Instruction/ maintenance manual of the product CY7C1316CV18 Cypress Semiconductor
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18-Mbit DDR-II SRAM 2-W ord Burst Architecture CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Cypress Semiconductor Corpora tion • 198 Champion Court • San Jose , CA 95134-1709 • 408-943-2600 Document Number: 001-07160 Rev .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 2 of 29 Logic Block Diagram (CY7C1316CV18) Logic Block Diagram (CY7C1916CV18) Wri te Reg Wri te Reg CLK A (19:0) Gen. K K Control Logic Address Register Read Add.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 3 of 29 Logic Block Diagram (CY7C1318CV18) Logic Block Diagram (CY7C1320CV18) Wri te Reg Write Reg CLK A (19:0) Gen. K K Control Logic Address Register Read Add.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 4 of 29 Pin Configuration The pin configuration for CY7C1316CV18, CY7C191 6CV18, CY7C1318CV18, and CY7C1320CV18 follo w .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 5 of 29 CY7C1318CV18 (1M x 18) 123456789 10 11 A CQ NC/72M A R/W BWS 1 K NC/14 4M LD A NC/36M CQ B NC DQ9.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 6 of 29 Pin Definitions Pin Name IO Pin Descripti on DQ [x:0] Input Output- Synchronous Dat a Input Output S ignals . Inputs are sampled on the rising edge of K and K clocks during valid write operations.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 7 of 29 CQ Output Clock CQ Referenced with Respect to C . This is a free running clock and is synchronized to the input clock for output data (C) of the DDR-II.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 8 of 29 Functional Overview The CY7C1316CV18, CY7C1916CV18, CY7C1 318CV18, and CY7C1320CV18 are synchronous pi pelined Burst SRAMs equipped with a DDR interface, which operates with a read latency of one and half cycles when DOFF pin is tied HIGH.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 9 of 29 driver impedance. The value of RQ must be 5x the value of th e intended line impedance d riven by the SRAM. The allo wable range of RQ to guarantee impe dance matching with a to lerance of ±15% is between 175 Ω an d 350 Ω , with V DD Q =1 .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 10 of 29 T ruth T able The truth table for the CY7C1316CV18, CY7C1916 CV18, CY7C13 18CV18, and CY7C1320CV18 fo llows.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 1 1 of 29 Write Cycle Descriptions The write cycle description t able for CY7C1 916CV18 follows. [2, 8] BWS 0 K K Comments L L–H – During the data portion of a write sequence, th e single byte (D [8:0] ) is written into the device.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 12 of 29 IEEE 1 149.1 Serial Boundary Scan (JT AG) These SRAMs incorporate a serial boundary scan T est Access Port (T AP) in the FBGA p ackage. This part is fully comp liant with IEEE S tandard #1 149.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 13 of 29 IDCODE The IDCODE instruction loads a vendor-specific, 32-bi t code into the instruction re gister .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 14 of 29 T AP Controller St ate Diag ram The state diagram for the T AP controller follows.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 15 of 29 T AP Controller Block Diagram T AP Electrical Characteristics Over the Operating Range [10, 1 1, 12] Parameter Description T est Conditions Min Max Unit V OH1 Output HIGH V oltage I OH = − 2.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 16 of 29 T AP AC Switching Characteristics Over the Operating Range [13, 14] Parameter Description Min Ma.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 17 of 29 Identification R egi ster Definitions Instruction Field Va l u e Descriptio n CY7C1316CV18 CY7C1916CV18 CY7 C1318CV18 CY7C1320CV18 Revision Numb er (31:29) 000 000 000 000 V ersion numbe r .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 18 of 29 Boundary Scan Order Bit # Bump ID Bit # Bump ID Bit # Bump ID Bit # Bum p ID 0 6R 28 10G 56 6A 8.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 19 of 29 Power Up Sequence in DDR-II SRAM DDR-II SRAMs must be power ed up and initialized in a predefined manner to prevent unde fined operations. Power Up Sequence ■ Apply power and drive DO FF either HIGH or LOW (all other inputs can be HIGH or LOW).
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 20 of 29 Maximum Ratings Exceeding maximum ratin gs may impair the useful life o f the device. These user guidelines are not teste d. S torage T emperature .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 21 of 29 I SB1 Automatic Power Down Current Max V DD , Both Ports Deselected, V IN ≥ V IH or V IN ≤ V.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 22 of 29 Cap acit ance T ested initially and after any design or process change that may affect these parameters. Parameter Description T est Conditions Max Unit C IN Input Capacitance T A = 25 ° C, f = 1 MHz, V DD = 1.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 23 of 29 Switching Characteristics Over the Operating Range [20, 21] Cypress Parameter Consor tium Parame.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 24 of 29 Output T imes t CO t CHQV C/C Clock Rise (or K/K in single clock mode) to Data V alid – 0.45 – 0.45 – 0.45 – 0.50 ns t DOH t CHQX Data Output Hold af ter Output C/C Clock Rise (Active to Active) –0.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 25 of 29 Switching W aveforms Figure 5. Read/Write/Deselect Sequence [2 7, 28, 29 ] READ READ READ NOP NO.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 26 of 29 Ordering Information Not all of the speed, package and temperature ranges are ava ilable. Please contact your local sales representative or visit www .
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 27 of 29 200 CY7C1316CV18-200BZC 51-85180 165-Ball Fine Pi tch Ball Grid Array (13 x 15 x 1.4 mm) Commercial CY7C1916CV18-200BZC CY7C1318CV18-200BZC CY7C1320CV18-200BZC CY7C1316CV18-200BZXC 5 1-85180 165-Ball Fine Pitch Ball Grid Array (13 x 15 x 1.
CY7C1316CV18, CY7C1916CV18 CY7C1318CV18, CY7C1320CV18 Document Number: 001-07160 Rev . *E Page 28 of 29 Package Diagram Figure 6. 165-Ball FBGA (13 x 15 x 1.4 mm), 51-85180 A 1 PIN 1 CORNER 15.00±0.10 13.00±0.10 7.00 1.00 Ø0.50 (165X) Ø 0 . 2 5MCAB Ø0.
Document Number: 001-07160 Rev . *E Revised June 18, 2008 Page 29 of 29 QDR RAMs an d Quad Data Rate RAMs comp rise a new family of product s develope d by Cypress, IDT , NEC, Renesas, and Samsung. All pr oduct and co mpany nam es mentioned i n this documen t are the tr ad emarks of their respe ctive hold ers.
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