Instruction/ maintenance manual of the product HCD-MD373 Sony
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1 HCD-MD373 SPECIFICA TIONS SERVICE MANUAL COMP ACT DISC DECK RECEIVER — Continued on ne xt page — AEP Model UK Model E Model A ustr alian Model Chinese Model T our ist Model Model Name Using Simi.
2 SELF-DIA GNOSIS FUNCTION The self-diagnosis function consists of error codes for customers which are displayed automatically when errors occur , and error codes which show the error history in the test mode during servicing. For details on how to view error codes for the customer , refer to the following box in the instruction manual.
3 ITEMS OF ERROR HIST ORY MODE ITEMS AND CONTENTS Selecting the T est Mode Display total rec total play retry err total err err history er refresh tm refresh Details of History No error Read error .
4 CA UTION Use of controls or adjustments or performance of procedures other than those specified herein may result in hazardous ra- diation exposure. MODEL IDENTIFICA TION — BA CK P ANEL — SAFETY.
5 1. SERVICING NO TE .......................................................... 6 2. GENERAL ........................................................................ 16 3. DISASSEMBL Y 3-1. Case ........................................................
6 SECTION 1 SER VICING NO TE T ra y (CDM) Mov e the Cam bloc k in the direction of arrow with a finger . 4 P anel board 2 Nut 1 Knob (V OL) 5 Ring (V OL) (Remov e the two cla ws from the F ront panel back side.
7 MD mechanism deck CD mechanism deck Main board P ower board Amp board CN802 Extension cable (4P) (J-2501-042-A) Extension cable (3P) (J-2501-045-A) CN993 SER VICE POSITION THE MD MECHANISM SER VICE .
8 Cold Reset • The cold reset clears all data inculuding preset data stored in the RAM to initial conditions. Execute this mode when returning the set to the customer . Pr ocedur e 1: (recommended) Press the RESET button on the back panel. Pr ocedure 2: 1.
9 Aging Mode • Mode for repeating operations of the CD player automatically . When errors occur: Aging stops and a message indicating that an error has occurred such as “CD MEC ERR” is displayed. (For details of errors, refer to “Error History Display Mode”.
10 • Reading the Mechanism Err or History Display (T o switch the history , press the PLA Y MODE/TUNING MODE button.) Display E@@M**#*$* @@: Error number .
11 JIG FOR CHECKING BD (MD) BO ARD W A VEFORM The special jig (J-2501-149-A) is useful for checking the waveform of the BD (MD) board. The names of terminals and the checking items to be performed are shown as follows.
12 IOP DA T A RECORDING AND DISPLA Y WHEN OPTICAL PICK-UP AND NON-V OLA TILE MEMOR Y (IC171 OF BD (MD) BO ARD) ARE REPLA CED The IOP value labeled on the optical pick-up can be recorded in the non-volatile memory . By recording the value, it will eliminate the need to look at the value on the label of the optical pick-up.
13 • 0.9 mW power Specified value : 0.84 to 0.92 mW • 7.0 mW power Specified value : 6.8 to 7.2 mW lop (at 7mW) • Labeled on the optical pickup Iop value ± 10mA • T raverse waveform Specified.
14 RETR Y CA USE DISPLA Y MODE • In this test mode, the causes for retry of the unit during recording can be displayed on the fluorescent indicator tube. During playback, the “track mode” for obtaining track information will be set. This is useful for locating the faulty part of the unit.
15 Hexadecimal Bit Binary Higher Bits Lower Bits 84218421 b7 b6 b5 b4 b3 b2 b1 b0 00000001 00000010 00000100 00001000 00010000 00100000 01000000 10000000 Hexa- decimal Details 01 02 04 08 10 20 40 80 Emphasis OFF Monaural This is 2-bit display . Normally 01.
16 LOCA TION OF PAR TS AND CONTROLS 1 1/u (power) switch 2 MD slot 3 6 (Eject) (MD) button 4 MD indicator 5 (P (MD) button 6 p (MD) button 7 VOLUME (CD) knob 8 (P (CD) button 9 p (CD) button 10 TUNER/.
17 This section is extracted from instruction manual..
18.
19 SECTION 3 DISASSEMBL Y Note: Follow the disassembly procedure in the numerical order given. 3-1. CASE Note: Follow the disassembly procedure in the numerical order given.
20 3-3. BA CK P ANEL 3-2. FRONT P ANEL 1 Flat type wire (25 core) 5 Screw (BVTT 3x10) 6 Screw (BVTT 3x6) 8 Screw (BVTT 3x6) 9 Screw (BVTT 3x6) 7 F ront panel b lock (T wo cla ws) 0 MD mechanism bloc k.
21 3-4. MAIN BO ARD AND PO WER TRANSFORMER Main board SP board P ower board Amp board (CN801) 1 Flat type wire (19 core) 2 Flat type wire (15 core) 7 Screw (BVTP 3x6) 8 Screw (BVTP 3x6) 9 T wo screws .
22 3-6. TRA Y , GEAR AND CAM 4 Belt (CDM55) 6 Pulley (LDG) 9 Gear (A) 8 Gear (B) 7 Roller 2 Push the claw in tne direction of arrow C . 0 Cam (CDM55) 3 Pull out the tra y . 5 Bushing C A B B Release 1 Pull out the tray in the arrow direction A , and release the lock while pressing this claw in the arrow direction B .
23 3-9. BD (CD) BOARD , SPINDLE MO T OR (M101) AND SLED MO TOR (M102) IC102 IC101 M101 M102 IC103 2 Remov e the f our solders. 1 Screw (BVTP 2.6x8) !¡ Spindle motor (M101) 5 Sled motor (M102) 0 Sled shaft 6 Gear (M) 7 Flatness gear (P) 8 T wo Insulators (BU) 9 T wo Insulators (BU) 4 T wo screws (P 2x3) 3 BD (CD) board 3-10.
24 3-12. BASE UNIT (MB U-5A) AND BD (MD) BO ARD • Note for installation of Slider (CAM) Set the shaft of Cam gear to be at the position in the figure. Set the shaft of Lev er (O/C) to be at the position in the figure. 6 Slider (CAM) 2 Brack et (GUIDE L) 5 Brack et (GUIDE R) 4 T wo screws (BTP 2.
25 3-13. O VER WRITE HEAD 1 Flexib le board 2 Screw (P 1.7x6) 3 Over write head (HR901) 3-14. OPTICAL PICK-UP OF MD (KMS-260B/J1N) 1 Screw (B 2x8) 3 Main shaft 2 Leaf spring (SHAFT) 4 Flexib le board 5 Optical pick-up (f or MD) 3-15.
26 SECTION 4 TEST MODE 4-1. PRECA UTIONS FOR USE OF TEST MODE • As loading related operations will be performed regardless of the test mode operations being performed, be sure to check that the disc is stopped before setting and removing it.
27 4-5. SELECTING THE TEST MODE There are 31 types of test modes as shown below . The groups can be switched by pressing the =0 /MD/CD/TUNING – button or )+ /MD/CD/TUNING + button. After selecting the group to be used, press the ENTER/YES “R” button.
28 “CPLAY MID” n “CPLAY OUT” n “CPLAY IN” 4-5-1. Operating the Continuous Playback Mode 1. Entering the continuous playback mode 1 Set the disc in the unit. (Whichever recordable discs or discs for playback only are available.) 2 Press the =0 /MD/CD/TUNING – button or )+ /MD/CD/TUNING + button and display “CPLA Y MODE”.
29 4-6. FUNCTIONS OF OTHER B UTT ONS Contents Sets continuous playback when pressed in the STOP state. When pressed during continuous playback, the tracking servo turns ON/OFF . Stops continuous playback and continuous recording. The sled moves to the outer circumference only when this is pressed.
30 ( (MD) * P (MD) * r REC * SYNC LEVEL-SYNC OVER 1 REPEA T TRACK DISC SHUFFLE MONO When Off Contents Display When Lit During continuous playback (CL V : ON) T racking servo OFF Recording mode ON CL V.
31 MD SECTION 5-1. PARTS REPLA CEMENT AND ADJUSTMENT • Check and adjust the MDM and MBU as follows. The procedure changes according to the part replaced SECTION 5 ELECTRICAL ADJUSTMENTS • Abbrevia.
32 5-2. PRECAUTIONS FOR CHECKING LASER DIODE EMISSINON T o check the emission of the laser diode during adjustments, never view directly from the top as this may lose your eye-sight.
33 5-6. CHECKS PRIOR TO REP AIRS These checks are performed before replacing parts according to “approximate specifications” to determine the faulty locations. For details, refer to “Checks Prior to Parts Replacement and Adjustments” (See page 13).
34 9. Press the ENTER/YES “R” button display “EFB = MO-P”. Then, the optical pick-up moves to the pit area automatically and servo is imposed. 10. Observe the waveform of the oscilloscope, and check that the specified value is satisfied. Do not press the =0 /MD/CD TUNING– button or )+ /MD/CD/TUNING+ button.
35 8. “C1 = AD = ” will be displayed. 9. Check that the C1 error becomes below 80 and the AD error below 2. 10. Press the MENU/NO “R” button to stop playback, and press the 6 (MD) button and remove the disc.
36 KMS 260A 27X40 B0825 N Iop = 82.5 mA in this case Iop (mA) = Digital voltmeter reading (mV)/1 ( Ω ) 5. Then “LD 7.0 mW $ ” will be displayed. 6. Press the =0 /MD/CD/TUNING – button or )+ / MD/CD/TUNING + button so that the reading of the laser power meter becomes 6.
37 9. Press the ENTER/YES “R” button, and save the adjustment results in the non-volatile memory . (“EFB = SA VE” will be displayed for a moment.) 10. “EFB = MO-P”. will be displayed. The optical pick-up moves to the pit area automatically and servo is imposed.
38 5-13. ERROR RA TE CHECK 5-13-1. CD Error Rate Check Checking Procedur e : 1. Load a check disc (MD) TDYS-1. 2. Press the =0 /MD/CD/TUNING – button or )+ / MD/CD/TUNING + button and display “CPLA Y MODE”. 3. Press the ENTER/YES “R” button twice and display “CPLA Y MID”.
39 39 NO TE: It is useful to use the jig. for checking the waveform. (Refer to Servicing Note on page 11.) [BD (MD) BO ARD] (SIDE B) CN110 NO TE D101 I+3V IOP TE VC GND IC171 IC121 IC101 IC192 CN101 RF 5-15. ADJUSTING POINTS AND CONNECTING POINTS [BD (MD) BO ARD] (SIDE A) CD SECTION Note: 1.
HCD-MD373 40 40 SECTION 6 DIA GRAMS 6-1. CIRCUIT BO ARDS LOCA TION TUNER UNIT i s supplied as the assembled block. SP board Amp board P ower board MD digital board P anel board T uner unit Main board .
HCD-MD373 41 41 6-2. BLOCK DIA GRAMS – BD (CD) SECTION – E F A B C D A C RF FF TE D B E F LD PD VCC VC RF SUMMING AMP FOCUS ERROR AMP TRACKING ERROR AMP LD DRIVE Q101 VC BUFFER INTEG- RATOR RF EQ .
HCD-MD373 42 42 – BD (MD) SECTION (1/2) – HR901 OVER WRITE HEAD HEAD DRIVE Q181,182 3 6 1 2 FILTER PCO FILI FILO CLTV PLL EFM, ACIRC, ENCODER/ DECODER RF AGC & EQ AGCI RFO MORFI MORFO RF AMP 1.
HCD-MD373 43 43 – BD (MD) SECTION (2/2) – 27 73 72 17 16 18 12 19 4 2 26 14 13 24 15 80 79 75 78 82 81 35 37 36 58 63 66 53 51 59 57 74 60 54 65 67 88 56 55 77 87 69 22 21 15 13 12 18 ADDT BCK LRC.
HCD-MD373 44 44 – MAIN SECTION – BUFFER Q401 MUX RDATA RCLK X1 X0 X401 4.332 MHz RDS DECODER IC401 X401 4.332 MHz AEP, UK STEREO TUNED DO DI CLK CE MUTE 50 51 54 53 55 52 49 6 9 10 B SELECT SWITCH.
HCD-MD373 45 45 • Indication of transistor THIS NO TE IS COMMON FOR PRINTED WIRING BO ARDS AND SCHEMA TIC DIAGRAMS. (In addition to this, the necessary note is printed in each bloc k.) For schematic diagrams. Note: • All capacitors are in µF unless otherwise noted.
HCD-MD373 46 46 6-3. PRINTED WIRING BO ARD – BD (CD) SECTION – • See page 40 for Cir cuit Boards Location. (Page 52) MAIN BOARD TP (VC) TP (RF) TP (AGC CON) TP (FE) TP (TE) TP (TEI).
HCD-MD373 47 47 6-4. SCHEMA TIC DIA GRAM – BD (CD) SECTION – • See page 45 f or W avef orms. • See page 67 f or IC Block Dia grams. • See page 69 f or IC Pin Functions.
HCD-MD373 48 48 6-5. PRINTED WIRING BO ARD – BD (MD) SECTION – • See page 40 for Cir cuit Boards Location. IC101 A-3 IC121 C-3 IC124 C-3 IC152 B-1 IC181 C-1 IC192 C-1 Q101 B-3 Q162 B-3 Q163 B-3 Q181 C-2 Q182 C-2 Ref.
HCD-MD373 49 49 (Page 50) (Page 50) (Page 50) (Page 50) (Page 50) (Page 50) (Page 50) 6-6. SCHEMA TIC DIA GRAM – BD (MD) SECTION (1/2) – • See page 45 for W aveforms.
HCD-MD373 50 50 6-7. SCHEMA TIC DIA GRAM – BD (MD) SECTION (2/2) – • See page 45 for W aveforms. • See page 48 for Printed Wiring Board. • See page 66 for IC Bloc k Dia grams.
HCD-MD373 51 51 6-9. PRINTED WIRING BO ARD – SP SECTION – • See page 40 for Cir cuit Boar ds Location. 6-8. SCHEMA TIC DIA GRAM – SP SECTION – (Page 59) (Page 52) SPEAKER R L (Page 53) (Page.
HCD-MD373 52 52 6-10. PRINTED WIRING BO ARD – MAIN SECTION – • See page 40 for Cir cuit Boards Location. Ref. No. Location • Semiconductor Location D171 E-2 D301 C-10 D302 C-9 D901 B-7 D911 D-.
HCD-MD373 53 53 6-11. SCHEMA TIC DIA GRAM – MAIN SECTION (1/3) – • See page 68 for IC Bloc k Diagrams. (Page 55) (Page 54) (Page 54) (Page 55) (Page 54) (Page 51).
HCD-MD373 54 54 6-12. SCHEMA TIC DIA GRAM – MAIN SECTION (2/3) – • See page 52 for Printed Wiring Board. • See page 68 for IC Bloc k Diagrams. (Page 62) (Page 55) (Page 55) (Page 55) (Page 55).
HCD-MD373 55 55 6-13. SCHEMA TIC DIA GRAM – MAIN SECTION (3/3) – • See page 45 for W aveforms. • See page 52 for Printed Wiring Board. • See page 68 for IC Bloc k Diagrams.
HCD-MD373 56 56 6-14. SCHEMA TIC DIA GRAM – MD DIGIT AL SECTION – • See page 45 for W aveforms. • See page 67 for IC Bloc k Diagrams. (Page 54) (Page 64) (Page 50) (Page 50).
HCD-MD373 57 57 6-15. PRINTED WIRING BO ARD – MD DIGIT AL SECTION – • See page 40 for Cir cuit Boards Location. (Page 48) (Page 48) (Page 64) (Page 52).
HCD-MD373 58 58 6-16. SCHEMA TIC DIA GRAM – AMP SECTION – (Page 51) (Page 62).
HCD-MD373 59 59 6-17. PRINTED WIRING BO ARD – AMP SECTION – • See page 40 for Cir cuit Boar ds Location. (Page 51) (Page 63).
HCD-MD373 60 60 6-18. SCHEMA TIC DIA GRAM – P ANEL SECTION – (Page 55).
HCD-MD373 61 61 6-19. PRINTED WIRING BO ARD – P ANEL SECTION – • See page 40 for Cir cuit Boards Location. Ref. No. Location • Semiconductor Location D602 A-2 D603 A-2 D604 E-4 D605 A-3 D606 D.
HCD-MD373 62 62 6-20. SCHEMA TIC DIA GRAM – PO WER SECTION – (Page 58) (Page 54).
HCD-MD373 63 63 6-21. PRINTED WIRING BO ARD – PO WER SECTION – • See page 40 for Cir cuit Boards Location. Ref. No. Location • Semiconductor Location D971 B-3 D972 B-2 D973 B-3 D974 B-2 D975 A.
HCD-MD373 64 64 6-22. SCHEMA TIC DIA GRAM – BD SWITCH SECTION – 6-23. PRINTED WIRING BO ARD – BD SWITCH SECTION – • See page 40 for Cir cuit Boards Location. 6-24. SCHEMA TIC DIA GRAM – LO ADING SECTION – 6-25. PRINTED WIRING BO ARD – LO ADING SECTION – • See page 40 f or Cir cuit Boards Location.
65 6-26. IC BLOCK DIA GRAMS • BD (MD) Board (1/2) IC101 CXA2523AR –1 –2 + – IVR BB + – IVR AA + – IVR CC + – IVR DD + – IVR + – EE EE' EFB TESW PTGR 48 MORFO 47 MORFI 46 RFO 45 .
66 32 31 30 29 28 27 26 25 24 23 22 21 20 19 18 17 123456789 10 11 12 13 14 15 16 GND VG IN4R IN4F VM4 OUT4F PGND4 OUT4R VM34 OUT3R PGND3 OUT3F VM3 IN3F IN3R PSB CAPA– CAPA+ IN2R IN2F VM2 OUT2F PGND2 OUT2R VM12 OUT1R PGND1 OUT1F VM1 IN1F IN1R V DD CHARGE PUMP.
67 • BD (CD) Board IC101 CXD2587Q TE RFDC CE IGEN AVSS0 ADIO AVDD0 CLTV FILO AVSS3 VSS AVDD3 DOUT VDD PCO FILI ASYO ASYI RFAC BIAS SSTP DFCT MIRR MDP LOCK FOK SFDR VSS TEST FRDR FE VC COUT SE XTSL T.
68 1 2 3 4 5 6 7 8 9 10 GND MOTOR DRIVE NOISE FILTER CLAMP FWD.IN REV.IN VCC 1 VCC 2 NOISE FILTER MOTOR DRIVE MOTOR DRIVE MOTOR DRIVE T.S.D O.C.P FWD/REV/STOP CONTROL LOGIC 1 2 3 4 5 6 7 8 16 15 14 13.
69 6-27. IC PIN FUNCTIONS • IC101 DIGIT AL SIGNAL PROCESSOR (CXD2587Q) (BD(CD) boar d) SQSO SQCK XRST SYSM DA T A XLA T CLOK SENS SCLK VDD A TSK SPOA SPOB XLON WFCK XUGF XPCK GFS C2PO SCOR COUT MIRR.
70 • Abbreviation EFM : Eight to Fourteen Modulation PLL : Phase Locked Loop Pin No. Pin Name I/O Function TE CE RFDC ADIO A VSS0 IGEN A VDD0 ASYO ASYI BIAS RF AC A VSS3 CL TV FILO FILI PCO A VDD3 V.
71 • IC101 RF Amplifier (CXA2523AR) (BD(MD) board) Pin No. Pin Name I/O Function I J VC A to F PD APC APCREF GND TEMPI TEMPR SWDT SCLK XLA T XSTBY F0CNT VREF EQADJ 3T ADJ Vcc WBLADJ TE CSLED SE ADFM.
72 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 to 34 35 36 to 40 41 42 43 44 45 46 47 • IC121 Digital Signal Processor , Digital Serv o Signal Processor , EFM/A CIRC Encoder/Decoder , Shoc k-proof Memory Controller , A TRAC Encoder/Decoder , 2M Bit DRAM (CXD2654R) (BD (MD) board) Function Pin No.
73 Function Pin No. Pin Name I/O 48 49 50, 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 D1 D0 D2, D3 MVCI ASYO ASYI A VDD BIAS RFI A VSS PCO.
74 Function Pin No. Pin Name I/O 86 87 88 89 90 91 92 93 94 95 96 to 98 99 100 TFDR DVDD FFDR FRDR FS4 SRDR SFDR SPRD SPFD FGIN TEST1 to TEST3 DVSS EFMO O — O O O O O O O I (S) I — O T racking servo drive PWM output (+) +3V power supply (Digital) Focus servo drive PWM output (+) Focus servo drive PWM output (–) 176.
75 • IC501 MASTER CONTROL (M30620ECFP-A21) (MAIN boar d) Pin No. Pin Name I/O Function 1 STK-POWER O Power amp ON/OFF signal output 2 P O Power ON/OFF signal output (Not used) 3 F-R Y O Front speake.
76 Pin No. Pin Name I/O Function 50 STEREO I Stereo signal input from the tuner 51 TUNED I T uned signal input from the tuner 52 ST -CE O Tuner chip enable output 53 ST -DOUT O T uner data output 54 S.
77 SECTION 7 EXPLODED VIEWS 7-1. CASE AND FRONT P ANEL SECTION NOTE: • Items marked “*” are not stocked since they are seldom required for routine service. Some delay should be anticipated when ordering these items. • The mechanical parts with no reference number in the exploded views are not supplied.
78 7-2. CHASSIS SECTION Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 51 A-4426-076-A AMP BOARD, COMPLETE 52 A-4426-081-A POWER BOARD, COMPLETE (AEP ,UK) 52 A-4426-088-A PO.
79 7-3. MD MECHANISM DECK (MDM-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 101 1-668-111-11 SW BOARD * 102 4-996-217-01 CHASSIS 103 4-996-223-01 INSULA TOR (F) * 10.
80 7-4. MD BASE UNIT (MBU-5A) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark * 151 A-4699-893-A BD (MD) BOARD, COMPLETE 152 3-372-761-01 SCREW (M1.
81 7-5. CD MECHANISM DECK (CDM55A-5SBD32) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 201 4-925-315-31 DAMPER 202 1-674-336-11 LOADING BOARD 203 4-220-231-01 TRA Y (CDM) .
82 7-6. CD BASE UNIT (BU-5SBD32) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 251 4-951-620-01 SCREW (2.6X8), +BVTP * 252 A-4724-375-A BD (CD) BOARD, COMPLETE 253 4-917-56.
83 7-7. CD MECHANISM DECK (CDM55C-5BD32) Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark 301 302 303 304 305 306 307 308 309 310 311 313 314 315 316 317 318 319 M103 S1 BU-5B.
84 7-8. CD BASE UNIT (BU-5BD32) Ref. No. Ref. No. 351 * 352 353 354 ! 355 356 357 358 M101 M102 The components identified by mark ! or dotted line with mark ! are critical for safety .
8 5 • CAP ACITORS uF : µ F • COILS uH : µ H • Abbreviation HK : Hong Kong model SP : Singapore model MY : Malaysia model AR : Ar gentine model AUS : Australian model KR : Korea model CH : Chin.
8 6 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R853 1-249-437-11 CARBON 47K 5% 1/4W R854 1-249-437-11 CARBON 47K 5% 1/4W R855 1-249-417-11 CARBON 1K 5% 1/4W F R856 1-249-437-11 CARBON 47K 5% 1/4W R857 1-260-103-11 CARBON 2.
8 7 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R158 1-216-111-00 METAL CHIP 390K 5% 1/10W R159 1-216-101-00 METAL CHIP 150K 5% 1/10W R161 1-216-308-00 METAL CHIP 4.
8 8 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark L106 1-414-813-11 FERRITE 0uH L121 1-414-813-11 FERRITE 0uH L122 1-414-813-11 FERRITE 0uH L151 1-412-029-11 INDUCTOR CHIP .
8 9 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C358 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C359 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C360 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C362 1-163-038-91 CERAMIC CHIP 0.1uF 25V C363 1-163-251-11 CERAMIC CHIP 100PF 5% 50V C503 1-126-206-11 ELECT CHIP 100uF 20% 6.
90 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark C161 1-126-933-11 ELECT 100uF 20% 16V C166 1-162-282-31 CERAMIC 100PF 10% 50V C167 1-162-294-31 CERAMIC 0.001uF 10% 50V C171 1-164-159-11 CERAMIC 0.1uF 50V C172 1-162-306-11 CERAMIC 0.
91 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN D922 8-719-911-19 DIODE 1SS133T -72 D923 8-719-911-19 DIODE 1SS133T -72 D924 8-719-911-19 DIODE 1SS133T -72 D941 8-719.
92 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark MAIN R402 1-249-417-11 CARBON 1K 5% 1/4W F (AEP ,UK) R403 1-249-429-11 CARBON 10K 5% 1/4W (AEP ,UK) R404 1-259-880-11 CARBON 2.
93 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark A-4426-073-A P ANEL BOARD, COMPLETE ********************** * 1-690-880-31 LEAD (WITH CONNECTOR) 4-221-103-01 HOLDER (FL) < CAP ACITOR > C601 1-162-306-11 CERAMIC 0.01uF 30% 16V C602 1-162-306-11 CERAMIC 0.
94 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark R651 1-249-429-11 CARBON 10K 5% 1/4W R652 1-249-435-11 CARBON 33K 5% 1/4W R681 1-162-600-11 CERAMIC 0.0047uF 30% 16V R682 1-249-441-11 CARBON 100K 5% 1/4W R686 1-249-425-11 CARBON 4.
95 Ref. No. Part No. Description Remark Ref. No. Part No. Description Remark PO WER SP SW The components identified by mark ! or dotted line with mark ! are critical for safety .
96 Ref. No. Part No. Description Remark HCD-MD373 ************* HARDWARE LIST ************* #1 7-685-647-79 SCREW +BVTP 3X10 TYPE2 TT(B) #2 7-685-650-91 SCREW +BVTP 3X16 TYPE2 TT(B) #3 7-685-871-01 SCREW +BVTT 3X6 (S) #4 7-685-533-19 SCREW +BTP 2.6X6 TYPE2 N-S #11 7-685-534-19 SCREW +BTP 2.
HCD-MD373 97 MEMO.
HCD-MD373 REVISION HIST OR Y Clicking the version allows you to jump to the revised page. Also, clicking the version at the upper right on the revised page allows you to jump to the next revised page. V er . Date Description of Revision 1.1 2001.06 Addition of CD mechanism (CDM55C-5BD32) and base unit (BU-5BD32).
An important point after buying a device Sony HCD-MD373 (or even before the purchase) is to read its user manual. We should do this for several simple reasons:
If you have not bought Sony HCD-MD373 yet, this is a good time to familiarize yourself with the basic data on the product. First of all view first pages of the manual, you can find above. You should find there the most important technical data Sony HCD-MD373 - thus you can check whether the hardware meets your expectations. When delving into next pages of the user manual, Sony HCD-MD373 you will learn all the available features of the product, as well as information on its operation. The information that you get Sony HCD-MD373 will certainly help you make a decision on the purchase.
If you already are a holder of Sony HCD-MD373, but have not read the manual yet, you should do it for the reasons described above. You will learn then if you properly used the available features, and whether you have not made any mistakes, which can shorten the lifetime Sony HCD-MD373.
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