Instruction/ maintenance manual of the product MDR-IF4000 Sony
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MDR-IF4000 US Model Canadian Model AEP Model E Model SERVICE MANUAL CORDLESS STEREO HEADPHONE Sony Corporation Per sonal A udio Company Published by Son y Engineering Corporation 9-879-301-02 2005B02-1 © 2005.02 SPECIFICA TIONS Ve r. 1.1 2005. 02 General Modulation System DQPSK-IM Secondary carrier wave frequency 3.
2 MDR-IF4000 T ABLE OF CONTENTS Specifications ............................................................................ 1 1. GENERAL ................................................................... 3 2. DISASSEMBL Y 2-1. Disassembly Flow ......
3 MDR-IF4000 SECTION 1 GENERAL This section is extracted from instruction manual. LOCA TING THE CONTROLS 1 Ear pad (left) 2 Battery case button 3 Battery case 4 Infrared sensor 5 Self-adjusting band 6.
4 MDR-IF4000 SECTION 2 DISASSEMBL Y Note: Follow the disassembly procedure in the numerical order given. 2-2. FRONT PLA TE (R) ASSY • This set can be disassembled in the order shown below . 2-1. DISASSEMBL Y FLO W 2-2. FRONT PLA TE (R) ASSY (P age 4) 2-6.
5 MDR-IF4000 2-3. RX B A ORD 2-4. HANGER (R) 2 1 Removal the solder at 9 places. 3 RX board Note for installation : Solder the leads at the places shown below with attention to their colors.
6 MDR-IF4000 2-5. WIRING ON THE RIGHT SIDE 2-6. FRONT PLA TE (L) ASSY RD1 board (R-CH front) RD2 board (R-CH rear) 1 ear pad (L) 4 Removal the solder at 2 places.
7 MDR-IF4000 2-7. B A TT BO ARD 2-8. HANGER (L) 3 4 BATT board 1 Removal the solder at 4 places. 2 two screws (P 2.6x6) to RX board to RX board to SW board to driver (L-CH) housing (L) assy Note for installation : Solder the leads at the places shown below with attention to their colors.
8 MDR-IF4000 2-9. WIRING ON THE LEFT SIDE 2-10. HANGER LID (L) RD2 board (L-CH front) RD1 board (L-CH rear) 3 head band hanger lid (L) 1 screw (P2.6 x 6) 2 screw (P2.
9 MDR-IF4000 2-11. WIRING ON THE SW BO ARD 2-12. HO W T O HANG THE TENSION SPRING head ban d cushion (B) SW board SW board suspender assy suspender assy S701 housing (L) assy hanger lid (L) tension spring Note for installation : Insert the end of the suspender assy under the S701 on SW board.
10 MDR-IF4000 SECTION 3 DIA GRAMS For schematic diagrams. Note: • All capacitors are in µ F unless otherwise noted. (p: pF) 50 WV or less are not indicated except for electrolytics and tantalums. • All resistors are in Ω and 1 / 4 W or less unless otherwise specified.
MDR-IF4000 11 11 MDR-IF4000 3-2. BLOCK DIA GRAM 31 16 60 2 54 3 59 1 10 5 16 I/V AMP IN ADIN SCKI DATA BCK LRCK PD +2.5V IC102 RESET OUT DAOUT/ ROUT BCK/RCLK LRCK/RCS 8 4 VOUTR 4 13 XRST 61 DTVALID AP.
MDR-IF4000 12 12 MDR-IF4000 3-3. PRINTED WIRING BO ARD – RECEIVER SECTION – : Uses unleaded solder . 1 3 5 4 1 12 24 13 17 32 64 49 33 48 16 1 1 8 16 9 1 4 8 5 1 4 8 5 E E E 1 3 5 4 +B SIG +B +B +.
MDR-IF4000 13 13 MDR-IF4000 3-4. PRINTED WIRING BO ARD – PO WER SECTION – : Uses unleaded solder . E E 1 1 1 3 5 4 3 5 4 3 IC601 R603 R601 RED RED RED RED Q602 D601 C604 C603 Q601 R602 R604 C506 L502 C510 C511 C507 C508 R503 C513 C516 C514 CHG (+) BATT (+) CHARGE TERMINAL CHG ( - ) C602 C504 IC502 C505 IC503 C605 D501 C503 2.
MDR-IF4000 14 14 MDR-IF4000 3-5. SCHEMA TIC DIA GRAM – RECEIVER SECTION – TP004 S601 D601 S 602 NIM H 1 N IM H 2 C605 C604 C602 R 602 R603 R 601 R604 C603 C504 C505 L501 D 501 C503 C510 L502 C506 .
15 MDR-IF4000 • IC BLOCK DIA GRAMS IC101 CXD4017R TEST7 SYMCLK ICLK XTST TESTMD PLVAR VSS APVCI APAVD APCPO APAVS VDDI VSS VCOR VDDE CHNUM DIVCODE PLREF 33 30 29 28 27 26 25 24 23 22 21 20 19 18 17 .
16 MDR-IF4000 IC001 CXA3668N-T4 14 15 16 17 18 19 20 21 22 23 24 DIVCODE GNDO 13 VCCS OUT VCCO DET GND2 A GCCAP2 AGCIREF2 VCC2 A GCIREF3 A GCCAP1 11 10 9 8 7 6 5 4 3 2 1 VOUT15 GNDR 12 VREGIN GNDR GNDS A GCIN GNDI IN VCCI SIS GNDMOS A GCIREF1 BIAS FWR S/D CONV GCA PREAMP OUTPUT_AMP FWR COMP 0 0 180 180 I/V AMP GNDMOS CONT LPF fc = 6MHz 4.
17 MDR-IF4000 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks SECTION 4 EXPLODED VIEWS 4-1. HOUSING (L) ASSY SECTION NO TE: • -XX, -X mean standardized parts, so they may have some differences from the original one. • Items marked “*” are not stocked since they are seldom required for routine service.
18 MDR-IF4000 4-2. HOUSING (R) ASSY SECTION Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks 51 3-246-154-13 PAD (R), EAR 52 X-2024-575-1 PLA TE (R) SUB ASSY , FRONT 53 A-1083-890-A RX BOARD, COMPLETE 54 3-253-143-01 SCREW (B2.
19 MDR-IF4000 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks NO TE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set. • -XX, -X mean standardized parts, so they may have some difference from the original one.
20 MDR-IF4000 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks C005 1-124-779-00 ELECT CHIP 10uF 20% 16V C006 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C007 1-107-826-11 CERAMIC CHIP 0.1uF 10% 16V C008 1-107-826-11 CERAMIC CHIP 0.
21 MDR-IF4000 Ref. No. Part No. Description Remarks R102 1-216-821-11 MET AL CHIP 1K 5% 1/10W R103 1-216-821-11 MET AL CHIP 1K 5% 1/10W R104 1-218-664-11 MET AL CHIP 68 0.5% 1/10W R106 1-216-833-11 MET AL CHIP 10K 5% 1/10W R107 1-216-833-11 MET AL CHIP 10K 5% 1/10W R108 1-216-821-11 MET AL CHIP 1K 5% 1/10W R109 1-216-827-11 MET AL CHIP 3.
22 MDR-IF4000 MEMO.
SERVICE MANUAL SUPPLEMENT - 1 File this Supplement with the Service Manual. Subject : SUFFIX CHANGE OF RX BO ARD US Model Canadian Model AEP Model E Model Ve r.
MDR-IF4000 24 • CHANGE OF RX BO ARD The RX board was changed into suffix-12. Printed wiring board and schematic diagram of new type, and changed parts list are described in this Supplement-1. Refer to original service manual (9-879-301-02) previously issued for the other information.
MDR-IF4000 25 25 MDR-IF4000 PRINTED WIRING BO ARD – RECEIVER SECTION – Suffix-12 : Uses unleaded solder . Ref. No. Location D101 A-3 D102 A-3 D103 A-2 D104 C-3 D401 C-9 D402 C-9 D403 D-9 D404 D-9 .
MDR-IF4000 26 26 MDR-IF4000 SCHEMA TIC DIA GRAM – RECEIVER SECTION – Suffix-12 TP004 S601 D601 S602 N IM H 1 N IM H2 C605 C604 C602 R602 R 603 R601 R 604 C603 C 504 C505 L501 100uH D501 C503 C510 L502 4.
27 MDR-IF4000 ELECTRICAL P ARTS LIST Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks NO TE: • Due to standardization, replacements in the parts list may be different from the parts specified in the diagrams or the components used on the set.
28 MDR-IF4000 Ref. No. Part No. Description Remarks Ref. No. Part No. Description Remarks < IC > IC001 8-753-208-23 IC CXA3668N-T4 IC101 8-752-425-06 IC CXD4017R IC102 6-707-193-01 IC BU4223G-TR.
29 MDR-IF4000 MEMO.
MDR-IF4000 REVISION HIST OR Y Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. Ve r. Date Description of Revision 1.0 2004.1 1 New 1.
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