setting value.
– 27 – 7. Then, turn the [AMS] knob to display “LDPWR CHECK” (C02). 8. Press the [YES] button once to display “LD 0.9 mW $ ”. Check that the reading of the laser po wer meter become 0.85 to 0.
– 28 – ± ≠ ± ≠ 8. T urn the [AMS] knob so that the wav eform of the oscilloscope becomes the specified v alue. (When the [AMS] knob is turned, the of “EFB- ” changes and the wa veform changes.
– 29 – 13. ERROR RA TE CHECK 13-1. CD Error Rate Check Checking Procedur e : 1. Load the check disc (MD) TD YS-1. 2. Turn the [AMS] knob and display “CPLA Y MODE” (C30). 3. Press the [YES] button twice and display “CPLA Y MID”.
– 30 – CN110 NO TE D101 I+3V IOP TEO RF VC GND IC171 IC121 IC101 IC192 CN101 Note: It is useful to use the jig. for checking the wa veform. (Refer to Servicing Notes on page 6) – BD BO ARD (Side.
MDS-JE630 – 31 – – 32 – SECTION 6 DIA GRAMS 6-1. BLOCK DIA GRAM – SER V O Section – F C B D A E I J J I B A C D E F DETECTOR J I A B C D E F LD PD LASER DIODE ILCC PD OPTICAL PICK-UP (KMS-260A/J1N) AUTOMATIC POWER CONTROL Q162, 163 APC PD APCREF AT AMP B.
– 33 – – 34 – MDS-JE630 6-2. BLOCK DIA GRAM – MAIN Section – 05 X341 45.1584MHz –1 –2 LED DRIVE Q756 ROTARY ENCODER FL DRIVE Q781, 782 D756 STANDBY A/D, D/A CONVERTER IC321 SDTO ADDT D.
– 35 – Note on Schematic Diagram: • All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified. • % : indicates tolerance.
– 36 – • Cir cuit Boards Location SW board MAIN board KEY SW board DISPLAY board BD board POWER SW board HP board KEY board.
MDS-JE630 – 37 – – 38 – 6-4. PRINTED WIRING BO ARD – BD Board – • See page 36 for Cir cuit Boards Location. • Semiconductor Location Ref. No. Location D101 A-1 D181 D-3 D183 D-3 IC103 B-1 IC123 D-2 IC171 D-1 Q102 B-1 Q103 C-1 Q104 B-1 • Semiconductor Location Ref.
MDS-JE630 – 39 – – 40 – 6-5. SCHEMA TIC DIA GRAM – BD Board (1/2) – • See page 43 for W avef orms. • See pa g e 55 for IC Bloc k Diagrams.
MDS-JE630 (Page 39) 6-6. SCHEMA TIC DIA GRAM – BD Board (2/2) – • See page 43 for W avef orms. • See pa ge 56 for IC Bloc k Diagrams. • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
MDS-JE630 – 43 – – 44 – • W aveforms – BD Board – 1 IC101 1 , 2 (I, J) (Play mode) 5 IC121 @¶ (LRCK) 2 IC101 4 (A) (Play mode) 4 IC121 !§ (OSCI) 6 IC121 @• (XBCK) 0.46 Vp-p 0.1 Vp-p 3 IC101 8 , 9 (E, F) (Play mode) 7 IC121 @ª (FS256) 8 IC121 (º (FS4) 0.
MDS-JE630 – 45 – – 46 – 6-9. PRINTED WIRING BO ARD – MAIN Board – • See page 36 for Circuit Boar ds Location. Ref. No. Location Ref. No. Location • Semiconductor Location D341 F-13 D34.
MDS-JE630 6-10. SCHEMA TIC DIA GRAM – MAIN Boar d (1/2) – • See page 43 for W avef orms. – 47 – – 48 – • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
MDS-JE630 – 49 – – 50 – 6-11. SCHEMA TIC DIA GRAM – MAIN Boar d (2/2) – • See page 43 f or W aveforms. • See page 57 for IC Bloc k Diagrams. • V oltages and wav eforms are dc with respect to ground under no-signal conditions. no mark : PLA Y The components identified by mark ! or dotted line with mark ! are critical for saf ety .
MDS-JE630 6-12. PRINTED WIRING BO ARDS – P ANEL Section – • See page 36 f or Circuit Boards Location. – 51 – – 52 – • Semiconductor Location Ref.
MDS-JE630 6-13. SCHEMA TIC DIA GRAM – P ANEL Section – • See page 43 for Wa veform. • V oltages and wav eforms are dc with respect to ground under no-signal conditions.
– 55 – – 56 – • IC Block Dia grams – BD Boar d – IC101 CXA2523AR IC121 CXD2656R IC152 BH6511FS-E2 –1 –2 + – IVR BB + – IVR AA + – IVR CC + – IVR DD + – IVR + – EE EE&apos.
– 57 – – MAIN Board – IC310 M5293L IC321 AK4524 IC431 LA5632 IC471 LB1641 2 5 5k + – 27k OVERCURRENT LIMITTER OVERHEAT PROTECTION REFERENCE VOLTAGE GND ON/OFF IN REFERENCE VOLTAGE OUT 3 4 1 .
– 58 – 6-14. IC PIN FUNCTION DESCRIPTION • BD BOARD IC101 CXA2523AR (RF AMP, FOCUS/TRACKING ERROR AMP) Pin No. Pin Name I/O Description 1I I I-V converted RF signal I input from the optical pick-up block detector 2J I I-V converted RF signal J input from the optical pick-up block detector 3V C O Middle point voltage (+1.
– 59 – • BD BOARD IC121 CXD2656R Pin No. Pin Name I/O Description 1 MNT0 (FOK) O Focus OK signal output to the system controller (IC501) “H” is output when focus is on (“L”: NG) 2 MNT1 (.
– 60 – Pin No. Pin Name I/O Description 46 XRAS O Row address strobe signal output to the D-RAM (IC124) “L” active 47 XWE O Write enable signal output to the D-RAM (IC124) “L” active 48 D1.
– 61 – Pin No. Pin Name I/O Description 91 SRDR O Sled servo drive PWM signal (–) output to the BH6511FS (IC152) 92 SFDR O Sled servo drive PWM signal (+) output to the BH6511FS (IC152) 93 SPRD .
– 62 – • MAIN BOARD IC501 M30624MG-223FP (SYSTEM CONTROLLER) Pin No. Pin Name I/O Description 1, 2 NC O Not used (open) 3C 1 O Monitor output terminal for the test C1 error rate is output when t.
– 63 – Pin No. Pin Name I/O Description 50 STB O Strobe signal output to the power supply circuit “L”: standby mode, “H”: power on 51 CHACK IN I Detection input from the disc chucking-in d.
– 64 – Pin No. Pin Name I/O Description 79 SCL O Clock signal output to the EEPROM (IC171) 80 SCTX O Recording data output enable signal output to the CXD2656R (IC121) and overwrite head driver (I.
– 65 – (1) CHASSIS SECTION SECTION 7 EXPLODED VIEWS Les composants identifiés par une marque ! sont critiquens pour la sécurité. Ne les remplacer que par une pièce portant le numéro spécifié. The components identified by mark ! or dotted line with mark ! are critical for safety .
– 66 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark (2) FR ONT P ANEL SECTION 51 4-996-691-12 WINDOW (FL) 52 A-4672-565-A KNOB (AMS) ASSY 53 3-354-981-01 SPRING (SUS),.
– 67 – (3) MECHANISM SECTION (MDM-5D) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 215 4-996-227-01 LEVER (HEAD) 216 4-996-229-01 SPRING (HEAD LEVER), TORSION 217 4-99.
– 68 – (4) B ASE UNIT SECTION (MBU-5D) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 251 A-4724-637-A BD BOARD, COMPLETE 252 3-372-761-01 SCREW (M1.
– 69 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark BD A-4724-637-A BD BOARD, COMPLETE ******************* < CAP ACITOR > C101 1-125-822-11 T ANT ALUM 10uF 20% 10V C102 1-163-038-00 CERAMIC CHIP 0.
– 70 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark < COIL/SHORT > L101 1-414-813-11 FERRITE 0uH L102 1-414-813-11 FERRITE 0uH L103 1-414-813-11 FERRITE 0uH L105.
– 71 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C776 1-162-294-31 CERAMIC 0.001uF 10% 50V C781 1-162-294-31 CERAMIC 0.001uF 10% 50V C782 1-164-159-11 CERAMIC 0.1uF 50V C783 1-162-294-31 CERAMIC 0.001uF 10% 50V C787 1-164-159-11 CERAMIC 0.
– 72 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C748 1-164-159-11 CERAMIC 0.1uF 50V C799 1-124-261-00 ELECT 10uF 20% 50V < CONNECTOR > CN701 1-779-556-11 CON.
– 73 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C435 1-126-964-11 ELECT 10uF 20% 50V C436 1-164-159-11 CERAMIC 0.1uF 50V C437 1-164-159-11 CERAMIC 0.1uF 50V C438 1-126-934-11 ELECT 220uF 20% 10V C439 1-126-926-11 ELECT 1000uF 20% 10V C440 1-126-964-11 ELECT 10uF 20% 50V C441 1-164-159-11 CERAMIC 0.
– 74 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark L349 1-410-397-21 FERRITE BEAD INDUCTOR L350 1-410-397-21 FERRITE BEAD INDUCTOR L411 1-414-747-11 INDUCTOR 0uH L412 1-414-747-11 INDUCTOR 0uH L611 1-410-509-11 INDUCTOR 10uH L661 1-410-509-11 INDUCTOR 10uH L801 1-410-324-11 INDUCTOR 4.
– 75 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R550 1-249-429-11 CARBON 10K 5% 1/4W R551 1-249-429-11 CARBON 10K 5% 1/4W R553 1-249-429-11 CARBON 10K 5% 1/4W R559.
– 76 – Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark #7 7-685-133-19 SCREW (DIA. 2.6) (IT3B) #8 7-685-871-01 SCREW +BVTT 3X6 (S) ***************************************.
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However, one of the most important roles played by the user manual is to help in solving problems with Sony MDS-JE630. Almost always you will find there Troubleshooting, which are the most frequently occurring failures and malfunctions of the device Sony MDS-JE630 along with tips on how to solve them. Even if you fail to solve the problem, the manual will show you a further procedure – contact to the customer service center or the nearest service center
