Instruction/ maintenance manual of the product CY7C1381FV25 Cypress
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18-Mbit (512K x 36/1M x 18) Flow-Through SRAM CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Cypress Semiconductor Corpora tion • 198 Champion Cou rt • San Jose , CA 95134-1 709 • 408-943-2 600 Document #: 38-05547 Rev . *E Revised Feburary 14, 2007 Features • Supports 133 MHz bus operations • 512K x 36/1M x 18 co mmon IO • 2.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 2 of 28 Logic Block Diagram – CY7C1381DV25 /CY7C1381FV25 [3 ] (512K x 36) Logic Block Diagram – CY7C1383DV2.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 3 of 28 Pin Configurations A A A A A 1 A 0 NC NC V SS V DD A A A A A A A A DQP B DQ B DQ B V DDQ V SSQ DQ B DQ .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 4 of 28 Pin Configurations (continued) 234 5 6 7 1 A B C D E F G H J K L M N P R T U V DDQ NC/288M NC/144M DQP .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 5 of 28 Pin Configurations (continued) 165-Ball FBGA Pinout (3 Chip Enable) CY7C1381DV25 (512 K x 36) 234 567 1.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 6 of 28 Pin Definitions Name IO Description A 0 , A 1 , A Input- Synchronous Address inputs used to select one of the address locations . Sampled at the rising edge of the CLK if ADSP or ADSC is active LOW , and CE 1 , CE 2 , and CE 3 [2] are sampled active.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 7 of 28 Functional Overview All synchronous inpu ts pass through input registers controlled by the rising edge of the clock. Maximum a ccess delay from the clock rise (t CDV ) is 6.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 8 of 28 and the IOs must be tri-stated prior to the presentation of data to DQs. As a safety precauti on, the data lines are tri-stated once a write cycle is detected, regardless of the st ate of OE .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 9 of 28 T ruth T able [4, 5, 6, 7, 8] Cycle Description Address Used CE 1 CE 2 CE 3 ZZ ADSP ADSC ADV WRITE OE C.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 10 of 28 T ruth T able for Read/Write [4, 9] Function (CY7C1381DV25 /CY7C1381FV25) GW BWE BW D BW C BW B BW A R.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 1 1 of 28 IEEE 1 149.1 Serial Boundary Scan (JT AG) The CY7C1381DV25/C Y7C1383DV25 incorporate s a serial boundary scan test access port (T AP). This part is fully compliant with 1 14 9.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 12 of 28 When the T AP controller is in the Capture -IR state, the two least significant bits are loaded with a binary ‘01’ pattern to allow for fault isolati on of the board level serial test data path.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 13 of 28 the T AP co ntroller , it will direct ly control the state of the output (Q-bus) pins, when the EXTEST is entered as the current instruction. When HIGH, it will en able the output buffers to drive the output bus.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 14 of 28 2.5V T AP AC T est Conditions Input pulse levels ........................ .............. ...........V SS to 2.5V Input rise and fall time .............. .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 15 of 28 Identification Codes Instruction Code Description EXTEST 0 00 Captures IO ring contents. Places th e boundary scan register between TDI and TDO. Forces all SRAM outputs to High-Z state.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 16 of 28 165-Ball BGA Boundary Scan Order [13, 15] Bit # Ball ID Bit # Ball ID Bit # Ball ID 1 N6 31 D10 61 G1 .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 17 of 28 Maximum Ratings Exceeding the maximum ratings may impair the useful life of the device. For user guideline s, not tested. S torage T emperature .........
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 18 of 28 Cap acit ance [18] Parameter Description T est Conditio ns 100 TQFP Package 1 19 BGA Package 165 FBGA Package Unit C IN Input Capa citance T A = 25°C, f = 1 MHz, V DD /V DDQ = 2.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 19 of 28 Switching Characteristics Over the Operating Range [19, 20] Parameter Descriptio n 133 MHz 100 MHz Unit Min. Max. Min. Max. t POWER V DD (T ypical) to the first Access [21] 11 m s Clock t CYC Clock Cycle T ime 7.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 20 of 28 Ti ming Diagrams Read Cycle Timing [25] t CYC t CL CLK t ADH t ADS ADDRESS t CH t AH t AS A1 t CEH t C.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 21 of 28 Write Cycle T iming [25, 26] Ti ming Diagrams (continued) t CYC t CL CLK t ADH t ADS ADDRESS t CH t AH.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 22 of 28 Read/Write Cycle Timing [25, 27, 28] Ti ming Diagrams (continued) t CYC t CL CLK t ADH t ADS ADDRESS t.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 23 of 28 ZZ Mode T iming [29, 30] Ti ming Diagrams (continued) t ZZ I SUPPLY CLK ZZ t ZZREC ALL INPUTS (except ZZ) DON’T CARE I DDZZ t ZZI t RZZI Outputs (Q) High-Z DESELECT or READ Only Notes 29.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 24 of 28 Ordering Information Not all of the speed, package, and temperature rang es are availabl e. Please contact your local sales representa tive or visit www .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 25 of 28 Package Diagrams Figure 1. 100-Pin Thin Plastic Quad Flat pack (14 x 20 x 1.4 mm) (51-85050) NOTE: 1. JEDEC STD REF MS-026 2. BODY LENGTH DIMENSION DOES NOT INCLUDE MOLD PROTRUSION/END FLASH MOLD PROTRUSION/END FLASH SHALL NOT EXCEED 0.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 26 of 28 Figure 2. 1 19-Ball BGA ( 14 x 22 x 2.4 mm) (51-851 15) Package Diagrams (continued) 51-851 15-*B [+] .
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 27 of 28 © Cypress Semicon ductor Corpor ation, 2006- 2007. The inform ation cont ained herein is subject to change wi thout notic e.
CY7C1381DV25, CY7C1381FV25 CY7C1383DV25, CY7C1383FV25 Document #: 38-05547 Rev . *E Page 28 of 28 Document History Page Document Title: CY7C1381DV25/CY7C1383DV25/CY7C13 81FV25/CY7C1 383FV25, 18-Mb it (512K x 36/1M x 18) Flow-Through SRAM Document Number: 38-05547 REV .
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