Instruction/ maintenance manual of the product S62F Asus
Go to page of 166
service overview 1-1 Chapter 1 Ser vice Ov er view Car efully r ead thr ough this chapter for a look at various components of the notebook and necessar y cautions an d tools befor e perfor ming any ser vice and r epairs.
service ov erview 1-2 S62F Series Ov er view and Components The ASUS S62F Series Notebook is a product combining the power of Intel® Pentium-M CPU. In this section, an overvi ew for the S62F, along with its components, will be presented.
service overview 1 - 3 USB ( 2.0 ) p orts Modem port PCMCIA slot LAN port VGA Port 1394 port Optical Drive Device Air vents Kensin g ton Lock Batter y Module DC Power Input Jack.
service overview 1 - 4 Components LCD COMPONENTS INVERTER BOARD The illustrations below show the components of theS62F Series. LCD Panel* The illustration below shows the LCD display pa nel.
service overview 1 - 5 LCD bracket LCD BRACKETS The illustration below shows the LCD brackets. Hinge Cover HINGE COVER The illustration below shows the Hinge Cover.
service overview 1 - 6 Keyboard KEYBOARD The illustration below shows the keyboa rd plate. It can be exchanged with keyboard plates with different language layouts, such as U.S., German, Russian, British, Italian and others. Top Case Module TOP CASE The illustration below shows the top case of the notebook.
service overview 1 - 7 Optical Drive Device OPTICAL The illustration below shows the Optical Drive Device DRIVE DEVICE Hard Disk Drive HDD The illustration below shows the 2.5” in dustry-standard HDD with 9.5mm height. HDD Bracket HDD BRACKET The illustration below shows the HDD Brac ket that is placed over the HDD.
service overview 1 - 8 CPU Thermal Module CPU The illustration below shows the thermal module for the CPU. It’s located on the top of CPU. THERMAL MODULE Memory Module MEMORY The illustration below shows the industry-standard 200pin SO-DIMM DD R SDRAM module for the notebook.
service overview 1 - 9 Modem Module MODEM The illustration below shows the modem module of the notebook. MODULE WALN Module WALN The illustration below shows the WALN module of the notebook. MODULE Top Case TOP CASE The illustration below shows the TOP case of the notebook.
service overview 1 - 10 Ser vice Ov er view Please pay special attention to the cautions below to prevent any damages to the notebook and also please be sure to select the appropria te tools described in this section to perform any services desired.
service overview 1 - 11 Appr opriate T ools TOOLS The illustrations below show the appropriate t ools that should be used for the notebook’s service and repair. Phillips-hea d Screwdri ver CROSS SCREW- Use a Phillips-head screwdriver to fas ten/remove the K- or B-typed screws.
Disassembly procedu re Chapter 2 Disassembl y Pr ocedur e Please follow the infor matio n pr ovided in this section to perfor m the complete disassembly procedur e of the note book . Be sur e to use pr oper tools described befor e. SUS S62F Series Notebook consists of vari ous modules.
Disassembly procedu re Ba tter y Module BATTERY BATTERY MODULE REMOVAL The illustration below shows how to remove the battery module. 1. Unlock and hold the latch No (1). 1 2. Slide the battery lock (No. 2) and pull the battery pack out. 2 3. Pull the battery pack out.
Disassembly procedu re HDD Module HDD MODULE The illustrations below show how to remove the HDD module from the notebook. Removing HDD Module HDD MODULE REMOVAL 1. Remove 3 screws (M2.5*4L (K )), then remove the HDD door. M2.5*4L 2. Lift the HDD module a nd then remove it.
Disassembly procedu re W ir eless LAN Module WIRELESS LAN The illustration below shows how to remove the Wireless LAN module. 1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna. 2. And open the two latches to pop the MINI PC I MODULE up then pull it out.
Disassembly procedu re 2. Open the 2 latches aside (No. 1, 2), which will pop the memory module up to an angle of 30 ° , then pull out the memory modul e in that angle (No. 3). 1 3 2 30 o CPU Module CPU MODULE The illustrations below show how to remove the CPU module from the notebook.
Disassembly procedu re 3. Disconnect the Fan cable and remove 2 sc rews (M2.5*4L (K)) then take away the CPU thermal module. 4. Turn the non-removabl e screw here 180 degrees counter-clockwise to loosen the CPU. 5. Squeeze the vacuum handling pump and use it to lift the CPU away.
Disassembly procedu re ODD Module OPTICAL DRIVE DEVICE The illustration below shows how to remove the ODD m odule. 1. Remove 1 screw (M2.5*4L (K )). ODD REMOVAL M2.
Disassembly procedu re K eyboar d KEYBOARD The illustration of below shows how to remove the keyboard. Removing Keyboard K/B REMOVAL 1. Push the 4 latches in (No.1, No.2, No.3, No.4) with a pair of tweezers or a single-slotted screwdriver and lift the keyboard plate up.
Disassembly procedu re Removing Keyboard Cable CABLE 1. Use a flexible connector t ool to unlock the cable connecto r on both ends (no. 1). REMOVAL 2. Carefully pull out the keyboard cabl e (no. 2) with a pair of tweezers. 3. Lock the connector (no. 3) agai n to avoid possible breakage.
Disassembly procedu re 2. Use a pair of tweezers to remove both hinge Cover. 3. Disconnect the LANCH cable and touchpad FFC on the top case. LANCH cable T ouchpad FFC 4.
Disassembly procedu re 5. Disconnect the Coaxia l & inverter cable. Coaxial cable Inverter ca ble 6. Arrange the Coaxial & inverter cable and antenna on the bottom case. BOTTOM CASE REMOVAL 7. Remove 15 screws (M2.5* 6L (K)) and 1 screw (M2.5*4L) (K)) on the bottom case.
Disassembly procedu re 8. Before separate the bottom case , remove a l ittle bit bottom case and let the cable and antennas through out of hole . Inverter & camera cable Antenna 9. Separate the bottom ca se from the top case. 10. Remove 2 screws (M2.
Disassembly procedu re 11. Separate the LCD module from the Top Case module 12. Remove 2 screws (M2.5*4L (K)) and take away the LANCH board. TOP CASE REMOVAL M2.
Disassembly procedu re 14. Disconnect the touch pad FFC and remove 1 piece of tape then take away the touch pad FFC. 15. Remove 5 screws (M2.5*4L (K)) and take away the touchpad bracket.
Disassembly procedu re Motherboar d MOTHERBOARD The illustrations below show how to di sassemble and remove the Motherboard. Removing Motherboard MOTHERBOARD REMOVAL 1. Remove 2 screws (M2.5*4L (K)). 2. Remove 2 screws for CRT on the ri ght side by a spacer screwdriver.
Disassembly procedu re 4. Disconnect the Bluetooth & Speaker cabl es then take away the Motherboard. 5. Remove 1 screw (M2* 3L (K)) on the IO bracket.
Disassembly procedu re 7. Remove 1 screw (M2*3L (K)) and take away th e TPM board . M2*3L 8. Remove 4 pieces of tapes and disconnect the modem cable. 9.
Disassembly procedu re Bottom Case Module BOTTOM The illustrations below show how to remove and disassem ble the Bottom case m odule. The module contains Bluetoot h board, speaker cable. CASE MODULE Disassembling Bottom case Module BOTTOM CASE DISASSEMBLY 1.
Disassembly procedu re L CD Module LCD MODULE The illustrations below show how to remove a nd disassemble the LCD m odule. The module contains LCD panel, Inverter board, LCD bezel, LCD back cover. LCD MODULE DISASSEMBLY Disassembling LCD Module 4. Remove 7 rubber pads and 7 screws (M2.
Disassembly procedu re 6. Disconnect the LCD cable. 7. Remove 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) and take away the LCD panel. M2.5*4L M2.
Disassembly procedu re 6. Remove 4 screws(M2*3L(K)) on the left LCD bracket to di sassemble the other LCD bracket. M2*3L 7. Remove 2 pieces of tapes and disconnect the coaxial cable then take it away .
Disassembly procedu re 9. Lift a little bit the inverter board and di sconnect the inverter cable and then t ake it away . 6. Remove 2 screws (M2x 6L) on both hinge and take them away .
Disassembly procedu re 7. Disconnect the camera cable and remove the microphone. 8. Remove the cable and remove mylar then take away the cable. 9. T ake away the Camera module from the LCD back cover . 10. Remove 1 screw (M2x 4L) and remove 3 pieces of t apes then take away the wireless black wire.
Disassembly procedu re 11. Remove 1 screw (M2x 4L) and remove 3 pieces of t apes then take away the wireless white wire. 2 - 24.
Assembly procedure Chapter 3 Assembl y Pr ocedur e Please follow the infor mation pr ovided in this section to perfor m the complete assembly procedur e of the note book.
Assembly procedure L CD Module LCD MODULE The illustrations below show how to asse mble and install the LCD module of the notebook. 1. Install the wireless wh ite wire module and secure 1 screw (M2x 4L) then paste 3 pieces of tapes to secu re it. LCD MODULE ASSEMBLY 2.
Assembly procedure 4. Install the microphone on the LCD cover and connect the camera cable. 5. Lay the inverter cable through the locking trench on the LCD back cover .
Assembly procedure 7. Inst all the both hinge on LCD back cover and secure 2 screws (M2x 6L) to secure them. 8. Install the inverter board on LCD back cover and connect the inverter cable.
Assembly procedure Assembly LCD Module 1. Connect the coaxial cable and paste 2 pieces of tapes to secure it. 2. Install the left LCD br acket and secure 4 screws (M2*3L (K)) to fix it. 3. Install the right LCD bracket and 4 screws(M2*3L(K)) and secure 4 screws (M2*3L (K)) to fix it.
Assembly procedure 4. Install the LCD p anel and secure 2 screws (M2.5*4L (K)) & 4 screws (M2.5*6L (K)) to secure it. M2.5*4L M2.5*6L 5. Connect the LCD cable. 6. Combine the LCD bezel and LCD Cover properly and press on all four edges until them snap into position.
Assembly procedure 7. Secure74 screws (M2.5 x 6L) on LCD front be zel then paste 7 rubber pads above. M2.5*6L Bottom Case Module BOTTOM CASE MODULE The illustrations below show ho w to assembly the Bottom case m odule. The module contains Bluetooth boar d, speaker cable.
Assembly procedure 2. Install the Bluetooth bo ard on the bottom case. 3. Connect the Bluetooth cable and lay it th r o ug h t he l o ck i n g t re n c h on b o t to m c as e . Motherboar d MOTHERBOARD The illustrations below show how to asse mble and install the motherboard of the notebook.
Assembly procedure 2. Connect the modem cable and paste 4 pi eces of tape to fix the cable. 3. Install the TPM board and secure 1 screw (M2*3L (K)) to secure it. M2*3L 4. Install the IO bracket a nd use a single-slotted screwdriv er to secure 2 screws HEX 5mm.
Assembly procedure 5. Secure 1 screw (M2* 3L (K)) on the IO br acket to secure it. M2*3L 6. Connect the Bluetooth & Speaker cables, before install the Motherboard to the bottom case. Bluetooth cable S p eaker cable 7. Combine the Motherbo ard and the bottom case.
Assembly procedure 9. Secure 2 screws (M2.5*4L (K)) to secu re the motherboard. T op Case Module TOP CASE MODULE The illustrations below show how to assemb le and install the top case module of the notebook. 1. Install the touc hpad on the top case. TOP CASE ASSEMBLY 2.
Assembly procedure 3. Connect the touch pad FFC and paste 1 piece of tape. 4. Connect the LANCH board cable. 5. Install the LANCH board and secu re 2 screws (M2.
Assembly procedure 1. Combine the Top case module and LCD module. 2. Secure 2 screws (M2.5 *6L (K)) to fix the hinge. 1. Combine the bottom ca se from the top case.
Assembly procedure 2. Before secure the botto m case, let the cable and ant ennas through in the hole. Inverter & camera cable Antenna 3. Secure 15 screws (M2.5*6L (K)) and 1 screw (M2 .5*4L) (K )) to secure the bottom case. 4. Lay the antennas through the locking trench on bottom case M2.
Assembly procedure 5. Connect the Coaxial & inverter cable and la y the cables through the locking trench on bottom case. Coaxial cable Inverter ca ble 6. Secure 1 screws (M2*3L (K)) to se cure cables. I M2*3L 7. Turn over the NB and connect the LA NCH cable and touchpad FFC on top case.
Assembly procedure 8. Install the both hinge Cover. HINGE COVER ASSEMABLY 9. Install the MIDDLE cover. 3 - 16.
Assembly procedure Assembling K eyboar d KEYBOARD The illustrations below show how to assemble and install the Keyboard of the notebook. KEYBOARD ASSEMBLY 1. Place the Keyboard module on front side of the top case. Then connect Keyboard FPC Cable with a pai r of tweezers.
Assembly procedure ODD Module ODD MODULE The illustrations below show how to asse mble and install the ODD Module of the notebook. 1. Insert the ODD module.
Assembly procedure 2. T urn the non-removable screw here 180 degrees clockwise to lock the CPU. 3 . Inst all the CPU therna l module gently and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. 4. Secure 4 screws (M2*3L (K)) by order .
Assembly procedure Assembling Memor y Module The illustrations below show how to assemb le and install the memory module to the notebook . MEMORY MODULE 1. Insert the Memory modul e into the memory socket by an angle of 30 degree, and push down to latch t he memory module.
Assembly procedure 2. Connect the MAIN & AUX antenna and paste 1 piece of tape to secure antennas. HDD Module HDD MODULE The illustrations below show how to assemb le and install the HDD module of the notebook 1. Secure 4 screws [M3 * 4(L) ] to fix HDD into HDD housing.
Assembly procedure 3. Install the bottom case and secure 3 screws (M2.5*4L(K )) to fix it. M2.5*4L Ba tter y Module BATTERY MODULE The illustrations below show how to install battery module of the notebook. 1. Install the battery module. Slide the battery latch to cl ose the battery l ock.
Upgrade & Replacement 4 – 1 Chapter 4 Upg r ade & R eplacement F ollow the indi vidual pr ocedur es in this chapter to perfor m the notebook’ s upgrade and r e placement of various major components. sus S62F Series Notebook is a 2 spindles p roduct, which means there are less options for you to upgrade to.
Upgrade & Replacement 4 - 2 CPU Upgr ade CPU TheS62F Series Notebook comes standar d with a Intel® Mi cro-FCPGA Socket on the motherboard, which means it can support all Intel Micro-FCPGA CPUs up to 2.13 GHz . Upgrading CPU Remove battery modu le 1.
Upgrade & Replacement 4 - 3 Removing CPU Module CPU REMOVAL 1. Remove 2 screws (M2.5*4L (K )), then remove the CPU door. 2. Remove 4 screws (M 2*3L (K)) by order. 1 2 3 4 M2.5*4L M2*3L 3. Disconnect the Fan cable and remove 2 screws (M 2.5*4L (K)) then take away the CPU thermal module.
Upgrade & Replacement 4 - 4 4. Turn the non-remo vable screw here 180 degrees counter-clockwise to loosen the CPU. 5. Squeeze the vacuum handling pump and use it to lift the CPU away. Installing CPU The illustration below shows how to in stall CPU and the heat sink of the notebook.
Upgrade & Replacement 4 - 5 3. Install the CPU thermal module gent ly and connect the fan cable then secure 2 screws (M2.5*4L (K)) to secure it. M2.5*4L 4. Secure 4 screws (M2*3L (K)) by order . 1 2 3 4 M2*3L 5. Install the CPU door and secure 2 screws (M2.
Upgrade & Replacement 4 - 6 Second Memor y Upgr ade MEMORY The S62F Series Notebook does not have RAM onboard. There are two SO- DIMM sockets for installing SO-DIMM RA M. It can upgrade the total memory size up to 1GB with a 512MB module on each socket.
Upgrade & Replacement 4 - 7 Removing Memory mo dule MEMORY REMOVAL 1. Remove 2 screws (M2.5*4L (K )), then remove the DIMM door. M2.5*4L 2. Open the 2 latches asi de (No. 1, 2), which will pop the memory module up to an angle of 30 ° , then pull out the memory modul e in that angle (No.
Upgrade & Replacement 4 - 8 2. Install the DIMM door and secure 2 screws (M2.5* 4L (K)) to secure it. M2.5*4L Install battery module 3. Install the battery modu le.
Upgrade & Replacement 4 - 9 HDD Upgr ade HDD The S62F Series Notebook uses an industry-standar d 2½” HDD with IDE interface. You can replace the HDD to any capacity of your choice within our approval and prior test. Upgrading HDD Remove battery modu le 1.
Upgrade & Replacement 4 - 10 Removing HDD Module HDD MODULE REMOVAL 1. Remove 3 screws (M2.5*4L (K )), then remove the HDD door. M2.5*4L 2. Lift the HDD module a nd then remove it.
Upgrade & Replacement 4 - 11 Installing new HDD module 4. Secure 4 screws [M3 * 4(L) ] to fix HDD into HDD housing. HDD INSTALLATION M3*4L 5. Insert the HDD module to connect t he FPC connector until it’s installed properly. 6. Install the bottom case and secure 3 screws (M2.
Upgrade & Replacement 4 - 12 W ir eless LAN Module WIRELESS The illustration below shows how to remove the Wireless LAN module. LAN Replacing WLAN Remove battery modu le WALN 1. Unlock and hold the latch No (1). REMOVAL 1 2. Slide the battery lock (No.
Upgrade & Replacement 4 - 13 Removing WALN Module 1. Remove 1 piece of tape and disconnect the MAIN & AUX antenna. ODD REMOVAL 2. And open the two latches to pop the MINI PCI MODULE up then pull it out. Installing new WALN module WALN MODULE INSTALLATION 3.
Upgrade & Replacement 4 - 14 4. Connect the MAIN & AU X antenna and paste 1 piece of tape to secure antennas. Install battery module 1. Install the battery module.
Upgrade & Replacement 4 - 15 ODD R eplacement ODD The S62F Series Notebook can suppor t DVD-ROM (8x DVD), COMBO (CD-R 24x/ CD-RW 24x / DV D-ROM 8x/ CD 24x), and DVD- Dual (DVD-R/RW: 4x/2x, DVD+R/RW: 4x/2.4x, CD-R/RW: 24x/ 10x, DVD: 8x, CD: 24x). Replacing ODD Remove battery modu le ODD REMOVAL 1.
Upgrade & Replacement 4 - 16 Removing ODD Module 1. Remove 1 screw (M2.5*4L (K )). ODD REMOVAL M2.5*4L 2. Push the ODD Module out by a pair of tweezers.
Upgrade & Replacement 4 - 17 4. Secure 1 screw (M2 .5*4L (K)) to secure i t. M2.5*4L Install battery module 5. Install the battery module. Slide the battery latch to clos e the battery l ock.
HARDWARE SPECIFICATION 5- 1 Har d war e Specifica tions You can enjoy and utilize the S62 series Notebook more effectively with a better compr ehension of detailed hardware specifications of the notebook. his chapter lists the detail ed specifications of the notebook’s main system and modules.
HARDWARE SPECIFICATION 5- 2 1 MARKETING SPEC S62F Specification (Two-Spindle Design) Product Family S62F Dimension 328 x 288x 27-38mm Weight 2.4 Color Silver-Gray CPU Type Intel Yonah 1M/2M Speed 1.
HARDWARE SPECIFICATION 5- 3 North Bridge INTEL 945GM South Bridge INTEL ICH7M Super IO SMSC LPC47N217 Thermal Sensor ADT7461ARMZ Micro-Processo r ITE8510E KBC ITE8510E Flash ROM (ISA) SST 4Mb Graphic .
HARDWARE SPECIFICATION 5- 4 Spec 56K I/F Azalia MDC Jack RJ-11 RJ-11 port ACPI Yes V.90 Yes Voice Phone No Digital Line Protection Yes Wake On Ring Yes BT No Controller CSR BT-183 I/F USB ANT Chip ant.
HARDWARE SPECIFICATION 5- 5 PC Speaker Volume Fn + F11 Volume de crease Number Lock Fn + Ins Scroll Lock Fn + Del Instant Keys Power Saving Power 4 Gear E-mail Direct button Internet Browser Direct button Disable TouchPad Direct button Status Indication 8 LEDs (Machine Base x 8) Power Status Yes (Green on LED when Power on.
HARDWARE SPECIFICATION 5- 6 Reset/Force Off Yes (Force O f f switch) I/O Port All ports support hot-plug Parallel NO CRT Yes 15-pin D-sub Port Bar port III Yes Mouse/Keyboa rd N O IrDA Port NO Fax/Mod.
HARDWARE SPECIFICATION 5- 7 PM On TBD. Power Management AMI BIOS LCD Close/Open Yes LCD Back-light Yes Suspend/Resume Yes Hibernation (S2D) Yes Thermal Control Yes DTS/Thermal diode ACPI Yes DMI 2.0 Yes Support DMI BIOS 2.1 Security Password Yes Password overridden by Master passwo rd Security Lock Kensington Lock Hole TPM Infineon TPM 1.
HARDWARE SPECIFICATION 5- 8 LAN Port Yes.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 9 2 CHIPSET LIST Chipset Summary Table Function S62F HW ACPI/PC99 CPU Intel Yonah Not required SRAM (L2 Cache) 2M N.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 10 2.1 CPU Processor Type: Intel Yonah Processor Processor frequency: 1.66 /1.83 /2.0/2.16 GHz Construction method: u-PGA479 wi th socket Supply voltage: Code:1.25V(High_Frequency_Mode )~0.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 11 2.2 CHIPSET 2.2.1 North Bridge Function: Full support 32bits AGTL+ host bus addressing Supports 400/533/667 DDR2.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 12 2.3.2 EXPANSION MEMORY Number of sockets: Bus: Supply voltage: Functional features: Hardware features: Two 200 pin SO-DIMM socket 64-bit data path 1.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 13 2.6 I/O INTERFACE Controller Function: Full ACPI 1.0 and PC98/99 compliant Support 10 IRQ channel options Integrated PC/AT Floppy Disk Controller Support 5.25”/3.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 14 2.7 PCMCIA Controller Function: PC99, ACPI 1.0 and PCI bus power management 1.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 15 2.9 AUDIO CODEC Function features: Fully Compliant HD Audio Com pliant. 20-bit Stereo Digital to Analog Converters. 18-bit Stereo Analog to Digital Converters. High-quality pseudo-Differe ntial CD in put.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 16 Vendor: Parts Number : Package: Realtek RTL8110SB 128-Pin LQFP 2.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 17 3 KEY PARTS LIST Key Parts Summary: S62F Project Keyparts List Priority Vendor Model No. ASUS Part No. CPU 1 Intel INT CO667 DC 2.16G T2600 L8VN 1 Intel INT CO667 DC 2.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 18 MDC 1 ASUS MODEM 56K Azalia(Green) 61-BMM011-01 CMOS Camera Module 1 YA HSIN N03P1BG_SM9 04G370030100 CHICONY CM.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 19 1 Delta SADP65KB-BFJ REV:01 04G266003163 SO-DIMM 512MB DDR2 533 1 UNIFOSA GU33512AGHYQ612L3P C 04G001616673 1 NA.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 20 3.1 Display WXGA Technology: Active color (TFT: Thin Film Transistor) Size: 14.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 21 Hardware features: Vendor/Model: Standard I/O addresses: 1F0h to 1F7h and 3F 6h Support of minimum IRQ 14 Suppor.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 22 3.5 Touch Pad Dimensions: Sensor effective areas: Interface: X/Y position resolution: Customizing: 65 mm(W) x 49 mm(H) x 2.82 mm(T) 62.5 mm(W) x 46.5 mm(H) PS/2 40 points / mm (graphics mode) Custom color can be printed on the sensor pad.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 23 Chemistry: Voltage: Capacity: Vendor: Duration: Charge Metho d: Charging Source: Gas-gauge: Li-ion rechargeable b attery Nominal 11.1V (= 3.7V cell 3pcs in se rial , 2pcs in parallel) 2400mAH/Cell Celxpert Minimum 4 hour (w/o PMU) Fast Charge: 2.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 24 Regulatory: EMI: Safety: FCC Class B CISPR 22 Class B .Dimension: (L) 114.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 25 4 SYSTEM 4.1 System diagram.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 26 4.2 Main components block diagrams.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 27 4.3 System resource 4.3.1 IRQ Map IRQ# Description IRQ 0 System Timer IRQ 1 Keyboard IRQ 2 [Cascade] IRQ 3 IrDA .
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 28 4.3.3 PCI INT Map INT Description INTA Giga LAN Chip INTB CARDBUS, 1394, INTC INTD 4.3.4 PCI Bus Master Map REQ Description REQ0 CARDBUS, 1 394 REQ1 REQ2 LAN REQ3 Non e REQ4 Non e 4.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 29 5 I/O PORT PIN ASSIGNMENT No FUNCTION DESCRIPTION .CRT Display (Analog) HDD ODD LCD KEYBOARD TOUCHPAD&LED 1 ST BATTERY .DC IN Adapter Input .AUDIO Headphone, Microphone-I n .
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 30 3 BLUE Video (analog) Blue this DAC analog output drives the CRT interface.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 31 5.2 Hard disk pin assignment Vendor Part No. Pin No. ALLTOP C17851-144A1-L 44 Pin (SMT) No.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 32 19 GND Ground P 18 PIORDY_3S Primary disk IO channel ready I 17 CSEL Cable select (device configuration) O 16 PD.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 33 13. IDE_PDD4 14. IDE_PDD12 15. IDE_PDD3 16. IDE_PDD13 17. IDE_PDD2 18. IDE_PDD14 19. IDE_PDD1 20. IDE_PDD15 21. IDE_PDD0 22. IDE_PDDREQ 23. GND 24. IDE_PDI OR# 25.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 34 5.4 LCD pin assignment Vendor Part No. Pin No. ENTERY 3761-Q30C-01R 30 Pin (SMT) No.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 35 26 EDID_CLK EDID Clock I 27 PID_0 Panel ID bit 0 I 28 EDID_DAT EDID DATA I 29 LCD_VCC +3V power supply P 30 LCD_.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 36 5.5 Internal keyboard pin assignment Vendor Part No. Pin No. ENTERY 6905-E28N-00R 28 Pin (SMT) No Signal Descrip.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 37 26 KEYDETECT0 Keyboard ID bit 0 I 27 GND Ground GND 28 KEYDETECT1 Keyboard ID bit 1 I 5.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 38 5.7 1 ST Battery pin assignment No Signal Description Type 1 BAT_CON Battery input/output voltage P 2 BAT_CON Ba.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 39 2 INTSPKR- Internal spea ker left sound negative O 3 INTSPKL+ Internal speaker signal channel positive O 4 INTSPKL- Internal speaker left sound negative O 5.9.2 Headphone Jack Vendor Part No.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 40 5.10 Fan Pin Assignment Vendor Part No. Pin No. ACES 85205-03701 3 Pin (SMT) No Signal Description Type 1 +5VS_FAN 5V Power Supply P 2 FANSP1 FAN speed signal inp ut I 3 GND Ground P 5.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 41 17 GND Ground P 18 INTMIC_A _GND Audio Ground P 19 GND Ground P 20 INVMIC_A Internal MIC I *** 5.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 42 4 LTPA0+ Twisted-pair cabl e A positi ve I/O 5.14 USB pin assignment Vendor Part No.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 43 ALLTOP C10089-112A4-Y 12 Pin (DIP) No Signal Description Type 1 None None NC 2 RJ11_RING Modem signal I/O 3 RJ11.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 44 12 MS_CD 13 MS_DATA3 14 SD_CMD 15 MS_SCLK 16 MS_VCC 17 SD_DAT3 18 GND 19 SD_DAT2 20 SD_WP 21 SD_CD 6 POWER MANAGEMENT 6.1 System power plane Power Group Power Control Pin Controlled Dev i ces +12V SUSC# Control +5V SUSC# PCMCIA Slot 5V, USB +3.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 45 6.2 Power management mode 6.2.1 Full-On mode All system devices are not power manag ed and the sy stem can respond to applications with maximum performance. 6.2.2 Doze mode The CPU clock is slo w do wn but all oth er devices are full on.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 46 IRQ 1-15 Stand by Stand by Time out Stand by hot key pressed Predefined Memory/IO range access Battery Warning B.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 47 6.3.1 Lid switch Display mode State Lid close Lid open Full on LCD OFF No action Stand by LCD OFF No action LCD .
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 48 Super I/O ON Power down Powe r Off Power Off Audio CODEC ON ON Power Off Power Off Audio Amplifier ON Power down.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 49 6.4.1 Device PM control duri ng Stand By mode Device Po wer Controlled by Description CPU Ha rdware Controlled b.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 50 6.4.2 Device PM control duri ng STR mode Device P owe r D own Contro lled by Description Super I/O Hardware Powe.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 51 6.4.3 Device PM control duri ng STD mode Device P owe r D own Controlled by Description Core Logic Hardware Powe.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 52 7 MODULE SPECIFICATION 7.1 Overall System The notebook system consists of the follo w ing PCB assembly and modules.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 53 7.3 Main board 7.3.1 Main system module spec Feature: CPU socket, Intel 945GM, Intel ICH7M, Clock generator, SDR.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 54 7.3.2 DC/DC module spec Controller: MAX1987, TPS5130, LTC37 28, TL494 Input voltage: 8-20V Output voltage/current: Voltage Current Ripple Regulation +5V/+5VS 4.5A 75mV +-3% +3.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 55 Input: Adapter Contain Min Typ. Max Charge c urrent (3S3P) Charge c urrent (3S2P) Ripple & Noise 500mV Efficiency 90% 7.4 Inverter Board Inverter spec Input voltage: 12~20V Output current: 6.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 56 7.5 Adapter spec 7.5.1 Input Input voltage: 90~240VAC, Full range Input frequency: 47~63Hz Input current: 1.5A(max)/100VAC Inrush current: 60A(max)/100VAC, 120A(max)/2 40VAC Efficiency: 80%(min) 7.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 57 7.7 LAN Spec Controller: REALTEK RTL8110SB Interface: PCI Compliant to PCI 2.2 Support ACPI , PCI power management Support for Wake-On-LA N duri ng S3,S4 Integrated IEEE 802.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 58 8 MISCELLANEOUS 8.1 Indicators Power LED Feature: Type: Color: Show System power status 5 ψ LED Green Indication: On: System in ON Mode Flash (0.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 59 Indication: On: RF on Off: No ststus Location: On board Hard Disk Driv e LED Feature: Type: Color: Location: On:.
S 62F Hard ware Technical Specification R ev. 1.0 06/03/28 ASUSTeK Confidential Page 60 Europe P-CORD 1.8m 250V 2.5A EUR 2-PIN WS-027 -T Well shin Austria P-CORD 1.8m 250V 2.5A AUS 2-PIN WS-027-T Well shin South Asia P-CORD 1.8m 125V 7A WS016+WS027 WS-027-T Well shin 8.
BIOS SPECIFICA TION 6-1 Softw ar e Specifica tions Get to know more ab out theS62Fseries Notebook with a detailed look at the software specifications. he informatio n contained in the chapter c an be quite useful w hen you are troubles hooting the syste m’s hardware.
BIOS SPECIFICA TION 6-2 1. General Description The specification is a guid eline for BIOS development on S62F pl atform. Anyone who needs the informat ion of s ystem BIOS c an re ad it for r efer ence.
BIOS SPECIFICA TION 6-3 2. Summary of Hardware Configuration 2.1 KEY COMPONENTS LIST The key components used on S62F are lis ted below . T able 2-1 Key components Item V endor Part’ s Name R evisio n CPU Intel Y onah 1.
BIOS SPECIFICA TION 6-4 One IEEE 1394 B Type Jack One PCMCIA One Memory card reader(SD /MMC/MS) Power Supply AC adapter : Output : 19 VDC, 3.4 2A, 65W , Input : 100~240V AC, 50/60Hz universal Battery Pack : Main : Li-I on 6 cells, 1 4. 8V , 4800mAh, 65W battery pack Run-do wn life 5.
BIOS SPECIFICA TION 6-5 USB1 Intel 0 29 1 8086h 27C9h 1043h 1297h USB2 Intel 0 29 2 8086h 27CAh 1043h 1297h USB3 Intel 0 29 3 8086h 27CBh 1043h 1297h U S B 2 .
BIOS SPECIFICA TION 6-6 3. Summary of BI OS R equirements Item Description BIOS V endor AMI Revision 8.0 Implemented Specification PCI Express 1.0 , ACPI 1.
BIOS SPECIFICA TION 6-7 4. BIOS Features 4.1 SYSTEM SECURITY The functions of all passwords are listed in following table. T able 4-1 Password Function Password Function User Supervisor Hard Disk Acce.
BIOS SPECIFICA TION 6-8 The configuration index /data I/O ports are 2Eh/2Fh. And only Parall el Port function is enabled b y BIOS. The Parallel Port Mode can be adjusted in BIOS SETUP MENU during POST . T able 4.4 shows all modes supported by BIOS. T able 4.
BIOS SPECIFICA TION 6-9 LA N Con tr oll er Dynamic D800~ D8FF IRQ16 FE8FEC00~ FE8FECF F Wirel ess (802.1 1abg) St a tic IRQ 17 FDFFF000~ FDFFFFFF Ricoh MS Dynamic IRQ19 FE8FF000~ FE8FF0F F Ricoh SD Dynamic IRQ19 FE8FF400~ FE8FF4F F Note: The resources of dynamic devic es will be changed if users c hange the settings.
BIOS SPECIFICA TION 6-10 Power Scheme AC P ow er DC Power Home/office Desk N one Adap tiv e Portable/Laptop Adaptive Adaptiv e Presentation Adaptive Degrade Al ways On Non e None Minimal Power Managem.
BIOS SPECIFICA TION 6-1 1 THRM Throttle On Threshold 95 CPU THRM_ON THRM Throttle Off Threshold 90 CPU THRM_OFF Fan Failure T emp Point 65 CPU F ANERR Fan S top Threshold 50 CPU FSP STEP T rip Point 1.
BIOS SPECIFICA TION 6-12 4.8 NUMERIC P AD CO NT RO L There is a control switch in setup menu item for enabli ng or disabling numeric pad lock of an internal keyboard. 4.9 T OUCH P AD CONTROL In ACPI environment, BIOS will notify A TK0100 to enable/disable T ouch Pad when the T ouch Pad Enable/Di sa ble in st ant ke y is presse d .
BIOS SPECIFICA TION 6-13 5. GPIO Pin A s si gnment The following tables are the definition of GPIO pins . Some of GPIO pins need to be initialized by system BIOS and some of them need the driver to sup port. Please check the Description column for reference.
BIOS SPECIFICA TION 6-14 41 N/A GPIO41 N/A N/A N/A 42 N/A GPIO42 N/A N/A N/A 43 N/A GPIO43 N/A N/A N/A 44 N/A GPIO44 N/A N/A N/A 45 N/A GPIO45 N/A N/A N/A 46 N/A GPIO46 N/A N/A N/A 47 N/A GPIO47 N/A N/A N/A 48 O GPIO48/GNT4# GNT4# M Native Function 49 O CPUP WRGD H_PWRGD M Processor I/F power well 1.
BIOS SPECIFICA TION 6-15 T able 5-2. KBC GPIO Definition Port I/O Ty p e Input Pin Pull-up/down Name Output Pin Default V alue Description A.0 O BRIGHT_PWM Low Used to adjust LCD backlight A.1 NC A.2 O BA T 1_CNT 1# High BA T1 _CNT1# s ignal to b atter y A.
BIOS SPECIFICA TION 6-16 G. 0 A FA 1 6 T o FLASH I/F G. 1 A FA 1 7 T o FLASH I/F G. 2 A FA 1 8 T o FLASH I/F G. 3 NC G. 4 O THRM_CPU# Lo w THRM_CPU# signal from exter nal thermal sensor G. 5 NC G. 6 I PMTHERM# Low PMTHERM# signal to ICH7-M G. 7 NC H.0 O VSUS_ON Low VSUS_ON signal to power circuit H.
BIOS SPECIFICA TION 6-17 T able 5-3. Super I/O GPIO Definition PIN# GPI O I/O T ype Name Ac ti vat ed Level Description 23 40 I NC NC N/A 24 41 I NC NC N/A 25 42 I NC NC N/A 27 43 I NC NC N/A 28 44 I .
BIOS SPECIFICA TION 6-18 6. Devices 6.0 CPU The CPU supported by S62F s ystem is Intel mobile Y onah dual core process or . The supported frequency is from 1.
BIOS SPECIFICA TION 6-19 001 -> IRQ10 010 -> IRQ1 1 01 1 -> R eser ved 100 -> IRQ20(Only available if APIC enabled) 101 -> IRQ21(Only available if APIC enabled) 1 10 -> IRQ 22(Only available if APIC enabl ed) 1 1 1 -> IRQ23(Onl y available if APIC enabled) 6.
BIOS SPECIFICA TION 6-20 6.2.3 IDE Controller 6.2.3.1 Function and Feature The ICH7-M IDE controller features two sets of interface signals(Primary and Secondary) that can be independently enabled, tri- stated or driven low . The ICH7-M IDE controller supports both legacy mode and native mode IDE interfac e.
BIOS SPECIFICA TION 6-21 same register , c ausing the USB 1.1 controller t o see a connect event and the EHC to see an ‘electrical’ disconnect event. The UHCI driver and hardware handle the connection and initializatio n process from that point on.
BIOS SPECIFICA TION 6-22 7. CMOS Setup Utility S 62F system BIOS allo ws users to change some s ystem hardware/function setti ngs during POST (power on self test) stage, users may hit F2 key to enter SETU P m ode in POST , the setup feature is categorized into 7 menus described as belo w: 7.
BIOS SPECIFICA TION 6-23 7.2 ADV ANCED MENU : In advanced menu, users can configure I/O device resourc e such as I/O base, interrupt vector or DMA(Direct Memory Acc ess) channel, some auxiliar y settings may be changed as well.
BIOS SPECIFICA TION 6-24 7.2.1 IDE Configuration: 7.2.1.1 Primary Master/Slave IDE At system boot, the Intel Ultra A T A S torage Driv er configures each A T A/A T API device to trans fer data at particular transfer modes.
BIOS SPECIFICA TION 6-25 7.2.2 SuperIO Configuration: Users can enable/disable Parallel por t function and set Parallel Port mode in this page. The Parallel Port modes supported by this system are listed below. 1. SPP/Bi-Directional 2. EPP/SPP 3. ECP 4.
BIOS SPECIFICA TION 6-26 7.3 SECURITY MENU: BIOS supports two levels of password for security protection: Supervisor p assword : Users may set, change or e rase system password, the password data is saved in non-volatile device (CMOS), s ystem password check is done during POST(Power On Self T est).
BIOS SPECIFICA TION 6-27 7.4 POWER MENU: LCD Power Sa ving : LCD exhausts the most part of power while the system is operatin g. S1A notebook s ystem BIOS support auto backlight sav ing mode.
BIOS SPECIFICA TION 6-28 7.5 BOOT MENU: In this menu users c an decide the boot sequence, as long as t he device with highest boot pri ority exists, system BIOS will boot from it, device boot priorit y is adjusted by pressing “+”,”-“ or space ke y on the selected (highlight ed) item.
BIOS SPECIFICA TION 6-29 7.6 EXIT MENU: Exit BIOS setu p, users ma y make final decision if they want to sa ve the chan ge just ma de, or load BIOS defau lt setting, lists a re: Save changes and Exit .
BIOS SPECIFICA TION 6-30 8. BIOS Flash Utility There are two utilities f or updating S62F BIOS. One is DO S mode utility and the other is Windo ws mode utility . The detailed information is in T able 8-1. T able 8-1: BIOS Flash Utilities Utility Name Supported O S Revision Aflash2 DOS 2.
BIOS SPECIFICA TION 6-31 9. Embedded Controller (EC) 9.1 HOTKEYS S62F support ed Fn+Hotkeys are listed i n following table. T able 9-1 Fn+ Hotkey T able Fn+ Hotkey L egacy AC PI Descri ption Fn+F1 N/A SC I St andby In ACPI OS, user need s to set sleep but ton behavior t o “S tandby” in pro pe rty o f Power Option.
BIOS SPECIFICA TION 6-32 When press ing Internet instant key , BIOS will notify A TK to la unch Internet browser applicatio n. 9.3.3 Email Key When pr essing Email instant key , BIOS will noti fy A TK to launc h email application.
An important point after buying a device Asus S62F (or even before the purchase) is to read its user manual. We should do this for several simple reasons:
If you have not bought Asus S62F yet, this is a good time to familiarize yourself with the basic data on the product. First of all view first pages of the manual, you can find above. You should find there the most important technical data Asus S62F - thus you can check whether the hardware meets your expectations. When delving into next pages of the user manual, Asus S62F you will learn all the available features of the product, as well as information on its operation. The information that you get Asus S62F will certainly help you make a decision on the purchase.
If you already are a holder of Asus S62F, but have not read the manual yet, you should do it for the reasons described above. You will learn then if you properly used the available features, and whether you have not made any mistakes, which can shorten the lifetime Asus S62F.
However, one of the most important roles played by the user manual is to help in solving problems with Asus S62F. Almost always you will find there Troubleshooting, which are the most frequently occurring failures and malfunctions of the device Asus S62F along with tips on how to solve them. Even if you fail to solve the problem, the manual will show you a further procedure – contact to the customer service center or the nearest service center
