Instruction/ maintenance manual of the product 419195-002 HP (Hewlett-Packard)
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HP Pr oL iant DL3 20 Gener ation 5 S er v er Maint enance and Se r v i ce Gui de Part Number 419195-002 November 2007 (Second Edition).
© Copyright 2006, 2007 Hewlett-Packard Develop ment Company, L.P. The information contained herein is subject to chan ge without no tice. The only warranties for HP products and services ar e set forth in the express warranty statements accompanying such produc ts and services.
Contents 3 Con t en t s Customer se lf re pair ...................................................................................................................... 5 Parts only warr anty service ......................................................
Contents 4 Server cabl e routing ........................................................................................................... ..................... 58 Embedded SATA contro ller cable routing .............................................
Customer self repair 5 C ust omer se lf r epair HP products are designed with many Customer Self Repair (CSR) parts to minimi ze repair time and allow for greater flexibility in performing def ective parts re placement.
Customer self repair 6 • Obligatoire - Pièces pour lesquelles la réparation par le client est obligatoire. Si vous demandez à HP de remplacer ces pièces, les coûts de déplac ement et main d'œuvre du service vous seront facturés. • Facultatif - Pièces pour lesquelles la réparation par le client est facultative.
Customer self repair 7 NOTA: alcuni componenti HP non sono progettati per la ri parazione da parte del cl iente. Pe r rispettare la garanzia, HP richiede che queste parti siano sostituite da un c entro di assistenza autorizzato. Tali parti sono identificate da un "No" nel Ca talogo illustrato dei componenti.
Customer self repair 8 anrufen und sich von einem Mitarbeiter per Telefon helfen lassen. Den Materiali en, die mit einem CSR- Ersatzteil geliefert werden, könn en Sie entnehmen, ob das defekte Teil an HP zurückgeschickt werden muss.
Customer self repair 9 Centro de asistencia técnica de HP y reci birá ayu da telefónica por parte de un técnico. Con el envío de materiales para la sustitución de componente s CSR, HP especificará si los comp onentes defectuosos deberán devolverse a HP.
Customer self repair 10 periode, gewoonlijk vijf (5) werkdagen, retourne ren aan HP. Het defecte onderdeel moet met de bijbehorende documentatie worden geretourneerd in het meeg eleverde verpakkingsmateriaal. Als u het defecte onderdeel niet t erugzendt, kan HP u voor het vervangende onderdeel kosten in rekeni ng brengen.
Customer self repair 11 Para obter mais informações sobre o programa de re paro feito pelo cliente da HP, entre em contato com o fornecedor de serviços local. Para o prog rama norte-americano, visite o site da HP ( http://www.hp.com/go/selfrepair ).
Customer self repair 12.
Customer self repair 13.
Customer self repair 14.
Customer self repair 15.
Illustrated parts catalog 16 Illus tr ated par ts catalog Mechanical components Item Description Spare part number Customer self repair (on page 5 ) 1 Access panel 432934-001 Mandatory 1 2 Front bezel 43293 5-001 Mandatory 1 3 Hard drive blank 413960-001 Mandatory 1 1 Mandatory—Parts for which customer self repair is mandatory.
Illustrated parts catalog 17 1 Mandatory: Obbligatorie—Parti che devono essere necessariam ente riparate dal cliente. Se il cliente ne affida la riparazione ad HP, deve sostenere le spese di spedi zione e di manodopera per il servizio. 2 Optional: Opzionali—Parti la cui riparazione da parte d el cl iente è facoltativa.
Illustrated parts catalog 18.
Illustrated parts catalog 19 System components Item Description Spare part number Customer self repair (on page 5 ) System components 4 Fan assembly 432933-001 Optional 2 5 Power supply, 420-W 432932-.
Illustrated parts catalog 20 Item Description Spare part number Customer self repair (on page 5 ) f) 3.4-GHz Intel® Pentium® 4 651 p rocessor, 2- MB cache, 800-MHz FSB* 418787-001 Optiona l 2 10 Hea.
Illustrated parts catalog 21 Item Description Spare part number Customer self repair (on page 5 ) 25 Optical drive ca ble* 433137-001 Optional 2 26 Diskette drive cable* 433138-001 Optional 2 27 USB c.
Illustrated parts catalog 22 3 No: No—Algunos componentes no están diseñados para que puedan ser repa rados por el usuario. Para que el usuario haga valer su garantía, HP pone como condición que un proveed or de servicios autorizado realice la sustitución de estos componentes.
Removal and replacement procedures 23 R emo v al and r eplacement pr ocedur e s Required tools You need the following item s for some procedures: • T-10/T-15 Torx screwdriver (included with the serv.
Removal and replacement procedures 24 This symbol on an RJ-45 receptacle indicates a network interface connection. WARNING: To reduce the risk of electric sh ock, fire, or damage to the equipment, do not plug telephone or telecommunicat ions connectors into this receptacle.
Removal and replacement procedures 25 Server warnings and cautions Before installing a server, be sure that you understand the following warnings and cautions. WARNING: To reduce the risk of electr ic shock or damage to the equipment: • Do not disable the power cord grounding plug.
Removal and replacement procedures 26 2. Disconnect all peripheral cables and po wer cords from the server rear panel. 3. Loosen the thumbscrews that secure the se rver faceplate to the front of the rack. 4. Extend the server on the rack rails unti l the server rail-releas e latches engage.
Removal and replacement procedures 27 6. Disengage the serv er from the rack. For more inform ation, refer to the documentation that ships with the rack mounting option.
Removal and replacement procedures 28 To replace the component, reverse the r emoval procedure. When adding hard drives to the server, ob serve the following general guidelines: • The system automatically sets all drive numbers. • If only one hard drive is used, install it in the bay with the lowest drive number.
Removal and replacement procedures 29 2. Extend the server from the rack (on page 25 ). 3. Remove the access panel (" Access panel " on page 27 ). 4. Disconnect all cables connected to the SAS/SATA backplane. 5. Remove all hard drives (" Hard drives " on page 27 ).
Removal and replacement procedures 30 3. Remove the access panel (" Access panel " on page 27 ). 4. Remove the air baffle. To replace the component, reverse the r emoval procedure. Fan assembly To remove the component: 1. Power down the server (on page 26 ).
Removal and replacement procedures 31 BBWC battery holder To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (on page 25 ). 3. Remove the access panel (" Access panel " on page 27 ). 4. Remove the air baffle (" Air baffle " on page 29 ).
Removal and replacement procedures 32 8. Remove the BBWC holder and battery. To replace the component, reverse the r emoval procedure. Media cage To remove the component: CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 33 9. Remove the media cage. To replace the component, reverse the r emoval procedure. Optical drive To remove the component: CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 34 10. Remove the optical drive. To replace the component, reverse the r emoval procedure. Diskette drive To remove the component: CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 35 10. Remove the diskette drive. To replace the component, reverse the r emoval procedure. Front video connector To remove the component: CAUTION: To prevent improper cooling and therma l damage, do not operate the server unless all bays are populated with either a component or a blank.
Removal and replacement procedures 36 10. Remove the front video connector. To replace the component, reverse the r emoval procedure. Power button/LED board To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (on page 25 ).
Removal and replacement procedures 37 8. Disconnect the power button/LED board cable. 9. Remove the media cage (" Media cage " on page 32 ). 10. Remove the power button/LED board. To replace the component, reverse the r emoval procedure. Front bezel 1.
Removal and replacement procedures 38 3. Remove the serial label pull tab by extending it out, and then pressing on the underside to release it from the chassis. 4. Remove the access panel (" Access panel " on page 27 ). 5. Remove all hard drives (" Hard drives " on page 27 ).
Removal and replacement procedures 39 PCI riser board assembly To remove the component: CAUTION: To prevent damage to the server or ex pansion boards, power down the server and remove all AC power cords before removing or installing the PCI riser board assembly.
Removal and replacement procedures 40 5. Remove any installed expansion boards. To replace the component, reverse the r emoval procedure. Storage controller To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (on page 25 ).
Removal and replacement procedures 41 6. Remove the storage controll er. To replace the component, reverse the r emoval procedure. PCI Express or PCI-X riser board To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (on page 25 ).
Removal and replacement procedures 42 DIMMs To remove the component: 1. Power down the server (on page 26 ). 2. Extend the server from the rack (on page 25 ). 3. Remove the access panel (" Access panel " on page 27 ). 4. Open the DIMM slot latches.
Removal and replacement procedures 43 The following table lists som e, but not all, possible configurations. Fo r best performance, HP recommends dual-bank interleaved mode configur ations.
Removal and replacement procedures 44 8. Remove the power supply. To replace the component, reverse the r emoval procedure. Heatsink To remove the component: WARNING: To reduce the risk of personal injury from hot surfaces, allow the drives and the internal system components to cool before touching them.
Removal and replacement procedures 45 6. Remove the heats ink. To replace the component: IMPORTANT: When replacing the heatsink, check the l abel on top to be sure the heatsink is properly oriented. 1. Use the alcohol swab to remove all the existing th ermal grease from the processor.
Removal and replacement procedures 46 CAUTION: Heatsink retaining screws should be tigh tened or loosened in diagonally opposite pairs (in an "X" pattern). Do not overtighten the screws as this can damage the board, connectors, or screws. Us e the wrench supplied wi th the system to reduce the possibility of overtightening the screws.
Removal and replacement procedures 47 6. Open the processor retaining latch and the processor socket retaining bracket. 7. Using your fingers, remove the failed processor. To replace the component: IMPORTANT: Be sure the processor remains ins ide the processor installation tool.
Removal and replacement procedures 48 1. If the processor has separated from the installation tool, carefully re-insert th e proces sor in the tool. 2. Align the processor installation tool with the socket and install the sp are processor. CAUTION: The processor is design ed to fit one way into the socket.
Removal and replacement procedures 49 3. Press down firmly until the processor in stallation tool clicks and separates from the processor, and then remove the processor installation tool. 4. Close the processor retaining latch and th e processor socket retaini ng bracket.
Removal and replacement procedures 50 6. Apply all the grease to the top of the processor in one of the foll owing patterns to ensure even distribution: CAUTION: Heatsink retaining screws should be tigh tened or loosened in diagonally opposite pairs (in an "X" pattern).
Removal and replacement procedures 51 2. Remove the server from the rack (on pag e 26 ). 3. Remove the access panel (" Access panel " on page 27 ). 4. Remove the PCI riser board assembly (" PCI riser board assembly " on page 39 ). 5.
Removal and replacement procedures 52 13. Using your fingers, remove the processor from the failed system board. CAUTION: To avoid damage to the system board: • Do not touch the processor socket contacts. • Always install the processor socket cover after removing the process or from the socket.
Removal and replacement procedures 53 2. Prepare the processor socket on the spare syst em board: a. Open the processor retaining latch and the processor socket retaining bracket. b. Remove the processor socket protective cover. 3. Install the processor socket cover onto the pr ocessor socket of the f ailed system board.
Removal and replacement procedures 54 5. Close the processor retaining latch and th e processor socket retaini ng bracket. 6. Clean the old thermal grease fr om the heatsink an d the top of the processor with the alcohol swab. Allow the alcohol to evapo rate before continuing.
Removal and replacement procedures 55 7. Apply all the grease to the top of the processor in one of the foll owing patterns to ensure even distribution: CAUTION: Heatsink retaining screws should be tigh tened or loosened in diagonally opposite pairs (in an "X" pattern).
Removal and replacement procedures 56 10. Install the access panel. 11. Power up the server. After you replace the system board, you must re-ent er the server serial number and the product ID. 1. During the server startup se quence, press the F9 key to access RBSU.
Removal and replacement procedures 57 5. Remove the battery. IMPORTANT: Replacing the system board battery resets the system ROM to its default configuration. After replacing the battery , reconfigure t he system through RBSU. To replace the component, reverse the r emoval procedure.
Cabling 58 C abling Server cable routing CAUTION: When routing cables, always be sure th at the cables are not in a position where they can be pinched or air flow can be blocked. IMPORTANT: Route the cables without b locking the airflow or other installed com ponents.
Cabling 59 Optional SAS/SATA controller cable routing CAUTION: When routing cables, always be sure th at the cables are not in a position where they can be pinched or air flow can be blocked.
Cabling 60 Slot 1 Video connector option cable routing.
Cabling 61 Battery-backed write cache cable routing.
Diagnostic tools 62 Diagno s ti c tools Troubleshooting resources The HP ProLiant Servers Troubleshoot ing Guide provides simple proced ures for resolving common problems as well as a comprehensive course of action for fault isolation and identification, erro r message interpretation, issue resolution , and software maintenance.
Diagnostic tools 63 NOTE: The current version of SmartStart prov ides the memory spare part numbers for the server. To download the latest version, see the HP w ebsite ( http://www.hp.com/support ). Integrated Management Log The IML records hundreds of events and stores th em in an easy-to-view form.
Component identification 64 C ompone nt i dentif icati on Front panel components Item Description 1 Serial label pull tab 2 Hard drive bay 1 3 Hard drive bay 2 4 Diskette drive/video connect or bay 5 .
Component identification 65 Front panel LEDs and buttons Item Description Status 1 UID button/LED Blue = Identification is activated. Flashing blue = System is being remotely managed. Off = Identification is deactivated. 2 Internal health LED Green = System health is normal.
Component identification 66 Item Description Status 6 Power On/Standby button and system power LED Green = System is on. Amber = System is shut down, but power is still applied.
Component identification 67 Slot Type Length Co nnector Interconnect 2 PCI Express Full x8 x8 Optional PCI- X Full 133 MHz/3.3 V 64 bit Rear panel LEDs Item Description Status 1 iLO 2 activity Green = Activity exists. Flashing green = Activity exists.
Component identification 68 System board components Item Description Item Description 1 PCI Express x8 connector or optional PCI-X 133- MHz connector 13 Diskette drive connector 2 PCI Express x1 conne.
Component identification 69 Position Default Function S4 Off Off = Normal op eration On = Override RBSU setting and enable diskette boot * S5 Off Off = Power-on password enabled On = Power-on password.
Component identification 70 System board LEDs Item LED description Status 1 Reserved — 2 Overtemperature Amber = System has reached a cautionary or critical temperature level. Off = Temperature is OK. 3 Fan 1 and 2 Amber = One or more fans in this module have failed.
Component identification 71 Item LED description Status 10 DIMM 3 Amber = DIMM has failed. Off = DIMM is operating normally. 11 DIMM 2 Amber = DIMM has failed. Off = DIMM is operating normally. 12 DIMM 1 Amber = DIMM has failed. Off = DIMM is operating normally.
Component identification 72 System LED and Color Internal Health LED Color Status Fan module (amber) Amber A redundant fan has failed. Fan module (red) Red The minimum fan requirements are not being met in one or more of the fan modules. One or more fans h ave failed or are missing.
Component identification 73 Item Description 1 Device 1 2 Device 2 Fan assembly location.
Specifications 74 Sp e c i fica t io n s Environmental specifications Specification Value Temperature Operating 1 10 ° C to 35 ° C (50 ° F to 90 ° F) Non-operating 30 ° C to 60 ° C (-22 ° F to .
Specifications 75 Specification Value Width 42.62 cm (16.78 i n) Weight (maximum) 12.27 kg (27.0 lb) Weight (no drives installed) 10.91 kg (24.0 lb) Input requirement Rated line voltage 90 VAC to 264 VAC Rated input frequency 47 Hz to 63 Hz Rated input current 6.
Acronyms and abbreviations 76 A c r on y ms and abbr e v iati ons ACU Array Configuration Utility ADU Array Diagnostics Utility BBWC battery-backed write cache BIOS Basic Input/Output System CMOS comp.
Acronyms and abbreviations 77 NVRAM non-volatile memory PCI peripheral component interface PCI-X peripheral component interconnect ext ended PCIe peripheral component interconnect express POST Power-O.
Index 78 A access panel 16 ADU (Array Diagnostic Utility) 63 air baffle 29 Array Diagnostic Utility (ADU) 63 B battery 19, 56, 68, 69 battery-backed write cache battery holder 31 battery-backed write .
Index 79 Integrated Management Log (IML) 63 interleaving memory configuration 43 internal health LED 65, 71 internal USB connector 72 L LED, DIMM slot 70 LED, drive activity 65 LED, fan 70 LED, iLO NI.
Index 80 U UID LED 26, 65, 69 USB connectors 64, 68, 72 utilities 62 V video connector 35, 64, 68 W warnings 25 warranty 5, 16.
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