Instruction/ maintenance manual of the product 5942G Acer
Go to page of 248
Aspire 5942/5942G Series Service Guide PRINTED IN T AIW AN Service guide files and updates are availab le on the ACER/CSD web; for more information, please refer to http://csd.
II Revision History Please refer to the table below for the updates ma de on Aspire 5942 Series service guide. Date Chapter Up date s.
III Copyright Copyright © 2009 by Acer Incorporated. All rights rese rved. No part of this pub lication may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into a.
IV Conventions The following conventi ons are used in this manual: SCREEN MESSAGES Denotes actual messages that appe ar on screen. NOTE Gives bits and pieces of additional information related to the current topic. W ARNING Alerts you to any damage that might result from doing or not doing specific actions.
V Preface Before using this information and the product it s upports, please read the fo llowing general info rma tion. 1. This Service Guide provides you with all techni cal information relating to the BASIC CON FIGUR A TION decided for Acer's "glo bal" product offering.
VI.
VII T able of Contents System Specifications 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 System Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . .
VIII T able of Contents Removing the Power Saving Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68 Removing the Volu m e Co nt ro l Boar d . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .70 Removing the MIC Board .
IX T able of Contents TouchPad Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 36 Internal Speaker Failure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .136 Internal Microphone Failure .
X T able of Contents.
Chapter 1 1 System Specifications Features Below is a brief summary of the computer ’s many features: Operating System • Genuine Windows® 7™ Platform • Intel ® Core i7 * • Intel ® Core i5.
2 Chapter 1 Audio • Dolby ® -optimized surround sound system with two built-in stereo speakers • Optim ized 3 rd Generation Dolby Home Theatre ® audio enh ancement • T rue5.
Chapter 1 3 I/O interface • ExpressCard ® /54 slot • Multi-in-1 card reader (SD/MMC/MS/MS PRO/xD) • Three USB 2.0 po rt s • eSA T A port • HDMI ™ port with HDCP sup port • Consumer infr.
4 Chapter 1 System Block Diagram TPA6017 USB port 3 USB port 10 CPU XDP PCH XDP PCI-E 2.0x16 5GT/s PER LANE 6.4G/8.5G/10.6G 100M/133M/ 166M(CFD) 100MHz 100MHz 133MHz 133/120/100/96/14.318M HZ to PCH 48MHZ to CardReader 33MHz 100MHz 133MHz LS-5511P LS-5512P 100MHz 1GB/s x4 DMI x4 FDI x8 port 2,4 port 1 LVDS SW LVDS Conn.
Chapter 1 5 Your Acer Notebook tour Front View No. Icon Item Description 1 Acer Crystal Ey e webcam Web camera for video communication. 2 Display screen Also called Liquid-Crystal Display (LCD), displays computer output (confi guration may va ry by mo dels).
6 Chapter 1 NOTE: 1 The front panel indicators are visible even when the comp uter cover is closed 4 Backup key Launches Acer Ba ckup Management for three-step data backup. Bluetooth communication button/in dicator Enables/disables the Bluetooth function.
Chapter 1 7 Closed Front View Rear View Left View No. Item Description 1 V entil ati on slots Enable the computer to stay cool, even after prolonged use. No. Item Description 1 V entila tio n slots Enable the computer to stay cool, even after prolonged use.
8 Chapter 1 4 External display (VGA) port Connects to a display device (e.g. external moni tor , LCD projector). 5 HDMI HDMI port Supports high definition digital video connections (only for certain models). 6 eSA T A e SA T A port Connects to eSA T A device s.
Chapter 1 9 Right View No. Icon Item Description 1 6-in-1 Ca rd Reade r Accepts Secure Digital (SD), MultiMediaCard (MMC), MultiMediaCard Plus (MMCPlus), Memory S tick (MS), Memory S tick PRO (MS PRO), xD-Picture Card (xD). Note: Push to remove/install the card.
10 Chapter 1 Bottom View No. Icon Item Description 1 Hard disk bay Houses the computer's hard disk (secured with screws). Memory compartment Houses the computer's main memory . 2 Battery lock Locks the battery in position. 3 V entilation s lots and cooling fan Enable the computer to stay cool, even after prolonged use.
Chapter 1 11 TouchPad Basics (with fingerprint reader) The following items show you how to use the T ouchP ad with Acer Bio-Protection fi ng e r p r in t read e r : • Move your finger across the touchpad (1) to move the cursor .
12 Chapter 1 Using the Keyboard The keyboard has full-sized keys and an embedded numeric keypad, separate cursor , lock, Windows, fun ction and special keys. Lock Keys and embedded numeric keypad The keyboard has three lock keys which yo u can to ggle on and off.
Chapter 1 13 Windows Keys The keyboard has two keys that perform Wi ndow s-specific functions. Key Description Windows key Pressed alone, this key has the same effect as clicking on the Windows St art button; it launches the S tart menu.
14 Chapter 1 Hot Keys The computer employs hotkeys or key combinations to access most of the computer ’s controls like screen brightness, volume out put and the BIOS utility . T o activate hot keys, press and hold the < Fn> key before pressing the other key in the hotkey combination.
Chapter 1 15 Special Keys Y ou can locate the Euro symbol and the US dollar si gn at the upper-center an d/or bottom-right of your keyboard. The Euro symbol 1. Open a text editor or word processor. 2. Hold <Alt Gr> and the n press the <5> key at the upper-center o f the keyboard .
16 Chapter 1 Hardware Specifications and Configurations Processor Processor Specifications CPU Fan T rue V alue T able Clarksfield • Throttling 50%: On=95 °C Off: 86°C Item Specification CPU type .
Chapter 1 17 • OS shut down at 100°C; H/W shut down at 92°C Auburndale • Throttling 50%: On=10 0°C Off: 86°C • OS shut down at 105°C; H/W shut down at 92°C DOS Mode • Throttling 50%: On=95 °C Off: 86°C • OS shut down at 100°C; H/W shut down at 92°C BIOS System Memory Item Specification BIOS vendor InsydeH20 BIOS V ersion V1.
18 Chapter 1 Memory Combinations NOTE: Above table lists s ome system memory configur ations. Y ou may combine DIMMs with various capacities to form other combinations. On above table, the configuration of slot 1 and slot 2 co uld be reversed. LAN Interface Wireless Module 802.
Chapter 1 19 Features Integr ated 10/100/ 10000BASE-T transceiver Automatic MDI crossover function PCIe V1.1 compliant 10/100/10000BASE-T full -dup lex/half -duplex MAC Receive side scaling(RSS) for multicore processors Complies with IEEE 802.3, 802 .
20 Chapter 1 Hard Disk Drive Interface Item Specification V endor & Model Name Seagate ST9250315AS ST9320325AS ST9500325AS T oshiba MK2555GSX MK3263GSX MK5055GSX HGST HTS545025B9 HTS545032B9 HTS54.
Chapter 1 21 Blueray Drive Blueray Combo Module Item Specification V end or & model name Panasonic UJ230A LF , Pioneer BDR-TD01RS LF Performance S pecificatio n With CD Diskette With DVD Diskette T ransfer rate Sustained: 3,600 kB/s (24x) max. Sustained: 1 1.
22 Chapter 1 Super-Multi Driv e Module Audio Interface System Board Major Chips Item Specification V end or & model name HLDS G T20N LF , T oshiba TS-L633B LF , Sony AD -7 580S LF , PLDS DS-8A3S LF Performance S pecificatio n With CD Diskette With DVD Diskette T ransfer rate Sustained: 3,600 kB/s (24x) max.
Chapter 1 23 Keyboard Battery LCD 15. 6" HD Audio Codec • Realtek ALC669-X for High Definition Aud io Code c with Dolby Digi t al Live Keyboard • ENE KB926 for Keyboard Controller, Battery ma.
24 Chapter 1.
Chapter 2 23 System Utilities BIOS Setup Utility The BIOS Setup Utility is a hardware configuration prog ram built into y our computer ’s BIOS (Basic Input/ Output System). Y our computer is alre ady properly configured and optimi zed, and you do not need to run this utility .
24 Chapter 2 Information The Information screen displays a summary of your computer ha rdware information. NOTE: The system information is su bject to diff erent models. Parameter Description CPU T ype This field shows the CP U type and spee d of the system.
Chapter 2 25 Main The Main screen allows th e user to set the system time and date as well as enable and disable bo ot option and recovery . NOTE: The screen above is for your reference only . Actual values may differ . The table below describes the parameters in this screen.
26 Chapter 2 Security The Security screen co ntains parameters that help sa feguard and protect your co mputer from unautho ri zed use. The table below describes the parameters in this screen. Settings in boldface are the default and suggested parameter settings.
Chapter 2 27 Setting a Password Follow these steps as you set the user or the supervisor password: 1. Use the ↑ and ↓ keys to highlight the Set Supe rvisor Password parameter and press the Enter key . The Set Supervisor Password box appears: 2. T ype a password in the “Ente r New Password” field.
28 Chapter 2 Changing a Password 1. Use the ↑ and ↓ keys to highlight the Set Supe rvisor Password parameter and press the Enter key . The Set Password box appears. 2. T ype the current passw or d in the Enter Curr en t Pa ssw or d field and press Enter .
Chapter 2 29 Boot This menu allows the user to deci de the order of boot devices to l oad the operating syste m. Bootable devices includes the USB diskette drives, the onboard hard disk dr ive and the DVD drive in the module bay .
30 Chapter 2 Exit The Exit screen allows you to save or discard any changes you made an d qui t th e BIOS Utility . The table below describes the parameters in this screen. Parameter Description Exit Saving Changes Exit System Setu p and save your changes to CMOS.
Chapter 2 31 BIOS Flash Utilities The BIOS flash memory upd ate is required for th e following con ditions: • New versions of system programs • New features or options • Restore a BIOS when it becomes corrupted. Use the Phlash util ity to update the system BIOS flash ROM.
32 Chapter 2 DOS Flash Utility Perform the following steps to use the DOS Flash Utility: IMPORT ANT : Use USB KEY , USB HDD, DVD-RW , and HDDs that can boot to DOS mode. 1. Press F2 during boot to enter the Setup Menu. 2. Select Boot Menu to modify the boot priority order , for example, if using USB HDD to Update BIOS, move USB HDD to position 1.
Chapter 2 33.
34 Chapter 2 WinFlash Utility Perform the following steps to use the WinFlash Utility: 1. Double-click the WinFlash executable. 2. Click OK to begin the update. A progress screen displays. 3. When the process is complete, close all programs and applicat ions and reboot the system.
Chapter 2 35 Remove HDD/BIOS Password Utilities This section provide you with remo ving HDD /BIOS password method: Remove HDD Password: If you key in the wrong HDD password three times, an error is gen erated. T o reset the HDD p assword, perform the following step s: 1.
36 Chapter 2 Removing BIOS Passw or ds: T o clear the User or Supervisor passwords, open the R AM door and use a metal instrument to short the J4 / J5 jumper as shown below . Cleaning BIOS Passwords T o clean the User or Supervisor passwords, perform the following steps: 1.
Chapter 2 37 Using Boot Sequence Selector The Boot Sequen ce Selector allows the b oot order to be changed without accessing the BIOS. T o use Boot Sequence Selector , perform the following steps: 1. Enter into DOS. 2. Execute BS.exe to display the usage screen.
38 Chapter 2 Using DMITools The DMI (Desktop Manag ement Interface) T ool copies BI OS information to eep rom to be used in the DMI pool for hardware management. When the BIOS dis plays V erifying DMI pool dat a it is checking the table corre lates wi th the hardware before sending to the operating system (Windows, etc.
Chapter 2 39 Using the ICW50/ICY70 LAN MAC Utility Y ou can use the MAC.BA T utility to write t he MAC.CFG file to the EEPROM under DOS mode. 1. Use a text editor (for example: Notepad) to open the MAC.CFG file. Y ou can see the MAC.CFG contents as below: 2.
40 Chapter 2.
Chapter 3 41 Machine Disassembly and Replacement IMPORT ANT : The outside housing and color may vary from the mass produced model. This chapter contains step-by-s tep procedures on how to disass emble the notebook computer for maintenance and troubleshooting .
42 Chapter 3 General Information Pre-disassembly Instructions Before proceeding with the disassembly procedure, make su re that you do the following: 1. T urn off the power to the system and all peripherals. 2. Unplug the AC adapter and all power and signal cab les from the system.
Chapter 3 43 External Module Disassembly Process IMPORT ANT : The outside housing and color may vary from the mass produced model. External Modules Disassembly Flowchart The flowchart below gives you a graph ic representation on the entire disassembly sequence and instructs you on the components that need to be removed during servicin g .
44 Chapter 3 Removing the Battery Pack 1. T urn the computer over . 2. Slide the batte ry lock to the unlocked po si ti o n. 3. Slide and hold the battery rel ease latch to the release po sition (1), then lift out the battery pack from the main unit (2).
Chapter 3 45 Removing the Express Dummy Card 1. Push the Express dummy card all the way in to eject it. 2. Pull the card out from the slot..
46 Chapter 3 Removing the SD Dummy Card 1. Push the SD dummy card all the way in to eject it . 2. Pull the card out from the slot..
Chapter 3 47 Removing the Lower Covers 1. See “Removing the Battery Pack” on page 44. 2. Loosen the fo ur captive screws in the Memory/HDD and WLAN covers.
48 Chapter 3 Removing the Optical Drive Module 1. See “Removing the Lower Covers” on page 47. 2. Remove the single screw securing the ODD module. 3. Insert a suitable object in to the Lower Cover to push the ODD Modul e clear of the casing. 4. Pull the ODD Module o ut of the chassis.
Chapter 3 49 5. Remove the two screws securing the ODD Bracket and remove the ODD bracket from the module. 6. Insert a pin in the eject hole of the ODD to eject th e ODD tray .
50 Chapter 3 Removing the Hard Disk Drive Module 1. See “Removing the Lower Covers” on page 47. 2. Use the pull-tab to lift the HDD and disconnect the interface. 3. Lift the hard disk dr ive module out of the bay . NOTE: T o prevent damage to device, avoid pressing down on it or placing heavy objects on top of it.
Chapter 3 51 5. Remove the four screws (two each side) securing the hard disk to the carrier . 6. Remove the HDD from the carrier . Ste p Size Quantity Screw T ype HDD Carrier M3*3 4.
52 Chapter 3 Removing the DIMM Modules 1. See “Removing the Lower Covers” on page 47. 2. Push out the release latches on both sides of the DIMM socket to release th e DIMM module. 3. Remove the DIMM module. 4. Repeat steps for the seco nd DIMM module if present.
Chapter 3 53 Removing the WLAN Module IMPORT ANT : If the model p urchased supports TV T uner functi onality , remove the TV T uner Module before removing the WLAN Mo dule. 1. See “Removing the Lower Covers” on page 47. 2. Remove the two screws securing the Mini-Card Bra cket an d WLAN Module to the Mainboard 3.
54 Chapter 3 4. Disconnect the antenna cables from the WL AN Module. IMPORT ANT : The black cable attaches to the MAIN terminal and the white cable attaches to the AUX terminal. 5. Detach the WLAN Module from the WLAN socket. NOTE: When reattaching the antennas, ensure th e cables are tucked into the chassis to prevent dama ge.
Chapter 3 55 Main Unit Disassembly Process Upper Cover Disassembly Flowchart Screw List Step Screw Quantity Part No. Upper Cover M2.5*8 18 86.PH702.006 M2.5*5 2 86.PH702 .005 M2.5*3 3 86.PH702 .003 M2.5*5 1 86.PH702 .005 S peaker Module M2.5*3 4 86.PH702.
56 Chapter 3 Lower Cover Disassembly Flowchart Screw List Ste p Screw Quantity Part No. LCD Module M2.5*5 4 86 .PH702.005 Right Sadd le M2.5*5 2 86.PH702.0 05 USB Board M2.5*3 1 86 .PH702.003 Card Reader Board M2.5*3 4 86.PH702.003 Hinge Wells M2.5*3 2 86 .
Chapter 3 57 Removing the Keyboard 1. Locate the five securing clips on the top edge of the Keyboard. 2. S tarting with the central clip, release al l five secu ring clips by pressing down w ith a suitable plastic tool . 3. Pry up the centre of the Keyboard as shown.
58 Chapter 3 4. Rotate the Keyboard upward aw ay from the Upper Cover an d place it fa ce down on the T ouchPad area. 5. Open the Keyboard backlight FFC connector and di sco nnect the FFC. 6. Open the Keyboard FFC connector and disconne ct the FFC. 7.
Chapter 3 59 Removing the Upper Cover 1. See “Removing the Keyboard ” on page 57. 2. T urn the computer over . Remo ve the twenty-three screws on the bottom panel. 3. T urn the computer over . O pen the Launch Boa rd FFC connector and disconnect the FF C.
60 Chapter 3 4. Remove the single screw securing the Keyboard Cover to the Upper Cover , and remove the Keyboard Cover . 5. Disconnect the following FFCs (A, B, D, and E) and cables (C, F , and G) from the Mainboard. NOTE: Avoid pulling on cables directly to prevent damage to the connectors.
Chapter 3 61 6. S t arting on the front left side of the casing and worki ng along toward the righ t, pry the upper and lower covers apart as shown. 7. Work along the casing on the right and left sides toward the back edge, prying apart the casing. 8.
62 Chapter 3 Removing the Media Board 1. See “Removing the Upper Cove r” on page 59. 2. T urn the Upper Cover over a nd lift the M edia Board FFC to disconnect the adh esive. 3. T urn the Upper Cover over . Lift the Media Board cover , left side first, and remove the cover from the Upper Cover .
Chapter 3 63 5. Lift the Media Board away from the Upper Cover (1) a nd feed the FFC through the Upper Cover (2) to remove the Media Board. 1 2.
64 Chapter 3 Removing the Launch Board 1. See “Removing the Upper Cove r” on page 59. 2. T urn the Upper Cover over a nd lift the Launch Board FFC to disconnect the adhesi ve. 3. T urn the Upper Cover over . Lift the Launch Board cover , left side first, and remove the cover from the Upper Cover .
Chapter 3 65 5. Lift the Launch Board away from the Upper Cover . 6. Feed the FFC through the Upp er Cover to remove the Launch Board.
66 Chapter 3 Removing the Speaker Module 1. See “Removing the Upper Cove r” on page 59. 2. Lift the mylar covering to expose the S peaker cabl e as shown. 3. Remove the S peaker cable from the cable channel as shown. 4. Remove the four securing screws from the S pe aker mo dule.
Chapter 3 67 5. Using both hands, lift the S peaker Module upward to remove it from the Upper Cover ..
68 Chapter 3 Removing the Power Saving Board 1. See “Removing the S peaker Module” on page 66. 2. Remove the Power Saving Board cabl e from the cable channel as shown. 3. Remove the two securing screws from the board. 4. Remove the board from the chassis.
Chapter 3 69 5. Disconnect the cable from the Power Saving Board as shown..
70 Chapter 3 Removing the Volume Control Board 1. See “Removing the Upper Cove r” on page 59. 2. Lift the V olume Control Board F FC away from the Upper Cover to detach the adhesive. 3. Remove the two screws securing the board to the Upper Cover .
Chapter 3 71 Removing the MIC Board 1. See “Removing the Upper Cove r” on page 59. 2. Remove the adhesive tape securing the MIC cable to the Upper Cover. 3. Remove the MIC cable from the cable channel as shown. Ensure that the cable is free from all cable clips.
72 Chapter 3 Removing the Button Boar d and Finger Print Reader 1. See “Removing the Upper Cove r” on page 59. 2. Lift the Button Board FFC to detach the adhesive holding it in place. 3. Remove the two screws securing the Button Board and Finger Pri nt Reader to the Upper Cove r .
Chapter 3 73 5. Open the FFC locking latch and discon nect the Finger Print Reader FFC from the Button Board. 6. Remove Button Board from the bracket. 7. T urn the bracket over and remove the two screws securing the Finger Print Reader to the bracket.
74 Chapter 3 8. Remove the Finger Print Reader from the bracket as shown..
Chapter 3 75 Removing the TouchPad Bracket IMPORT ANT : The T ouchPad ca nnot removed from the Up per Cover . Replace the entire Upper Cover if the T ouchPad malfunctions. 1. See “Removing the Button Board and F inger Print Reader” on page 72. 2. Lift the T ouchPad FFC to detach the adhesive securing it in place.
76 Chapter 3 5. Remove the two screws securing the T ouchPad Bracket in place. 6. Lift the T ouchPad Bracket, front edge first, and remove it from the Upper Cover .
Chapter 3 77 Removing the LCD Module IMPORT ANT : The LCD Module cannot be disassemble d outside of factory conditions. If any part of the LCD Module is faulty , such as the camera, antenna or LCD panel, the whole module must be replaced. 1. See “Removing the Upper Cove r” on page 59.
78 Chapter 3 5. Remove the USB Board cable from the cable clips as shown. 6. Remove the adhesive tapes securing the USB Board and Backlight cables in place.
Chapter 3 79 8. Lift the USB Board cable to detach the adhesive securing it in place. 9. Remove the USB Board and Backlight cables from the ca ble channel. Ensure that the cables are free from all cable clips. 10. Remove the Antenna and Backlight cables from the cable clip as shown.
80 Chapter 3 11 . Pass the Antenna and Backl ight cables through the space between the Battery Bay and Hinge well as shown. 12. Remove the cables from the final cable clip as shown .
Chapter 3 81 14. Disconnect the L VDS cable from the Mainboard. 15. Remove the Conductive and L VDS cables from the cabl e channel. Ensure th at the cables are free from all cable clips. 16. Remove the four screws (two each side) securing the LCD Module to the Lower Cover .
82 Chapter 3 17. Using both hands, lift the LCD Module clear of the Lower Cover . IMPORT ANT : The LCD Module cannot be disassemble d outside of factory conditions. If any part of the LCD Module is faulty , such as the camera, antenna or LCD panel, the whole module must be replaced.
Chapter 3 83 Removing the Saddles 1. See “Removing the Upper Cove r” on page 59. 2. Lift the left side Saddle clear of the Lower Cover as shown. 3. Remove the two screw securing the right side Saddle to the Lower Cover . Ste p Size Quantity Screw T ype Right Saddle M2.
84 Chapter 3 4. Lift the right side Saddle clear of the Lower Cover as shown..
Chapter 3 85 Removing the USB Board 1. See “Removing the Saddles” on page 83. 2. Remove the single screw securing the USB Board to the Lower Cover . 3. Remove the USB Board from the Lower Cover as shown. Ste p Size Quantity Screw T ype USB Board M2.
86 Chapter 3 Removing the Subwoofer 1. See “Removing the LCD Module” on page 77. 2. Disconnect the Subwoofer cable from the Mainboard. 3. Remove the cable from the channel. Ensure th at the cable is free from all cable clips. 4. Using both hands, lift the Subwoofer clear of the Lower Cover .
Chapter 3 87 Removing the Bluetooth Module 1. See “Removing the Upper Cove r” on page 59. 2. Disconnect the Bluetooth cable from the Mainboard. 3. Remove the cable from the cable channel as shown.
88 Chapter 3 5. Disconnect the cable from the Bluetooth Module..
Chapter 3 89 Removing the Card Reader Board 1. See “Removing the Saddles” on page 83. 2. Remove the four screws securing the Ca rd Reader Board to the Lower Cover. 3. Lift the left side of the board to d isconnec t the read er interfac e from the Mainboard.
90 Chapter 3 Removing the Hinge Wells 1. See “Removing the Subwoofe r” on page 86. 2. Remove the two screws (one each side) securing the Hinge Wells to the Lower Cover . 3. Lift the Hinge Wells clear of the Lower Cover . Ste p Size Quantity Screw T ype Hinge Wells M2.
Chapter 3 91 Removing the Mainboard 1. See “Removing the Hinge Wells” on page 90. 2. Remove the single screw securing the Mainboard to the Lower Cover . 3. Pivot the Mainboard upward and remove it from the chassis, right side first. Place the Mainboard on a clean, dust-free surface.
92 Chapter 3 Removing the RTC Battery IMPORT ANT : Follow local regulations for disposal of all batteries. 1. See “Removing the Mainboard” on page 91. 2. The RTC Battery is soldered to the Mainboard. T o replace the battery , solder the new battery to the connections shown.
Chapter 3 93 Removing the VGA/MXM Card NOTE: The following procedure outlines the remo val steps for models supporting VGA Cards. The procedure for MXM Cards requires the removal of two scre ws, thoug h the remaining steps are identical. 1. See “Removing the Mainboard” on page 91.
94 Chapter 3 Removing the Thermal Module 1. See “Removing the Mainboard” on page 91. 2. Disconnect the fan cable from the Mainboard. 3. Remove the single screw securing the Fan to the Mainboard (green callout). 4. Remove the four securing screws (i n reverse numerical order from screw 4 to screw 1) from the Thermal Module (red callout).
Chapter 3 95 5. Using both hands, lift the Thermal Module clear of the Mainboard..
96 Chapter 3 Removing the CPU 1. See “Removing the Therma l Module ” on page 94. 2. T urn the securing screw 180° to release the CPU from the socket. 3. Remove the CPU from the socket as shown. IMPORT ANT : The pins on the underside of the CPU are very delicate.
Chapter 3 97 Main Module Reassembly Procedure Replacing the CPU IMPORT ANT : The CPU has a Pin1 locator that must be positi oned corresponding to the marker on the CPU socket. 1. Carefully turn the mainboa rd upside down (CPU side up), and place the CPU into the CPU socke t as shown, taking note of the Pin1 locator.
98 Chapter 3 Replacing the Thermal Module IMPORT ANT : Apply a suitable thermal grease and ensure all heat pads are in place before replacing the Thermal Module. The following thermal grease type s are approved for use: • Silmore GP50 • Honeywell PC M4 5F -SP • ShinEtsu 7762 The following thermal pads are approved for use: • Eapus XR-PE 1.
Chapter 3 99 Replacing the VGA/MXM Card NOTE: The following procedure outlines the installation steps for models supporting VGA Cards. The procedure for MXM Cards requires two screws, though the remaining steps are identical. 1. Insert the card in to the Mainboard connecto r as shown.
100 Chapter 3 Replacing the Mainboard 1. Insert the Mainboard in to the Lowe r Cover , left side fi rst. Ensure that the I/O ports on the left side of the Mainboard are locate d correctly through the Lowe r Case. 2. Pivot the Mainboard in to the Lower Cover as shown.
Chapter 3 101 Replacing the Hinge Wells Replacing the Card Reader Board 1. Replace the left and ri ght Hinge Wells in the L ower Cover as shown. Ensure that the Wells are seated correctly on the locating pins. 2. Replace the two screws to secure the Hing e Wells in the Lower Cove r .
102 Chapter 3 Replacing the Bluetooth Module 3. Replace the four screws to secure the Card Reader Board to the Lower Cover . 1. Connect the Bluetooth cable to the module as shown. 2. Place the module in th e Lo w e r Cove r . Ensure that the module is seated correctly on the locating pins.
Chapter 3 103 Replacing the Subwoofer Replacing the USB Board 1. Place the module in the Lower Cover . Ensure that the module is sea ted correctly on the locating pin s. 2. Run the cable along the cable channel using all available clips. 3. Connect the Subwoofer cable to the Mainboard as shown.
104 Chapter 3 Replacing the Saddles 1. Align the screw holes and locating pin s on the Saddles and the Lower Cove r and repla ce the Saddles. 2. Replace the two screws to secure the Righ t Sadd le to the Lower Cover . NOTE: The Left Saddle is not secured with screws.
Chapter 3 105 Replacing the LCD Module IMPORT ANT : The LCD Module cannot be disassemble d outside of factory conditions. If any part of the LCD Module is faulty , such as the camera, antenna or LCD panel, the whole module must be replaced. 1. Align the LCD hinges with the Lower Cover screw hol es and replace the LCD Module.
106 Chapter 3 Replacing the TouchPad Bracket IMPORT ANT : The T ouchPad ca nnot removed from the Up per Cover . Replace the entire Upper Cover if the T ouchPad malfunctions. 1. Insert the T ouchPad Bracket into the upper cover so the tabs slide into the securing slots in the upper cover .
Chapter 3 107 2. Insert the two screws to secure the T ouchPad Bracket in place. 3. Adhere the Finger Prin t Reader protection strip to the T ouchPad Bracket as shown. 4. Connect the T ouchPad FFC to the T ouchPad and cl ose the locking latch. Ste p Size Quantity Screw T ype T ouchPad Bracket M2.
108 Chapter 3 5. Adhere the T ouchPad FFC to the touchpad bracket as shown. Replacing the Button Boar d and Finger Print Reader 1. Place the Finger Print Reader into the bracket as shown. 2. Insert the two screws to secure the Finger Print Reader to the bracket.
Chapter 3 109 3. Place the Button Board into the bracket. 4. Connect the Finger Print Reader FFC to the Button Board and cl ose the FFC locking latch. 5.
11 0 Chapter 3 6. Replace the two screws to secure the Button Boar d and Finger Print Rea der to the Upper Cover. 7. Adhere the Button Board FFC to the back of the touchpad.
Chapter 3 111 Replacing the MIC Board 1. Place the MIC Board into the Upper Cover as shown. 2. Insert the MIC cable from the cable chann el as shown . Ensure that the cable is secured by all c able clips. 3. Adhere the adhesi ve tape to secure the MIC cable to the Upper Cover .
11 2 Chapter 3 Replacing the Volume Control Board 1. Place the board into the Upper Cove r . 2. Insert the two screws to secure the board to the Upper Cover . 3. Adhere V olume Control Board FFC to the Upper Cove r as shown. Ste p Size Quantity Screw T ype V olume Contro l Board M2.
Chapter 3 11 3 Replacing the Power Saving Board 1. Connect the cable to the Power Saving Board as shown. 2. Place the board into the chassis. 3. Insert the two securing screws into the board.
11 4 Chapter 3 4. insert the Power Saving Board ca ble into the cable channel as shown..
Chapter 3 11 5 Replacing the Speaker Module 1. Using both hands, place the S peaker Module into the Upper Cover . 2. Insert the four screws to secure the S peaker module to the Upper Cover . 3. Insert the S peaker cable into the cable channel as sh own.
11 6 Chapter 3 4. Replace the mylar covering to cover the S peaker cable as shown..
Chapter 3 11 7 Replacing the Launch Board 1. Feed the FFC through the penetration in the Upper Cover as shown. 2. Place the Launch Board into the Upper Cover . 3. Press down on the top of the board to en gage the securing cli ps (1) and push the Launch Boa rd in the direction of the arrow (2) to lock the board in place.
11 8 Chapter 3 4. T urn the Upper Cover over and insert the Launch Board cover into the Upper Cover . 5. T urn the Upper Cover over and adhere the Launch Board FFC to the upper cover .
Chapter 3 11 9 Replacing the Media Board 1. Insert the FFC into the penetra tion in the Upper Cover (1) and place the Media Bo ard into the Upper Cover (2) as shown. 2. Press down on the board so the securing clips engage an d pu sh the Media Board in th e direction of the a rrow (2).
120 Chapter 3 4. T urn the Upper Cover over and adhere t he Media Board FFC to the upper cover. Replacing the Upper Cover 1. Insert the Upper Cover into the assembly back edge first as shown. 2. Work along the casing on the right and lef t sides toward the front edge, pressing the casing together .
Chapter 3 121 3. S t arting on the front left side of the casing and work ing along toward the righ t, press the upper and lower covers together as shown. A click indicates the securing clips have engaged. 4. Connect the following FF Cs (A, B, D, and E) and cables (C, F , and G) to the Mainboard.
122 Chapter 3 5. Replace the Keyboard Cover and insert the single screw securing the Keyboard Cove r to the Upper Cover . 6. T urn the computer over . Connect th e Launch Board FFC connector and lock the FFC connector . Ste p Size Quantity Screw T ype Keyboard Cover M2.
Chapter 3 123 7. T urn the computer over . Insert the twenty-three screws on the bottom panel. Ste p Size Quantity Screw T ype Upper Cover (red callout) M2.
124 Chapter 3 Replacing the Keyboard 8. Insert the Keyboard backlight FFC and lock the conne cto r . 9. Connect the Keyboard FFC and lock the connector .
Chapter 3 125 11 . Press down around the edg es of the Keyboard to secure it in place. Replacing the WLAN Module 1. Insert the WLAN Mod ule into the mini -card socket. 2. Connect the antenna cables to the WLAN Module . IMPORT ANT : The black cable attaches to the MAIN terminal and the white cable attaches to the AUX terminal.
126 Chapter 3 3. Replace the Mini-Card Bracket as shown. 4. Insert the two screws to secure the Mini-C ard Bracket an d WLAN Modu le to the Mainboard Ste p Size Quantity Screw T ype WLAN Module M2*3 2.
Chapter 3 127 Replacing the DIMM Modules Replacing the Hard Disk Drive Module 1. Insert the DIMM Module in place. 2. Press down to lock the DIMM module in place. 1. Place the HDD in the HDD carrier . 2. Replace the four screws (two each side) to secure the carrier .
128 Chapter 3 Replacing the ODD Module 1. With the ODD tray in the eject position, replace the ODD bezel on the new ODD Module. 2. Secure ODD bracket with two screws. 3. Slide the module in to the chassis and p ress until the module is flush w ith the chassi s.
Chapter 3 129 Replacing the Lower Covers Replacing the SD Dummy Card Push the SD Dummy into the slot until an audible c lick indicates that the card is correctly inserted. 1. Replace the Memory Cover back edge first as shown. 2. Replace the memo ry/HDD cover back edge first as shown.
130 Chapter 3 Replacing the PCI Express Dummy Card Push the Express Dummy into the slot until an audible click indicates that the ca rd is correct ly inserted. Replacing the Battery 1. Slide and hol d the battery rele ase latch to the release po sition (1) , insert t he battery pack an d press down (2).
Chapter 4 131 Troubleshooting Common Problems Use the following procedure as a gui de for computer problems. NOTE: The diagnosti c tests are intended to test only Acer products. Non-Acer products, prototype cards, or modified options can give false e rrors and invalid system responses.
132 Chapter 4 Power On Issue If the system doesn’t power on, perform the following acti ons one at a time to correct the problem. Do not replace a non-defective FRUs: Computer Shutsdown Intermittently If the system powers off at intervals, perform the fo llow ing actions one at a time to correct the problem.
Chapter 4 133 No Display Issue If the Displa y doesn’t work, perform the follo wing actions one at a time to correct the problem. Do not replace a non-defective FRUs: No POST or Video If the POST or video doesn’t display , perform the foll owing actions one at a time to correct the problem.
134 Chapter 4 Abnormal Video Display If video displays abnormally , perform the following actions one at a time to correct the proble m. 1. Reboot the computer . 2. If permanent vertical/h orizontal lines or dark spots display in the same location, the LCD is faulty and should be replaced.
Chapter 4 135 LCD Failure If the LCD fails, perform the following actions one at a ti me to correct the problem. Do not replace a non- defective FRUs: Built-In Keyboard Failure If the built-in Keyboard fails, perform the foll owing actions one at a ti me to correct the pro blem.
136 Chapter 4 TouchPad Failure If the To u c h P a d doesn’t work, perform the following actions one at a time to correct the problem. Do not replace a non-defective FRUs: Internal Speaker Failure If the internal Speakers fail, perform the following actions one at a time to correct the probl em.
Chapter 4 137 Sound Problems If sound problems are experienced, p erform the following actions one at a time to correct the problem. 1. Reboot the computer . 2. Navigate to Start ´ Control Panel ´ System and Maintenance ´ System ´ Device Manager .
138 Chapter 4 Internal Microphone Failure If the internal Microphone fails, perform the following actions one at a time to correct the problem. Do not replace a non-defective FRUs: Microphone Problems If internal or external Mic rophones do no op erate correctl y , perform the following actions one at a time to correct the problem.
Chapter 4 139 HDD Not Operating Correctly If the HDD does not op erate correctly , perform the following ac ti ons one at a time to correct the problem. 1. Disconnect all external devices. 2. Run a complete virus scan using up-to-date software to ensure the computer is virus free.
140 Chapter 4 ODD Failure If the ODD fails, perform the following acti ons one at a time to correct the problem. Do not replace a non- defective FRUs: ODD Not Operating Correctly If the ODD exhibits a.
Chapter 4 141 a. Double-click lDE A T A/A T API controllers . If a device displa ys a down arrow , right-cl ick on the device and click Enable . b. Double-click DVD/C D-RO M dri ves . If the device displays a down arrow , right-click on the device and click Enable .
142 Chapter 4 b. Double-click IDE A T A/A T API controllers , then right-click A T A Device 0. c. Click Properties and select the Advanced Settings tab. Ensure that the Enable DMA box is checked and click OK . d. Repeat for the other A T A Devices shown if applicable.
Chapter 4 143 Modem Function Failure If the internal Modem fails, perform the followin g actions one at a time to correct the problem. Do not replace a non-defective FRUs: Wireless Function Failure If the WLAN fails, perform th e following actions one at a time to correct th e probl em.
144 Chapter 4 Thermal Unit Failure If the Thermal Unit fails, perform the follo wing actions one at a time to correct the problem. Do not replace a non-defective FRUs: External Mouse Failure If an external Mouse fails, perform the following actions one at a time to correc t th e problem.
Chapter 4 145 • No hardware is listed under Other Devices. 13. If the Issue is still not resolved, see “Online Support Information” on page 231. Other Failures If the CRT Switch, Dock, LAN Port, external MIC or S peake rs, PCI Express Card, 5-in-1 Card Reader or V olume Wheel fail, perform the following general steps to correct the problem.
146 Chapter 4 Intermittent Problems Intermittent system hang problems can be caused by a variety of reasons th at have nothin g to do with a hardware defect, such as: cosmic radiation, electros tatic discharge, or software errors. FRU replacement should be considered only when a recurring prob lem exists.
Chapter 4 147 Post Codes These tables describe the POST code s and descriptions durin g th e POST . Post Code Range SEC Phase POST Code T able NOTE: The color bar items indicate 3rd party re lated functions that are platform dependent.
148 Chapter 4 PEI Phase POST Code T able: NOTE: The color bar items indicate 3rd party re lated functions that are platform dependent. Functionality Name (Inc lu de PostCode.
Chapter 4 149 DXE Phase POST Code T able: NOTE: The color bar items indicate 3rd party re lated functions that are platform dependent. Functional i ty Name (Include PostCode.
150 Chapter 4 BDS Phase POST Code T able: Functional i ty Name (Include PostCode.h) Phase Post Code Description BDS_ENTER_BDS BDS 10 Enter BDS entry BDS_INST ALL_HOTKEY BDS 1 1 Install Hotkey service .
Chapter 4 151 NOTE: The color bar items indicate 3rd party re lated functions that are platform dependent. PostBDS POST Code T able S3 Functions POST Code T able ACPI Functions POST Code T able SMM Functions POST Code T able BDS_RECOVERY_ST ART_FLASH BDS 35 Fast Recovery S tart Flash.
152 Chapter 4 InsydeH2ODD T Debugger POST Co de T able SMM_ACPI_DISABLE_ST ART SMM 0xA8 OS call ACPI disable function SMM_ACPI_DISABLE_END SMM 0xA9 ACPI disable function complete Functionality Name (Include P ostCode.
Chapter 5 153 Jumper and Connector Locations Top View Item Description Item Description 1 SW1 Switch 12 JP1 Subwoofer (2P) 2L E D 1 , 2, 6, 7 Reed SW 13 JP3 TV Tuner Board to MB (8P) (Cable) 3 JP2 LCD Bezel Conductive (5P) 14 JP4 S peaker Conn. (4P) 4 Reed SW 15 JP7 Media Console (R) to MB (16P) (FCC) 5 L VDS for WLED Pa nel 16 JP8 Mic.
154 Chapter 5 Bottom View Item Description Ite m Description 1 PJP2 Battery Connector 9 JHDMI1 Launch Board to MB 2 JSA T A2 H9, 2 DDRIII STD 10 JSA T A1 eSata & USB 3 JSA T A3 HDD Conn. 1 1 JUSB1/2 USB 4 S tandof f Fan 12 JLINE1 Audio Jack (Line-In) Blue 5 PJP1 DC-IN Conn.
Chapter 5 155 LS-5511P Switch Board Item Description 1 LED3 Backup Button 2 SW3 Backup LED 3 LED2 Bluetooth Button 4 SW2 Bluetooth LED 5 LED1 Wireless Button 6 SW1 Wireless LED 7 JP1 T o M/B C onnecto.
156 Chapter 5 LS-5512P Media Board Item Description 1 JP3 Power Saving Conn. 2 JP1 V olume Control Conn. 3 JP2 T o M/B Conn. 1 2 3.
Chapter 5 157 LS-5513P TV-Tuner Board Item Description Item Description 1 ANT1 TV T un er Cable Conn. 3 JP2 TV T uner C onn. 2 JP4 ACER LOGO Back light Conn.
158 Chapter 5 LS-5514P Card Reader Board Item Description Item Description 1 J1 1394 Conn. 4 JMINI2 Wireless LAN Conn. 2 JREAD1 7 in 1 Card Reader 5 JMINI1 TV Tuner Connector 3 IR IR 6 JP1 T o M/B Conn.
Chapter 5 159 LS-5515P Touch Pad Button Board Item Description Item Description 1 JP3 Finger Print Conn 3 JP2 TP Module Conn. 2 JP1 T o M/B Connector 4 SW1/2 Le ft & Right Buttons Bottom View Top .
160 Chapter 5 LS-5516P Power Saving Board Item Description Item Descrip tion 1 SW1 Power Saving Button 2 JP1 T o Media Board Conn. Top View Bottom V iew 12.
Chapter 5 161 LS-5517P Volume Board Item Description Item Desc ription 1 SW1 V olume Button 2 JP1 T o Media Board Conn. Top View Bottom View 1 2.
162 Chapter 5 LS-5518P Color Engine Board Item Description Item Description 1 SENSE1 Acer Logo Backlight 3 JP1 T o TV -Tuner Board Conn. 2 SENSE2 Color Engine 12 3.
Chapter 5 163 Clearing Password Check and BIOS Recovery This section provide s you with the standard operating pr ocedures fo r clearing passwords and BIOS recovery for the Aspire 5942 Series. The Aspire 594 2 Series pr ovides one Hardware Op en Gap on the main board fo r clearing password check, and one Hotkey for enabling BIOS Recovery .
164 Chapter 5 system till BIOS POST finish. Then re move the tool from the HW Gap. • Restart system. Press F2 key to enter BIOS Setup menu. • If there is no Password request, BIOS Password is cleared. Otherwise, pl ease follow the steps and try again.
Chapter 5 165 BIOS Recovery by Crisis Disk BIOS Recovery Boot Block: BIOS Recovery Boot Block is a spec ial block of BIOS. It is used to boot up the system with minimum BIOS initialization. Users can enable this feature to restore the BIOS firmware to a successful one once the previous BIOS flashing process failed.
166 Chapter 5.
Chapter 6 167 FRU (Field Replaceable Unit) List This chapter gives you the FRU (Field Repl aceable Unit) listing in global configurati ons of Aspire 5942 Series. Refer to this chapter whenever ordering for parts to repair or for RMA (Return Merchandise Authorization).
168 Chapter 6 Aspire 5942 Series Exploded Diagrams Main Assembly No. Description Acer P/N 1 Keyboard KB.I1 40A.001 2 Up per Cover TBD 3 Mainboard MB.PH802.001 4 T hermal Module 60.PH702.008 5 Subwoofer 23.PH702.003 6 L ower Cover TBD 7 Hi nge Saddle-L 33.
Chapter 6 169 Base Assembly No. Description Acer P/N 1 HD D Door TBD Confirm 42.PH702.003 2 M ini Door 42.PH702.004 3 L ower Cover 60.PH702.002 1 2 3.
170 Chapter 6 Aspire 5942 Series FRU List CA TEGOR Y Description Acer Part Number BOARD Lan Intel WLAN 512AN_ HMWG Shirley Peak 5100 MM#895373 KI.SPH01.003 Lan Intel WLAN 512AG_HMWG Sh irley Peak 5100 MM#897072 KI.SPH01.005 Lan Intel WLAN 533AN_ HMWG Shirley Peak MM#895401 KI.
Chapter 6 171 CABLE BLUE TOOTH CABLE 50.PH702.001 T/P FFC 50.PH702.002 POWER SA VING CABLE 50.PH702.003 USB CABLE 50.PH702.004 RF CABLE 50.PH802.001 ON-OFF BOARD CABLE 50.PH702.007 TV TUNER ANTENNA 50.PH802.002 SMB-P AL JACK 50.PH802.003 P AL-F JACK 50.
172 Chapter 6 HDD DOOR 42.PH702.003 MINI DOOR 42.PH702.004 HDD BRACKET 33.PH702.003 HDD CONNECTOR 20.PH702.001 MINI CARD BRACKET 33.PH702.004 LAUNCH COVER - BT , WLAN, REPLICA TE 60.PH702.003 FP-TP BRACKET 33.PFQ02.001 T/P BRACKET 33.PH702.005 MEDIA COVER 60.
Chapter 6 173 KEYBOARD Keyboard ACER AC4B SM50 Internal 14 S tandard 86KS Black US Internationa l Backlit KB.I140A.031 Keyboard ACER AC4B SM50 Internal 14 S tandard 86KS Black Greek Backlit KB.I140A.016 Keyboard ACER AC4B SM50 Internal 14 S tandard 86KS Black Arabic Backlit KB.
174 Chapter 6 Keyboard ACER AC4B SM50 Internal 14 S tandard 87KS Black US w/ Canadi an French Backlit KB.I140A.033 Keyboard ACER AC4B SM50 Internal 14 S tandard 87KS Black Brazilian Portugue se Backlit KB.I140A.009 Keyboard ACER AC4B SM50 Internal 14 S tandard 87KS Black CZ/SK Backlit KB.
Chapter 6 175 BD RW DRIVE ODD BD RW MODULE 6M.PH702.004 ODD PIONEER BD R W 12.7mm T ray DL 4X BDR-TD01RS LF W/O bezel SA T A (Windows 7) KU.00405.015 ODD P ANASONIC BD RW 12.7mm T ray DL 4X UJ230A LF W/O bezel FW 1.10 SA T A (Windows 7) KU.00407.014 ODD P ANASONIC BD RW 12.
176 Chapter 6 HEA TSINK CPU THERMAL MOUDLE - CAF 60.PH702.008 CPU THERMAL MOUDLE - ARRANDALE 60.PMV02.003 SPEAKER MIC 23.PH702.001 SPEAKER R&L 23.PH702.002 SUB WOOFER 23.PH702.003 MISCELLANEOUS NAME PLA TE-AS5942 40.PMV02.001 LCD SCREW RUBBER-PLASTIC 47.
Chapter 6 177 Screw List Category Description Acer P/N Screw SCREW M2.5D 3.0L K 5.3D NI NL 86.PH702.001 SCREW M1.98D 3.0L K 4. 6D 0.8T ZKNL 86.PH702.002 SCREW M2.46D 3.0L K 5. 5D 0.8T ZKNL 86.PH702.003 SCREW M3.0D 3.0L K 4.9D NI 86.PH702.004 SCREW M2.
Appendix A 178 Model Definition and Configuration Aspire 5942 Series Model RO Country Acer Part No Description AS5942G- 332G25Bi WW WW S2.PR5 02.001 AS5942G-724G64Bn W 7HP64A WW1 MC M96PRO1GBCFPbkQ_V3 2*2G/640/BT/ 8L2.4/5R/cb_bgn _FP_1.0D_GEb_ES62RO Media Review Sku AS5942G- 332G25Bi WW WW S2.
179 Appendix A AS5942G- 334G32Mn EMEA Germany LX.PM N02.01 3 AS5942G-724G64Bn W7HP64A TDE1 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/640/ BT/8L2.4/5R/cb_bg n_FP_1.0D_GEb_DE1 1 AS5942G- 334G32Mn EMEA Denmark LX.PM N02.02 6 AS5942G-728G64Bn W7HP64A TDK2 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/640/ BT/6L2.
Appendix A 180 AS5942G- 334G32Mn AAP Indon esia LX.PM N02.02 9 AS5942G-724G64Mn EM W7HP64EMA TID1 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/ 640/BT/6L2.2/5R/ cb_bgn_FP_1.0D_GEb _ID21 AS5942G- 334G32Mn AAP Philippi nes LX.PM N07.00 5 AS5942G-724G50Wn EM W7UT64EMA TPH1 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/ 500_L/BT/8L2.
181 Appendix A AS5942G- 334G50Mn EMEA South Africa LX.PM N02.1 1 4 AS5942G-728G64Bn EM W7HP64EMA TZA2 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/ 640/BT/6L2.2/5R/ cb_bgn_FP_1.0D_GEb _ES61 AS5942G- 334G50Mn EMEA Turkey LX.PM N02.1 1 3 AS5942G-728G64Bn EM W7HP64EMA TTR1 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/ 640/BT/6L2.
Appendix A 182 AS5942G- 334G50Mn EMEA Belgium LX.PM N02.09 9 AS5942G-728G64Bn W7HP64A TBE1 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_NL1 1 AS5942G- 334G50Mn EMEA Switzerland LX.PM N02.09 8 AS5942G-728G64Bn W7HP64A TCH1 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/640/ BT/6L2.
183 Appendix A AS5942G- 334G50Mn EMEA Greece LX.PM N02.08 1 AS5942G-728G64Bn W7HP64A TGR1 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_EL31 AS5942G- 334G50Mn EMEA Austria LX.PM N02.08 0 AS5942G-728G64Bn W7HP64A T A T1 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/640/ BT/6L2.
Appendix A 184 AS5942G- 434G50Bn EMEA Middle East LX.PM N02.06 6 AS5942G-724G64Bn EM W7HP64EMA TME3 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_ES81 AS5942G- 434G50Bn EMEA Middle East LX.PM N02.06 5 AS5942G-724G64Bn EM W7HP64EMA TME6 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/640/ BT/6L2.
185 Appendix A AS5942G- 434G64Mn EMEA Israel LX.PM N02.05 0 AS5942G-724G64Bn W7HP64A TIL1 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_HE1 1 AS5942G- 434G64Mn EMEA Portugal LX.PM N02.04 9 AS5942G-724G64Bn W7HP64A TPT1 MC MADISON_PRO1GBCFPbkQ_V3 2*2G/640/ BT/6L2.
Appendix A 186 AS5942G- 434G64Mn AAP Singapore LX.PM N02.02 8 AS5942G-726G64Mi W7HP64A TSG1 MC MADISON_PRO1GBCFPbkQ_V3 4G+2G/ 640/BT/8L2.4/5R/ cb_abgn_FP_1.0D_GEb_ES61 AS5942G- 434G64Mn AAP Singapore LX.PM N02.02 7 AS5942G-728G64Mi W7HP64A TSG1 MC MADISON_PRO1GBCFPbkQ_V3 2*4G/640/ BT/8L2.
187 Appendix A AS5942G- 434G64Mn EMEA Ukraine LX.PMT 02.1 10 AS5942G-4 34G64Mn W7 HP64RUA TUK1 MC MADISON_PRO1GBCFPbk_V3 2*2G/ 640/BT/6L2.2/5R/ cb_bgn_FP_1.0D_GEb _RU61 AS5942G- 434G64Mn EMEA Denmark LX.PMT 02.022 AS5942G-434G50Mn W7 HP64A TDK2 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ BT/6L2.
Appendix A 188 AS5942G- 522G32Mn EMEA Greece LX.PMT 02.019 AS5942G-434G64Bn W 7HP64A TGR1 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_EL31 AS5942G- 522G32Mn EMEA Russia LX.PMT 02.024 AS5942G-434G50Mi W7H P64RUA TRU1 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ BT/6L2.
189 Appendix A AS5942G- 524G50Mn EMEA Middle East LX.PMT 02.108 AS5942G-434G64Mn EM W7HP64EMA TME4 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_RU61 AS5942G- 524G50Mn EMEA South Africa LX.PMT 02.106 AS5942G-434G64Mn EM W7HP64EMA TZA2 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.
Appendix A 190 AS5942G- 722G32Bi EMEA Poland LX.PMT 02.093 AS5942G-434G64Mn W7 HP64A TPL1 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_PL1 1 AS5942G- 722G32Bn EMEA Holland LX.PMT 02.092 AS5942G-434G64Mn W7 HP64A TNL1 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.
191 Appendix A AS5942G- 724G64Bi EMEA S pain LX.PMT 02.077 AS5942G-434G64Mn W7 HP64A TES1 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_ES51 AS5942G- 724G64Bi EMEA Eastern Europe LX.PMT 02.075 AS5942G-434G64Mn W7 HP64A TEU7 MC MADISON_PRO1GBCFPbk_V3 2*2G/640/ BT/6L2.
Appendix A 192 AS5942G- 724G64Bn EMEA Germany LX.PMT 02.060 AS5942G-334G50Mn W7 HP64A TDE1 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ 6L2.2/5R/cb_bgn _FP_1.0D_GEb_DE1 1 AS5942G- 724G64Bn EMEA South Africa LX.PMT 02.059 AS5942G-334G50Mn EM W7HP64EMA TZA1 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ 6L2.
193 Appendix A AS5942G- 724G64Bn EMEA UK LX.PMT 02.045 AS5942G-334G50Mn W7 HP64A TGB1 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ 6L2.2/5R/cb_bgn _FP_1.0D_GEb_EN1 1 AS5942G- 724G64Bn EMEA Eastern Europe LX.PMT 02.044 AS5942G-334G50Mn W7 HP64A TEU5 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ 6L2.
Appendix A 194 AS5942G- 724G64Bn EMEA Turkey LX.PMT 02.028 AS5942G-334G32Mn EM W7HP64EMA TTR1 MC MADISON_PRO1GBCFPbk_V3 2*2G/320/ BT/6L2.2/5R/cb_bg n_FP_1.0D_GEb_TR31 AS5942G- 724G64Bn AAP Malaysia LX.PMT 02.026 AS5942G-524G50Bn EM W7HP64EMA TMY1 MC MADISON_PRO1GBCFPbk_V3 2*2G/500_L/ BT/6L2.
195 Appendix A AS5942G- 726G64Bn EMEA S pain LX.PM R07.00 2 AS5942G-434G64Mn W7UT64A TES1 MC MADISON_PRO1GBCPbk_V3 2*2G/640/BT/ 6L2.2/5R/cb_bgn _1.0D_GEb_ES51 AS5942G- 726G64Bn EMEA S pain LX.PM R07.00 1 AS5942G-334G50Mn W7UT64A TES1 MC MADISON_PRO1GBCPbk_V3 2*2G/500_L/ BT/6L2.
Appendix A 196 AS5942G- 728G64Bn EMEA Eastern Europe LX.PM S02.02 1 AS5942G-334G32Mn W7HP64A TE U5 MC MADISON_PRO1GBCbk_V3 2*2G/320/ 6L2.2/5R/cb_GN _1.0D_GEb_RO1 1 AS5942G- 728G64Bn EMEA Eastern Europe LX.PM S02.02 0 AS5942G-334G32Mn W7HP64A TE U5 MC MADISON_PRO1GBCbk_V3 2*2G/320/ 6L2.
197 Appendix A AS5942G- 728G64Bn CHINA Hong Kong LX.PM S02.00 4 AS5942G-522G32Mn W7HP64A THK2 MC MADISON_PRO1GBCbk_V3 1*2G/320/BT/ 6L2.2/5R/cb_GN _1.0D_GEb_ZH34 AS5942G- 728G64Bn WW GCTWN S2.PM S0C.00 1 AS5942G-523G25Bi LINPUSAWW1 MADISON_PRO1GBCbk_V3 2G+1G/250/ BT/6L2.
Appendix A 198 AS5942G- 728G64Bn AAP Singapore LX.PM W02.00 3 AS5942G-544G50Mn W7HP64A TSG1 MC P ARK_XT512CFPbk_V3 2* 2G/500_L/BT/ 6L2.2/5R/cb_bgn _FP_1.0D_GEb_ES61 AS5942G- 728G64Bn AAP Indonesia LX.PM W02.00 5 AS5942G-524G50Mn EM W7HP64EMA TID1 MC P ARK_XT512CFPbk_V3 2*2G/500_L/ BT/6L2.
199 Appendix A AS5942G- 334G32Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 334G32Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) A.
Appendix A 200 AS5942G- 334G50Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 334G50Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) A.
201 Appendix A AS5942G- 334G50Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 334G50Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) A.
Appendix A 202 AS5942G- 434G50Bn AS5942G_ MADISON_PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 434G50Bn AS5942G_ MADISON_PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) A.
203 Appendix A AS5942G- 434G64Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 434G64Mn AS5942G_MADISON _PRO1GBCF PbkQ_V3 Ci7720QM MADISON_ PRO 1G-DDR3 (64*16*8) A.
Appendix A 204 AS5942G- 434G64Mn AS5942G_MADISON _PRO1GBCF Pbk_V3 Ci5430M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 434G64Mn AS5942G_MADISON _PRO1GBCF Pbk_V3 Ci5430M MADISON_ PRO 1G-DDR3 (64*16*8) AS594.
205 Appendix A AS5942G- 524G50Mn AS5942G_MADISON _PRO1GBCF Pbk_V3 Ci5430M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 524G50Mn AS5942G_MADISON _PRO1GBCF Pbk_V3 Ci5430M MADISON_ PRO 1G-DDR3 (64*16*8) AS594.
Appendix A 206 AS5942G- 724G50Mi AS5942G_MADISON _PRO1GBCF Pbk_V3 Ci5430M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 724G50Mn AS5942G_MADISON _PRO1GBCF Pbk_V3 Ci5430M MADISON_ PRO 1G-DDR3 (64*16*8) AS594.
207 Appendix A AS5942G- 724G64Bn AS5942G_ MADISON_PRO1GBCF Pbk_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 724G64Bn AS5942G_ MADISON_PRO1GBCF Pbk_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS594.
Appendix A 208 AS5942G- 724G64Bn AS5942G_ MADISON_PRO1GBCF Pbk_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 724G64Bn AS5942G_ MADISON_PRO1GBCF Pbk_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS594.
209 Appendix A AS5942G- 728G64Bi AS5942G_ MADISON_PRO1GBCb k_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 728G64Bi AS5942G_ MADISON_PRO1GBCb k_V3 Ci5520M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- .
Appendix A 210 AS5942G- 728G64Bn AS5942G_ MADISON_PRO1GBCb k_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- 728G64Bn AS5942G_ MADISON_PRO1GBCb k_V3 Ci3330M MADISON_ PRO 1G-DDR3 (64*16*8) AS5942G- .
21 1 Appendix A AS5942G- 728G64Mi AS5942G_P ARK_X T512CPbk_V3 Ci5520M P ARK _XT 512M- DDR3 (64*16*4) AS5942G- 728G64Wn AS5942G_P ARK_ XT512Cbk_V3 Ci5520M P ARK_XT 512M- DDR3 (64*16*4) AS5942G- 728G64W.
Appendix A 212 AS5942G- 334G32Mn SO4GBIII 10 SO2GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 334G32Mn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 334G32Mn SO4GBIII 10 SO2GBIII 10 N640GB5 .
213 Appendix A AS5942G- 334G50Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 334G50Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 334G50Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .
Appendix A 214 AS5942G- 334G50Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 334G50Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 334G50Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .
215 Appendix A AS5942G- 434G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 434G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 434G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .
Appendix A 216 AS5942G- 434G64Mn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 434G64Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 434G64Mn SO4GBIII 10 SO2GBIII 10 N640GB5 .
217 Appendix A AS5942G- 434G64Mn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 434G64Mn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NBDCB4 XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 434G64Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .
Appendix A 218 AS5942G- 524G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 524G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 524G64Bn SO2GBIII 10 SO2GBIII 10 N640GB5 .
219 Appendix A AS5942G- 724G50Mi SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 724G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 724G50Mn SO2GBIII 10 SO2GBIII 10 N640GB5 .
Appendix A 220 AS5942G- 724G64Bn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 724G64Bn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 724G64Bn SO2GBIII 10 SO2GBIII 10 N500GB5 .
221 Appendix A AS5942G- 724G64Bn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 724G64Bn SO2GBIII 10 SO2GBIII 10 N500GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 724G64Bn SO2GBIII 10 SO2GBIII 10 N500GB5 .
Appendix A 222 AS5942G- 726G64Mi SO2GBIII 10 SO1GBIII 10 N250GB5 .4KS NBDCB4 XS 5 in 1-Build in INT6200 H AS5942G- 726G64Mn SO4GBIII 10 SO4GBIII 10 N640GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 726G64Wn SO2GBIII 10 SO2GBIII 10 N640GB5 .
223 Appendix A AS5942G- 728G64Bn SO2GBIII 10 SO2GBIII 10 N320GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 728G64Bn SO2GBIII 10 SO2GBIII 10 N320GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 728G64Bn SO2GBIII 10 SO2GBIII 10 N320GB5 .
Appendix A 224 AS5942G- 728G64Bn SO2GBIII 10 SO1GBIII 10 N250GB5 .4KS NBDCB4 XS 5 in 1-Build in INT6200 H AS5942G- 728G64Mi SO2GBIII 10 SO1GBIII 10 N250GB5 .4KS NBDCB4 XS 5 in 1-Build in INT6200 H AS5942G- 728G64Wn SO2GBIII 10 N N320GB5 .4KS NSM8XS 5 in 1-Build in 3rd WiFi 2x2 BGN AS5942G- 728G64Wn SO2GBIII 10 SO1GBIII 10 N320GB5 .
Appendix B 225 Test Compatible Components This computer ’s compat ibility is tested and verified by Acer ’s internal testing department. All of it s system functions are tested under Windows ® 7 environment with backward s compatibility to Windows XP ® .
226 Appendix B Microsoft ® Windows ® 7 Environment Test BRAND Ty p e Des cription Adapter DEL T A 90W Adapter DEL T A 90W 19V 1.7x5.5x1 1 Blue ADP-90CD DB A, L V5 LED LF HIPRO 90W Adapter HIPRO 90W 19V 1.7x5.5x1 1 Blue HP-A0904A3 B1LF , L V5 LED LF LITE-ON 90W Ad apter LITE-ON 90W 19V 1.
Appendix B 227 HDD HGST N2 50GB5.4KS HDD HGST 2.5" 5400rpm 25 0GB HTS545025B9A300 Panther B SA T A LF F/W:C60F HGST N2 50GB5.4KS HDD HGST 2.5" 5400rpm 25 0GB HTS545025B9A300 Panther B SA T A LF F/W:C60F Disk imbalance criteria = 0.014g-cm HGST N3 20GB5.
228 Appendix B ELPIDA SO2GBIII10 Memory ELPIDA SO-DIMM DDRIII 1066 2GB EBJ21UE8BBS0- AE-F LF 128*8 0.065um HYNIX SO1GBIII10 Memory HYNIX SO-DIMM DDRIII 1066 1GB HMT1 12S6BFR6C-G7 N0 LF 64*16 0.055 um HYNIX SO2GBIII10 Memory HYNIX SO-DIMM DDRIII 1066 2GB HMT125S6BFR8C-G7 N 0 LF 128*8 0.
Appendix B 229 SONY NBDCB4XS O DD SON Y BD COMBO 12.7 mm T ray DL 4X BC-5500H LF W/ O bezel SA T A (HF + Windows 7) SONY NBDCB4XS O DD SON Y BD COMBO 12.7mm T ray DL 4X BC-5500S LF W/ O bezel FW 1.E1 SA T A (Windows 7) SONY NSM8XS ODD SONY Super-Multi DRIVE 12.
230 Appendix B.
Appendix C 231 Online Support Information This section describe s online techni cal support services a vailable to help you repair your Acer Systems. If you are a distributor , dealer , ASP or TPM, please re fer your technical queries to your local Acer branch office.
232 Appendix C.
233 A AFLASH Utility 31 B Battery Pack Removing 44 BIOS ROM size 17 ROM type 17 vendor 16 Version 16 BIOS Utility 23–31 Advanced 26 Boot 29 Exit 30 Navigating 23 Onboard Device Configur ation 27 Pow.
234 Internal S peaker Failure 136 J Jumper and Connector Locations 153 Top View 153 K Keyboard Removing 57 Keyboard Failure 135 L Launch Bo ard Removing 64 Replacing 117 LCD Failure 135 LCD Module Rem.
235 Removing 66 Replacing 115 speakers hotkey 14 Subwoofer Removing 86 Replacing 103 System Block Diagram 4 T T est Compatible Components 225 Thermal Grease 98 Thermal Module Removing 94 Replacing 98 .
236.
An important point after buying a device Acer 5942G (or even before the purchase) is to read its user manual. We should do this for several simple reasons:
If you have not bought Acer 5942G yet, this is a good time to familiarize yourself with the basic data on the product. First of all view first pages of the manual, you can find above. You should find there the most important technical data Acer 5942G - thus you can check whether the hardware meets your expectations. When delving into next pages of the user manual, Acer 5942G you will learn all the available features of the product, as well as information on its operation. The information that you get Acer 5942G will certainly help you make a decision on the purchase.
If you already are a holder of Acer 5942G, but have not read the manual yet, you should do it for the reasons described above. You will learn then if you properly used the available features, and whether you have not made any mistakes, which can shorten the lifetime Acer 5942G.
However, one of the most important roles played by the user manual is to help in solving problems with Acer 5942G. Almost always you will find there Troubleshooting, which are the most frequently occurring failures and malfunctions of the device Acer 5942G along with tips on how to solve them. Even if you fail to solve the problem, the manual will show you a further procedure – contact to the customer service center or the nearest service center
