Instruction/ maintenance manual of the product 653745-001 HP (Hewlett-Packard)
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HP Pr oL ian t DL5 8 5 G7 S er v er Maint enance and S er v i ce Guide Part Number 6 17690 - 002 August 2010 (Second Ed ition).
© Copyright 2010 Hewlett- Packard Development Company, L.P. The information c ontaine d herein is subject to change without notice. The only warranties for HP products and serv ices are set forth in the express warranty statements accompanyin g such products and services.
Con tents Customer self repair ...................................................................................................................... 5 Parts only warranty service .......................................................................
System board ......................................................................................................................................... 66 SAS backplan e ..................................................................................
Customer self repair 5 C u st omer s elf r epair HP products are de signed with many Customer Self Repair (CSR) parts to minimize repair time and allow for greater flex ibility in performing defe ctive parts replacement.
Customer self repair 6 Obligatoire - P ièces pour lesquelles la ré paration par le client est ob ligatoire. Si vous demand ez à HP de remplacer c es pièces, les c oûts de déplacemen t et main d'œuv re du service vo us seront facturé s. Facultatif - Piè ces pour lesquell es la réparati on par le client est facultative.
Customer self repair 7 NOTA: alcuni comp onenti HP non sono p rogettati per la riparazion e da parte del cliente. Per r ispettare la garanzia, HP ric hiede che queste parti sian o sostituit e da un centro di assi stenza autori zzato. Tali part i sono identifica te da un "No" nel Catalogo illustrat o dei componenti.
Customer self repair 8 anrufen und s ich von einem Mitarbeiter per Te lefon helfen l assen. Den Materia lien, die mit einem CSR - Ersatzteil g eliefert werde n, können Sie en tnehmen, ob da s defekte Teil an HP zurückgeschic kt werden muss .
Customer self repair 9 Centro de asistenci a técnica de HP y recibirá ayu da telefónica por parte de un técnico. Con el enví o de materiales para la su stitución de componentes C SR, HP especificará si los c omponentes defectuos os deberán devolverse a HP .
Customer self repair 10 bijbehoren de documentati e worden geret ourneerd in het m eegeleverde ver pakkingsmater iaal. Als u het defecte ond erdeel niet teru gzendt, kan HP u v oor het vervang ende onderdeel ko sten in rekeni ng brengen.
Customer self repair 11 Se r v iço de gar anti a a pena s par a peças A garantia limitada da H P pode incluir um s erviço de garantia apenas par a peças. Segundo os t ermos do serviço de garanti a apenas para peças, a HP fo rnece as peças de re posição sem cobrar nenhu ma taxa.
Customer self repair 12.
Customer self rep air 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 I llus tr ated parts catalog M echanical co mponents Item Description Spare part number Customer sel f repair (on page 5 ) 1 Plastics ki t 604055 - 001 — a) Bezel — Ma.
Illustrated parts catalog 17 Item Description Spare part number Customer sel f repair (on page 5 ) e) Blank, pow er supply — Mandatory 1 f) Badge, product name* — Mandatory 1 g) Baffle, DIMM* — .
Illustrated parts catalog 18 1 Mandatory: Obl igatorio — com ponentes para los que l a reparación por pa rte del usuario e s obligatoria. S i solicita a HP que realice la sustitución de estos compo nentes, tendrá que hacerse cargo de los gastos de desplazamien to y de mano de obra d e dicho servicio.
Illustrated parts catalog 19.
Illustrated parts catalog 20 S ystem components Item Description Spare part number Customer self repair (on page 5 ) 6 Power supp ly, 1200 W 498 152 - 001 Mandatory 1 7 Fan, 92 - mm, hot -plug 591208 .
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5 ) 11 I/O enable r, with tray 604049 - 001 Optiona l 2 12 PCI - X/PCI Express I/O e xpansion board 604051.
Illustrated parts catalog 22 Item Description Spare part number Customer self repair (on page 5 ) 27 Hot - plug SAS hard drive* — — a) 36 - GB, 10,000 - rpm, 6.35 - cm (2.5 - in) 376596 - 001 Mandatory 1 b) 36 - GB, 15,000 - rpm, 6.35 - cm (2.5 - in) 432322 - 001 Mandatory 1 c) 72 - GB, 10,0 00 - rpm, 6.
Illustrated parts catalog 23 2 Optional: Optiona l — Teile, für die das Customer Self Repair - Verfahren optional ist. Diese Teile sind auch für Custome r Self Repair ausgelegt.
Illustrated parts catalog 24.
Removal an d replacement procedures 25 R emo v al and r eplacemen t pr ocedur es R equired tools You need the following it ems for some procedur es: • Torx T - 15 screwdrive r (provided with the ser.
Removal an d replacement procedures 26 WARNING: To redu c e the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touchi ng them. CAUTION: Do not operate the server for long periods with the access panel open or removed.
Removal an d replacement procedures 27 IMPORTANT: Pressing the UID button ill uminates the blue UID LEDs on the front and rear panels. In a rack environment, this feature facilitates locating a server when moving between the front and rear of th e rack.
Removal an d replacement procedures 28 3. After performing the installation or maintenance procedure, s lide the server into the rack by pressing the server ra il - release latche s. R em ove the server f rom the rack WARNING: The server weighs app roximately 36.
Removal an d replacement procedures 29 o Extend the server from the rack (on pag e 27 ). 2. Open the locking latch, slide the access panel to the rear o f the chass is, and remove the access panel. If the locking lat ch is locked, use a T - 15 Torx screwdriver to unlock the latch.
Removal an d replacement procedures 30 4. Firmly holding the processor me mory drawer, press the release bu ttons and then remove th e drawer from the server. R emove the tray 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer (on page 29 ).
Remo val and replacemen t procedures 31 4. Remove the tray. To replace th e component, rev erse the remova l procedure. R emove the SPI boar d To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 27 ).
Removal an d replacement procedures 32 5. Raise the lev ers, and lift t he SPI board from t he server. 6. Remo ve all components from the failed SPI board.
Removal an d replacement procedures 33 I /O enabler board 1. Power down the serv er (on page 26 ). 2. Remove the p rocessor memor y drawer (on page 29 ). 3. Remove the p rocessor memor y drawer cover. 4. Remove the tray containing the I/O enabler board (" Remove the tray " on page 30 ).
Removal an d replacement procedures 34 CAUTION: When installing the tray with the secondary process or memory board, be sure that all DIMM latches on t he primary processor memory board are in the fully -l ocked position. Failure to do so results in damage to the primary processor memo ry board.
Removal an d replacement procedures 35 To replace the compon ent: 1. Clean the old therm al grease from the top of the processor with the alcohol swab. Allow the alcohol to evaporate before cont inuing. 2. Remove the h eatsink prote ctive cover. 3. Install the heatsink.
Removal an d replacement procedures 36 H eatsink on the secon dary processor memory board To remove the component: 1. Power down the serv er (on page 26 ).
Removal an d replacement procedures 37 2. Remove the h eatsink prote ctive cover. 3. Install the heatsink. 4. Install the proce ssor memory drawer cover. 5. Install the processor me mory drawer. 6. Power up the server. P rocessor on the primary processor m emory board The process ors and memory a re stored in a mod ule at the front of th e server.
Removal and replacement procedures 38 CAUTION: To help avoi d damage to the proc essor and system board, do not instal l the processor without u sing the processor ins tallation tool. CAUTION: To prevent po ssible server malfuncti on and damage to the equ ipment, multiprocessor configurations must contain processors with the same part number.
Removal an d replacement procedures 39 5. Using your fi ngers, remove the failed proce ssor. To replace the compon ent: IMPORTANT: Be sure the proces sor remains ins ide the processor installation t ool. 1. If the processor has separated from the installation tool, carefull y re - insert the processor in the tool.
Removal an d replacement procedures 40 3. Press down fir mly until the processor insta llation tool clicks and separ ates from the processor, and then remove the pr ocessor installation too l.
Removal an d replacement procedures 41 4. Close the processor retaining latch and the processor socket retaining bracke t. 5. Clean the old thermal greas e from the heatsink with th e alcohol swab. Allow the al cohol to evaporate before con tinuing. 6.
Removal an d replacement procedures 42 7. Install the heatsink. CAUTION: When installing the tray with the secondary process or memory board, be sure that all DIMM latches on the primary proces sor memory board are in the f ully - locked position. Failure to do so results in damage to the primary processor memo ry board.
Removal an d replacement procedures 43 To remove the component: 1. Power down the serv er (on page 26 ). 2. Remove the h eatsink. 3. Open the processor retaining latch and the processor socket reta ining bracket.
Removal an d replacement procedures 44 4. Using your fi ngers, remove the failed proce ssor. To replace the compon ent: IMPORTANT: Be sure the processor rema ins inside the processor in stallation tool. 1. If the processor has separated from the installation tool, carefull y re - insert the processor in the tool.
Removal an d repla cement procedures 45 3. Press down fir mly until the processor insta llation tool clicks and separates fr om the processor, and then remove the processor installation tool.
Removal an d replacement procedures 46 4. Close the processor retaining latch and the processor socket retaining bracke t. 5. Clean the old therm al grease from the hea tsink with the alcohol swab . Allow the alcohol to evaporate before con tinuing. 6.
Removal an d replacement procedures 47 7. Install the heatsink. 8. Install the proce ssor memory drawer cover. 9. Install the processor me mory drawer. 10. Power up th e server . D IMMs on the primary processor memory board To remove the component: 1.
Removal an d replacement procedures 48 5. Remove the D IMM baffle. 6. Remove the fa iled DIMM: a. Open the DI MM slot l atches. b. Remove the D IMM. To replace the compon ent: 1.
Removal an d replacement procedures 49 b. Install the DIMM. 2. Install t he DIMM b affle. 3. Install the tray. 4. Install the proce ssor memory drawer cover. 5. Install the processor me mory drawer. 6. Power up the server. D IMMs on the seconda ry processor memory b oard To remove the co mponent: 1.
Removal an d replacement procedures 50 4. Remove the D IMM baffle. 5. Remove the fa iled DIMM: a. Open the DI MM slot latches. b. Remove the D IMM. To replace the compon ent: 1.
Removal an d replacement procedures 51 b. Ins tall the DIMM. 2. Install th e DIMM baffle. 3. Install the proce ssor memory drawer cover. 4. Install the processor me mory drawer. 5. Power up the server. P ower su pply blank Remove the compone nt as indicated.
Removal an d repl acement procedure s 52 To confirm the redundancy of your configuration, see t he HP power advisor at the HP we bsite ( http://www.h p.com/go/hppoweradv isor ). WARNING: To reduce the risk o f electric shock or damage to the eq u ipment: • Do not disable the power cord grounding plug.
Removal an d replacement procedures 53 7. Remove the S ystems Insight Display assem bly. To replace the compon ent, reverse the removal pr ocedure. F an To remove the component: 1. Extend the server from the rack (on pag e 27 ). 2. Remove the a ccess panel (on page 28 ).
Removal an d replacement procedures 54 F an louver To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 27 ). 3. Remove the a ccess panel (on page 28 ). 4. Remove the fa n (" Fan " on page 53 ).
Removal an d replacement procedures 55 4. Release th e latches on the rel ease lever. 5. Lower the ha ndle, and th en extend the proce ssor memory dra wer from the serv er until the relea se latches catch. 6. Remove any expansion boards from the fai led I/O expansion board (" Non - hot - plug expansion board " on page 58 ).
Removal an d replacement procedures 56 o PCI- X/PCIe Express I/O expansion board o PCIe Express I/O expansion board To replace th e component, rev erse the remova l procedure. DVD- ROM drive To remove the component: 1. Power down the ser ver (on page 26 ).
Removal an d replacement procedures 57 3. Remove the a ccess panel (on page 28 ). 4. Disconnect the cable from the rear of the DVD - ROM drive . 5. Remove the DVD - ROM driv e. To replace th e component, rev erse the remova l procedure. S olid state drive To remove the component: 1.
Removal an d replacement procedures 58 To replace th e component, rev erse the remova l procedure. E xpansion slot cover CAUTION: To prevent i mproper cooling and thermal damage, do not oper ate the server unless all expansion slots have either an expans ion slot cover or an expansion board installed.
Removal an d replacem ent procedures 59 4. Open the expansion slot latch. 5. Disconnect any cables attached to the expansion board. 6. Remove the retaining screw. 7. Remove the expansion bo ard. To replace th e component, rev erse the remova l procedure.
Removal an d replacement procedures 60 • Recovery of cache d data from a failed server (" Recovering data from the batter y - backed write c ache " o n page 61 ) CAUTION: Do not detach the c able that connects the battery pack to the cache modu le.
Removal an d replacement procedures 61 R emoving the BBWC battery pack CAUTION: After the server is powe red down, wait 15 seconds and then check the amber LED before unpl ugging the cable fr om the cache mod ule. If the amber LED blinks after 15 seconds, do not re move the cable from t he cache module.
Removal an d replacement procedures 62 1. Perform one of th e following: o Set up a recovery s erver station using an i dentical server model. Do not install any internal drives or BBWC in this server.
Removal an d replacement procedures 63 To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 27 ).
Removal an d replacement procedures 64 R emoving the FBWC capacitor pack CAUTION: After the server is powe red down, wait 15 seconds and then check the amber LED before unpl ugging the cable fr om the cache mod ule. If the amber LED blinks after 15 seconds, do not re move the cable from t he cache module.
Removal an d replacement procedures 65 The SPI board is re moved for clarity. To replace th e component, reve rse the removal procedure . Battery If the server no longer automatically displays the co rrect date and time, you may need to replace the battery that provides power to the real - time clock .
Removal an d replacement procedures 66 5. Remove the battery. To replace th e component, rev erse the remova l procedure. For more information about battery replaceme nt or proper disposal , contact an authorized re seller or an authorized service provider.
Removal an d replacement procedures 67 8. Remove the I/O ex pansion board, if instal led (" I/O expansion board " on page 54 ). 9. Remove the system boar d. To replace a sys tem board: 1. Install th e spare system bo ard. 2. Replace all components removed from the failed s ystem board.
Removal an d replacement procedures 68 WARNING! WARNING! WARNING! The serial number is loaded into the system during the manufacturing process and should NOT be modified. This option should only be used by qualified service personnel. This value should always match the serial number sticker located on the chassis.
Removal an d replacement procedures 69 P ower su pply backplan e WARNING: Only authorized technicians trained by HP should attempt to replace the power supply backplane. To remove the component: 1. Power down the serv er (on page 26 ). 2. Extend the server from the rack (on pag e 27 ).
Diagnostic tool s 70 D i agno sti c tools T roubleshooting resources The HP ProLiant Serv ers Troubleshooting Guid e provides procedure s for resolving common prob lems an d comprehensiv e courses of .
Diagnostic tool s 71 Survey functionality is installed w ith every SmartStart - assisted HP Insight Diagnosti cs installation, or it can be installed through the HP PSP. NOTE: The current version of SmartStart provides the memory spare part numbers for the server.
Diagnostic tool s 72 U SB support HP provides both stan dard USB 2.0 support and le gacy USB 2.0 support. Standa rd support is provide d by the OS through the appropriate USB device dri v ers. Befor e the OS loads, HP provides sup port for USB devices thro ugh legacy USB support, which is enabled by def ault in the system RO M.
Server component identification 73 S er v er compone nt i dentif i cati on F ront panel comp onents Item Description 1 Serial and PI D tag 2 Optical drive 3 Systems Insig ht Display 4 USB connect ors .
Server component identification 74 F ront panel LEDs and b uttons Item Description Status 1 UID button and LED Blue — Act ivated Blue (flashing) — Server being managed remotely Off — Deactiva te.
Server component identification 75 S ystems Insight Disp lay The Systems Insight Display LEDs represent the serve r and component layout. LED Description AMP status Off — No protection Green — Pro.
Server component identification 76 R ear panel comp onents Item Description Item Description 1 Power supply ba y 4 (optional) 15 Expansion slot 2 (opt i onal) 2 Power supply ba y 3 (optional) 16 Expan.
Server component identification 77 R ear panel LEDs and b uttons Item Description LED color Status 1 iLO 3 NIC Activity LED Green On or flashing — Network activity Off — No network a ctivity 2 iLO.
Server component identification 78 P ower su pply LED Power LED St atus Off No AC power to p ower supply un its Green AC is present. Standby output i s on, output is disabled. Green AC is present. Standby output i s on, power supply DC output is on and OK.
Server component identification 79 S ystem board c omponents Item Description 1 Optional I/O ex pansion board conne ctors: • PCI - X/PCI Express I/ O expansion bo ard • PCI Express I/O expansion b.
Server component identification 80 S ystem maintena nce switch The system maintenance switch (SW5) is an ten - position switch that is used for system configura tion. The default position for a ll ten positions is Off. Position Descript ion Function S1 iLO 3 Security Off = i LO 3 security is enabled.
Server component identification 81 S PI board compo nents Item Description 1 Mini SAS conn ectors (2) 2 SAS cache connector 3 TPM conne ctor 4 Fan data connect or 5 RMII con nector 6 SD card s lot 7 B.
Server component identification 82 I /O expansion board components • PCI- X/PCI Express I/O expansion board Item Description 1 Slot 6 PCIe 2 x16 (16, 8, 4, 2, 1) 2 Slot 5 PCIe 2 x8 (8, 4, 2, 1) 3 Sl.
Server c omponent identificati on 83 Item Description 5 Slot 2 PCIe 2 x8 (8, 4, 2, 1) 6 Slot 1 PCIe 1 x8 (8, 4, 2, 1) D IMM slot locations • Primary processor memo ry board.
Server component identification 84 • Secondary processor memory board D evice numbers.
Server component identification 85 S AS hard drive LEDs Item Description 1 Fault/UID LED (amber/blue) 2 Online LED (green) S AS hard drive LED com binations Online/activity LED (g reen) Fault/UID LED .
Server component identification 86 Online/activity LED (g reen) Fault/UID LED (amber/blue) Interpretat ion Flashing irregularly Off The drive is act ive, and it is op erating normally . Off Steadily amber A critical fault c ondition has be en identified for this drive, and the controller h as placed it offlin e.
Server component identification 87 LED3 pattern LED4 pat tern Interpretation — One blink every two seconds The system is power ed down, and the c ache contains data that has not yet been written to the drives. Restor e system power as soon as p ossible to prevent data loss.
Server component identification 88 FBWC module LEDs The FBWC module has tw o single - color LEDs (green and amber). T he LEDs are duplic ated on the reverse side of the cache mod ule to facilitate status viewin g. Green LED Amber LED Interpret ation Off On A backup is in progress.
Server component identification 89 F an locations P ower su pply backplan e components.
Server component identification 90 Item Description 1 Graphics card p ower connector 2 Graphics card p ower connector 3 Graphics card p ower con nector 4 SAS backplane power conn ector 5 Fan power con.
Specifications 91 S pec if icati ons E nvironmental spec ifications Specification Value Temperature range* Operating 10 ° C to 35 ° C (50 ° F to 95 ° F) Shipping - 40 ° C to 70 ° C ( - 40 ° F to 158 ° F) Maximum wet bulb temperature 28 ° C (82.
Specifications 92 Specification Value Power supply output 910 W (low line) 1300 W (hig h line).
Acronyms and abbreviation s 93 A c r on y ms and abbr e v iati on s AMP Advanced Memory Protec tion BBWC battery - backed write c ache FBWC flash - backed write cache iLO 3 Integrate d Lights - Out 3 .
Acronyms and abbreviation s 94 SAS serial attached SCSI SD Secure Digital SIM Systems In sight Manager SPI system perip heral interfa ce TPM trusted platform modul e UID unit identification USB univer.
Index 95 1 10 Gb NIC adapter blank 76 10Gb NIC connect or 81 A access panel 16, 28 additional infor mation 70 AMP status LED 75 B badge, product name 16 baffles 16 battery 20, 65, 81 battery pack LEDs.
Index 96 extending ser ver from rack 27 F fan data connector 81 fan LE D 75 fan louver 16, 54 fan module location s 89 fans 20, 53, 89 FBWC cabling 20, 64 FBWC module 20, 88 FBWC module LEDs 88 featur.
Index 97 plastics kit 16 power button 74 power button cable con nector 79 power button/U ID connector 79 power cap 75 power cap L E D 75 power LED 74 power LEDs, system 86 Power On/Standby button 74 p.
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